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Title:
IEEE Central Coast Event 22 April @ 6 PM - "ESD Protection of Electronics"- Dan Bezzant
Date:
April 22nd
6:00 PM (2.5 hours)
Location:
Rusty's
Goleta, CA
Abstract:

In-Person Location - Rusty’s Pizza ­­ 5934 Calle Real, Goleta, CA 93117 

or Optional Virtual Webex Attendance   

6:00 PM – Complimentary Pizza, Salad, Beverage­

6:30 PM – Central Coast Status

6:35 PM – Dan Bezzant Presents. 

Please join us on April 22nd when Dan Bezzant, Recently retired EE Section Manager at RTX (Raytheon}, will give a talk on how static charge can build up in semiconductor devices resulting in Electrostatic Discharge (ESD) causing catastrophic damage and how to protect against ESD events. Guests are welcome. Please Register Now below. Note Attendance Type: In-Person or Virtual. Best regards, Ruth Franklin IEEE Central Coast Chair

Title:
Del Mar Electronics and Manufacturing Show 2026 - Thursday April 23
Date:
April 23rd
10:00 AM (5 hours)
Location:
Del Mar Fair Grounds
Del Mar, CA
Abstract:

The annual Del Mar Electronics and Manufacturing Show will be held at the Del Mar Fair and Exposition Center. 

The IEEE Consultants' Network of San Diego and the San Diego IEEE Section will both be hosting booths.   The IEEE booths are 1031 and 1130 (co-located) in the Seaside Pavilion.

 

San Diego IEEE Societies and Groups participating:  

  • San Diego Section
  • IEEE Consultants' Network of San Diego
  • San Diego IEEE Women in Engineering
  • IEEE San Diego Open Source Digital Radio Group
  • IEEE Oceanic Engineering Society - San Diego Chapter
  • IEEE Computer Society - San Diego Chapter
  • IEEE Signal Processing Society - San Diego Chapter

 

 

 

Title:
SSCS DL Presentation - Fractional-N Phase-Locked Loops Using Harmonic-Mixer-Based Feedback and Noise Cancellation
Date:
April 23rd
11:00 AM (1 hour)
Location:
Electrical and Computer Engineering Building
Seattle, WA
Abstract:

Title: Fractional-N Phase-Locked Loops Using Harmonic-Mixer-Based Feedback and Noise Cancellation

Abstract: Frequency synthesizers are an integral part of various applications, such as wireless and wireline communication systems. The generation of frequency sources with low phase noise under limited power, area, and many other factors has been an ongoing challenge over the years. Especially for the fractional-N phase-locked loops (PLLs), the suppression of quantization noise (Q-noise) and spurs has been one of the main challenges. Architectures based on quantization error cancellation, either in the time domain using digital-to-time converters or in the voltage domain using digital-to-analog converters, have been popular in recent years. However, the circuits used for the cancellation are often affected by PVT-related gain errors and non-linearity, requiring intensive digital calibration to prevent severe performance degradation. In this talk, we introduce some harmonic-mixer-based fractional-N PLL architectures that avoid the amplification of the Q-noise by the loop. With this concept, we can effectively suppress the contribution of the Q-noise at the PLL output without applying intensive calibration.

Tetsuya Iizuka received the B.S., M.S., and Ph.D. degrees in electronic engineering from the University of Tokyo, Tokyo, Japan, in 2002, 2004, and 2007, respectively. From 2007 to 2009, he was with THine Electronics Inc., Tokyo, as a High-Speed Serial Interface Circuit Engineer. He joined the University of Tokyo in 2009, where he is currently a Professor with the Department of Electrical Engineering and Information Systems, School of Engineering. From 2013 to 2015, he was a Visiting Scholar with the University of California at Los Angeles, Los Angeles, CA, USA. His current research interests include data conversion techniques, high-speed analog integrated circuits, digitally assisted analog circuits, and VLSI computer-aided design.

He was a TPC member of ISSCC from 2013 to 2017 and CICC from 2014 to 2019. He is also serving as a member of the IEEE Asian Solid-State Circuits Conference (A-SSCC) and the IEEE VLSI Symposium on Circuits Technical Program Committees. Since 2025, he has been serving as a distinguished lecturer of the IEEE SSCS.

Title:
Diamond Semiconductor Device Design & Fabrication
Date:
April 23rd
11:30 AM (1.7 hours)
Location:
==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road
Sunnyvale, California, CA
Abstract:
Diamond Semiconductor Device Design & Fabrication

Abstract: 

Diamond Quanta: making diamond as available as siliconLaser Annealing for Electronic-Quality Diamond

 

Abstract:Diamond’s extreme thermal conductivity, wide bandgap, high breakdown field, stiffness, and radiation hardness make it a compelling platform for power microelectronics, photonics, and quantum technologies. But its performance is often limited by defects that scatter carriers, perturb color-center environments, and degrade quantum coherence. Conventional polishing and growth processes typically create defects near the surface, where they will have the greatest impact on electronic and optical performance. For many applications, a key challenge is to convert commercially available diamond plates into device-ready surfaces over large areas.

In collaboration with Lawrence Livermore Lab, Diamond Quanta is developing sub-melt nanosecond Pulsed‑Laser Annealing (PLA) - a controllable, scalable means to reconfigure carbon bonding and relieve near‑surface strain without melting. This method produces low-defect, device-ready surfaces from industrial-grade diamond, with applications in high-power electronics, photonics, and quantum-grade substrates and wafers.

Read More:
Reducing dislocation defect levels via sub-melt nanosecond pulsed-laser induced densification of diamond
Advanced co-doping techniques for enhanced charge transport in diamond-based materialsSpeaker:Adam KhanFounder & CEODiamond Quanta

 

AGENDA:

Thursday April 23, 2026

11:30 AM: Networking, Pizza & Drinks

Noon -- 1 pm: Seminar

Please register on Eventbrite before 9:30 AM on Thursday April 23, 2026

IEEE members  non IEEE members

(discounts for unemployed and students )

Title:
Semiconductor Super Lattices
Date:
April 23rd
12:00 PM (1 hour)
Abstract:

A superlattice can be formed by alternating thin layers of different semiconductor materials. The result is an artificial semiconductor whose properties differ from those of the constituents. The advantage is that the bandgap energy and the lattice parameter can be varied independently, providing a wide parameter space for bandgap engineering. The presentation will show how the superlattice can grow on available substrates, such as GaSb, and how it functions as a detector of infrared light.

Title:
ICOP Hawaii (O'ahu)
Date:
April 23rd
12:00 PM (2 days)
Location:
Address coming soon
Honolulu, HI
Abstract:

IEEE-USA’s Congressional Outreach Program (ICOP) aims to connect IEEE Young Professionals (YPs) and Student Members with their Members of Congress.

ICOP events provide IEEE members the opportunity to meet directly with congressional staff to discuss critical technology policy issues affecting their communities. These events are a unique opportunity to help shape the future of engineering and technology by promoting innovation and research support at the federal level.

No prior policy or political experience is required. Participants will receive training (virtually) prior to the event.

Once you register, you’ll receive additional details and scheduling information. Because Congressional meetings are subject to change, the final schedule will not be confirmed until the week of the event. For more information, please contact the event hosts.

NOTE: This event is for IEEE members on O'ahu. 

Link to register: https://forms.gle/aPYV5PaD3GZeBAqb7

Learn more here: https://ieeeusa.org/public-policy/icop/

For questions, please contact a.grisham@ieee.org or icop@ieeeusa.org.

Title:
Complexity of the Internet—An AI Observation Science Perspective
Date:
April 23rd
4:00 PM (1.5 hours)
Location:
MIT building 32
Cambridge, MA
Abstract:
Boston Chapter of the IEEE Computer Society and GBC/ACM 7:00 PM, Thursday, 23 April 2026

MIT Room 32-G449 (Kiva) and online via Zoom

Complexity of the Internet—An AI Observation Science PerspectiveJeremy Kepner, MITPlease register in advance for this seminar even if you plan to attend in person at

https://acm-org.zoom.us/webinar/register/6717750000324/WN_Z5KGSMQBSg2dzjM7s_X0mw

After registering, you will receive a confirmation email containing information about joining the webinar.Indicate on the registration form if you plan to attend in person. This will help us determine whether the room is close to reaching capacity. We plan to serve light refreshments (probably pizza) before the talk starting at around 6:30 pm. Letting us know you will come in person will help us determine how much pizza to order.

We may make some auxiliary material such as slides and access to the recording available after the seminar to people who have registered.

Abstract:

What does “normal” look like in a system that grows, adapts, and scales at extraordinary speed? How do its underlying patterns shift as the network expands from its early days to a billion-fold increase in scale?

In this seminar, Dr. Kepner will explore how advances in high-performance, privacy-preserving AI graph analysis tools open new windows into the Internet’s behavior. His work sheds light on emergence, structure, and stability within this constantly changing global system.

Dr. Kepner will explain the deep connections between graphs and matrices and more general mathematical concepts of semirings and associative (token) arrays that are the foundations of modern large language model (LLM) agentic AI systems. These mathematical concepts form the basis of the high performance GraphBLAS sparse matrix standard and the D4M (Dynamic Distributed Dimensional Model) associative array library that can analyze the largest networks in the world while preserving privacy.

Bio:

Dr. Jeremy Kepner is an MIT Lincoln Laboratory Fellow. He founded the Lincoln Laboratory Supercomputing Center and pioneered the establishment of the Massachusetts Green High Performance Computing Center. He has developed novel big data and parallel computing software used by thousands of scientists and engineers worldwide. He has led several embedded computing efforts, which earned him a 2011 R&D 100 Award. Kepner has chaired the SIAM Data Mining conference, the IEEE Big Data conference, and the IEEE High Performance Extreme Computing conference. Kepner is the author of two bestselling books, Parallel MATLAB for Multicore and Multinode Computers, and Graph Algorithms in the Language of Linear Algebra. His peer-reviewed publications include works on abstract algebra, astronomy, astrophysics, cloud computing, cybersecurity, data mining, databases, graph algorithms, health sciences, plasma physics, signal processing, and 3D visualization. In 2014, he received Lincoln Laboratory's Technical Excellence Award. You can learn more about his work here: https://www.mit.edu/~kepner/

Kepner holds a BA degree in astrophysics from Pomona College and a PhD degree in astrophysics from Princeton University. He is a fellow of the Society of Industrial Applied Mathematics (SIAM) and is a faculty advisor to the MIT SIAM student group.

Directions to 32-G449 - MIT Stata Center, 32 Vassar Street, Cambridge, MA: Please use the main entrance to the Stata Center at 32 Vassar Street (the entrance closest to Main street) as those doors will be unlocked. Upon entering, proceed to the elevators which will be on the right after passing a large set of stairs and a MITAC kiosk. Take the elevator to the 4th floor and turn right, following the hall to an open area; 32-G449 will be on the left. Location of Stata on campus map

This joint meeting of the Boston Chapter of the IEEE Computer Society and GBC/ACM will be hybrid (in person and online).

Up-to-date information about this and other talks is available online at https://ewh.ieee.org/r1/boston/computer/. You can sign up to receive updated status information about this talk and informational emails about future talks at https://mailman.mit.edu/mailman/listinfo/ieee-cs, our self-administered mailing list.

Title:
Characterizing 2nd Law Efficiency of AI Datacenters
Date:
April 23rd
5:30 PM (3 hours)
Location:
Zio Fraedo's
Pleasant Hill, CA
Cost:
Admission fee may apply
Abstract:

Datacenter workload fluctuations challenge the design and operation of our critical grid infrastructure. Significant gaps exist in assessment of these fluctuations as to their lifetime and short-term impact on the infrastructure and environment. Some mitigation approaches focus on throttling the datacenter workload, thus impacting the performance. Other approaches include use of alternate generation sources or energy storage systems. While disparate, these approaches are reactive and lack foresight and the intelligence to plan and strategize for optimal power management. We introduce an approach to quantify the transitional entropy generated during datacenter power fluctuations as a metric to evaluate datacenter performance using power demand measurements. A comparative assessment is provided between a BESS optimized datacenter and a regular datacenter to demonstrate the reduction of irreversibilities due to power fluctuations. Workloads are used to characterize the datacenter power demand at the point of interaction with utility. This approach can be scaled from datacenters to servers to chips.

Title:
SCV WIE April 2026 ExCom Meeting
Date:
April 23rd
6:00 PM (1 hour)
Abstract:

Shalini Lakshmana is inviting you to a scheduled Zoom meeting.

Topic: SCV WIE Mar ExCom Meeting
Time: Mar 26, 2026 06:00 PM Pacific Time (US and Canada)
        Every month on the 26 of the month, 36 occurrence(s)

Monthly: https://zoom.us/meeting/tJArfumopzkpHtaky1j5fYpqwMUeY7hSmBWs/ics?icsToken=DLAvxr8efHNhT92mFgAALAAAAICuIz08PSYY6dBYKGdyAmG9V8apUVN2a4qZ15xYs4WT3mV-sSkt5z2I4R9S5HnEoBhV7EWs81CyNNkybzAwMDAwMQ&meetingMasterEventId=GF3_gS3WTzuUZDIP3DGSlw 

Join Zoom Meeting
https://zoom.us/j/94690092342?pwd=7PGwqJDSorXhy8TcYD9alL0bucCPEc.1 

Meeting ID: 946 9009 2342
Passcode: 9yPaX9

 

Title:
IEEE EDS Webinar: Robustness and Reliability of Wide Bandgap Power Semiconductors
Date:
April 24th
11:45 AM (1.5 hours)
Abstract:
Overview 

Webinar EDS SCV/SF event, Topic: "Robustness and Reliability of Wide Bandgap Power Semiconductors", Presenter: Dr. Layi Alatise

"Robustness and Reliability of Wide Bandgap Power Semiconductors" Lecture by Dr. Layi Alatise

 

The Electron Devices Society Santa Clara Valley/San Francisco joint Chapter and Device Reliability Physics committee are hosting Dr.  Layi Alatise

When: Friday, April 24th, 2026 – 11:45AM to 1:15PM (PDT)

11:45AM - 12PM: Introduction

12PM-12:45PM: Lecture

12:45PM-12:55PM: Q&A

1PM Adjourn

Where: ZoomZoom

This is an online event ONLY and attendees can participate via Zoom.

We will send the Zoom meeting information to registrants one day before the meeting. Please make sure you register.

Contact: ieeescveds at gmail.comSpeaker: Dr. Layi AlatiseAbstract:

Wide bandgap devices are increasingly penetrating the automotive market and are becoming prime candidates for implementation in applications like traction inverters and battery chargers. The mission profile of the traction inverter is a particularly aggressive one since the electrothermal stresses on the power devices vary significantly in amplitude and frequency as the motor drive goes through various stages of the drive cycle including acceleration, deceleration, stalling etc. Historically, the traction converter has been implemented using silicon devices where the performance and reliability is well known and understood. Application of WBG devices like SiC MOSFETs and GaN power devices in automotive applications requires understanding of the reliability and qualification procedures especially according to the automotive standard. SiC and GaN power devices have varying internal physics and modes of operation with vastly varying robustness and reliability performance compared to silicon devices. Given the sensitive nature of the application, these devices must pass stringent automotive reliability tests and guidelines defined by the Automotive Electronics Council (AEC), the Joint Electron Device Engineering Council (JEDEC-JC70) and the European Centre of power electronics (AQG).

Title:
IEEE CPP End-of-the-Year Banquet
Date:
April 24th
12:00 PM (3 hours)
Location:
35
Pomona, CA
Abstract:

Banquet for the IEEE student branch at Cal Poly Pomona and the ComSoc technical society student club.

Title:
Macropad Workshop: Part I
Date:
April 24th
12:00 PM (2 hours)
Location:
60
Chula Vista, CA
Abstract:

Macropad Workshop

Title:
Alaska Village Electric Cooperative (AVEC): Past, Present and Future
Date:
April 24th
12:30 PM (1.5 hours)
Location:
Engineering & Industry Building (EIB)
Anchorage, AK
Abstract:

Please join us for the IEEE Alaska Section’s April meeting. This month’s program features a presentation on the Alaska Village Electric Cooperative (AVEC) by the CEO, Bill Stamm.  He will talk about AVEC, the challenges of generating power in remote Alaska villages, and how they meet those challenges.

We will meet in person on the UAA campus.  Park in the UAA Engineering & Industry building south parking lot, come in the west entrance, and come up to room 413.

UAA parking is free on Fridays.

Zoom will be available for those unable to join us on campus. 

A complimentary light lunch will be provided, so advance registration is required. 

 
Title:
AI & Ethics in Public Health: Governing the White Space
Date:
April 24th
2:00 PM (1 hour)
Abstract:

This special guest lecture is brought to you in partnership with University of California Berkeley Spring 2026 course CIVENG#187: Emerging Technologies for Public Health.

Title:
WORKSHOP - TECHNOLOGY ROADMAPPING
Date:
April 24th
3:00 PM (2.5 hours)
Location:
Intel Ronler Acres RA1 Auditorium
Hillsboro
Abstract:
About the Workshop

Technology roadmapping is a powerful strategic planning approach that integrates scientific and technological insights with product development and business objectives. It enables organizations to identify emerging opportunities, align resources, and effectively navigate complex innovation landscapes.

In this interactive workshop, participants will gain a comprehensive introduction to both the concept and practical application of technology roadmapping. The session will combine expert presentations, group exercises, and discussions, providing a hands-on learning experience to reinforce key concepts.

How You Will Benefit
  • Gain a foundational understanding of technology roadmapping concepts and methodologies
  • Participate in team-based exercises to apply learning in real-world scenarios
  • Explore practical applications across industries, including energy efficiency
  • Enhance your ability to align technology strategy with business goals
Who Should Attend

This workshop is ideal for:

  • Technology planners and strategists
  • Engineers and innovation leaders
  • Project and product managers
  • Anyone involved in planning and developing new technologies
Learning Outcomes

By the end of this workshop, participants will:

  • Develop a working knowledge of technology roadmapping concepts and applications
  • Understand how to create graphical frameworks for complex strategic issues
  • Gain access to resources and tools for further exploration and implementation

Join us for this engaging session to strengthen your strategic planning capabilities and learn how to effectively map the future of technology and innovation.

(Note: Non Intel registrants should arrive by 2:30 PM to get badges to have access to the workshop.)

Title:
PES Chapter of IEEE Boise Section - Silver Jubilee Event (25 years)
Date:
April 24th
5:00 PM (2 hours)
Location:
Micron Center for Materials Research (MCMR)
Boise, ID
Abstract:

The IEEE Power & Energy Society (PES) Boise Chapter is celebrating its Silver Jubilee (25 years) this year. To mark this milestone, we will be hosting a chapter event and would like to invite all members to join us.

This event will bring together members of the Boise PES community to recognize the chapter’s 25 years and connect with fellow professionals in the power and energy field.  We will update you on what the chapter has been doing and what is planned.  Bring your ideas and interests for upcoming events.  Food and drinks will be provided.

Micron Center for Materials Research, Room 105
1435 W University Drive
Boise, Idaho 83706


Title:
Volunteers Needed: IEEE Spring STEM Event for Girls
Date:
April 25th
8:00 AM (7 hours)
Location:
Isbell Middle School - Harvard Blvd Entrance
Santa Paula, CA
Abstract:

“Girls Make STEM with Heart”, the IEEE Buenaventura spring STEM event for middle-school girls, will be on Saturday, April 25 at Isbell Middle School in Santa Paula. If you were involved in previous events, you know what a wonderful experience it is for the students and volunteers and how rewarding.

Here is some background:

  • Students can choose from a variety of workshops covering topics such as chemistry, circuits, light, sound, momentum, solar energy, and numbers.
  • We have at least three mentors per workshop. Each student was able to get plenty of attention.
    At the end of the day, students get to show what they learned to their parents.
  • Isbell Middle School graciously lets us use their classrooms and food service. Each classroom is equipped with a computer projector, movable tables and chairs, and Wi-Fi connectivity.
  • Lunch and materials are provided by IEEE.
  • See the IEEE Foundation Newsletter for an excellent write-up of a past event, and our YouTube channel for a photo montage.

Planning for the event is already underway. If you are interested in volunteering, please contact us at stem2026@ieee-bv.org

Know any middle-school girls who would like to attend? Their parents can register them here: www.ieee-bv.org/stem

Title:
IEEE Region 6 - Spring 2026 All Area Meeting
Date:
April 25th
8:30 AM (4.5 hours)
Abstract:

Join us for the Virtual Spring 2026 All Area Meeting on April 25th.

 

Title:
SCV-EPS AdCom Meeting (APRIL 2026)
Date:
April 25th
9:30 AM (1.5 hours)
Abstract:

Monthly AdCom meeting:  [agenda NOT updated yet]

1. Welcome - Hualiang

2. Symposium status update - Annette/Paul/Hualiang

3. Education outreach status - Masha/Azmat/Hualiang

4. Chapter Storage - Hualiang  XXXX NOT

5. Monthly talk preparation - Chandan/Luu

6. Chapter website update -    XXXX NOT Venkatesh/Claire/Paul

7. Senior member advancement - Dwayne

  Xxxx NOT

8: Election 2026

9:  Open discussion - All

 

Title:
2026 IEEE GameSIG Intercollegiate Computer Game Competition Showcase
Date:
April 25th
1:00 PM (4.5 hours)
Location:
Titan Student Union (TSU)
Fullerton, CA
Cost:
Admission fee may apply
Abstract:

Hybrid Event Details

Are you involved with Computer Game Development? Do you know of staff or students at academic institutions who are?  If so, please share this information on this event with them so they can attend this year's Competition.  The top 10 of this year's entries of the games' first stage  submitted will compete and be judged by professionals from the Computer Game Development industry. 

Building on the success of last year's competition, this year's is also being held in a Hybrid format! We'll be in-person at Cal State University, Fullerton and virtually via Twitch (while the teams present to the judges via Discord).

The IEEE GameSIG Intercollegiate Game [Developers] Competition, now in its fifteenth year, is an educational outreach project of IEEE GameSIG (which is part of the Orange County IEEE Computer Society, but does not geographically limit competing teams). The purpose of this event is to help students develop and demonstrate their skills at game design, development and promotion. They are challenged to show off a playable level of a game, live, in front of an audience of experienced game industry personnel and guests (which we are hoping you will join).  The Computer Society Publication Office produced a 9 minute Youtube video about a previous live Competition/Showcase which is available on the home page of GameSIGshowcase.org or at this link: 2013 IEEE Intercollegiate Game Showcase.

The competition typically attracts 30 to 50 entries, from which the top ten are chosen to present their work to the "live" audience and judges. Three primary awards are given, plus a series of special awards for unique achievements. These special awards are different each year based on the nature of what the developers are showing.  Their is also a People's Choice Award voted on by those attending in person or virtually.  More details on the competition can be found at GameSIGshowcase.org.

This year's showcase will be hosted from the California State University, Fullerton, at the Titan Student Center in Fullerton CA, and held Online via Twitch.

Parking at the event is free.  Use the State College Parking Structure on State College Blvd. Please see https://parking.fullerton.edu/visitors/index.html for maps.

The Twitch stream will start at 1:00 PM (PT) and end by 5:30 PM (PT).  Registered individuals will receive reminders about the Showcase as we get closer to the event, with the Twitch link provided via GameSIGshowcase.org.  The Twitch stream will be public.

  • For sponsorship via networking at the event, please contact us for more information at gamesigshowcase@gmail.com.
  • For sponsorship and donations, we'll contact you to acknowledge and verify processing. If unsure, please contact us.
    Support in check-form are preferred to avoid processing fees.
  • For inquiries and larger sponsorship or support, contact us for more information at gamesigshowcase@gmail.com.

Competition details are available at: http://gamesigshowcase.org/

Title:
OC IEEE 2026 Spring BBQ & UCI Graduation Celebration
Date:
April 26th
11:00 AM (5 hours)
Location:
18712 University Dr
Irvine, CA
Abstract:

OC IEEE 2026 SPRING BBQ

Join OC IEEE for our annual Spring BBQ at Mason Park in Irvine!
We’ll be celebrating UCI seniors graduating this year with ice cream and cake.

Everyone is welcome:
UCI faculty, UCI graduate students, friends, children, and pets
(Please register guests so we can plan accordingly)

📅 Date: Sunday, April 26
⏰ Time: 11:00 AM – 4:00 PM

📍 Location:
Mason Park – Shelter #2
Irvine, CA
(Turn right after entering from University Drive, then continue to Parking Lot B)

🎯 Activities
Volleyball & Badminton

🍔 Menu
Hamburgers & Grilled Chicken
Vegetarian food cooked separately

💲 Cost
Event Registration: FREE
Parking: (paid at entrance booth – card or cash accepted)

           

 

Title:
IEEE Coastal Los Angeles Section EXCOM Mixer with Young Professionals and Students
Date:
April 26th
11:00 AM (4 hours)
Location:
New India Oven Restaurant
Marina del Rey, CA
Abstract:

 

IEEE Coastal Los Angeles Section EXCOM is hosting a mixer event for CLAS students and Young Professionals on Sunday April 26, 2026.

New India Oven Restaurant

13444 Maxella Ave. Marina del Rey, CA 90292

Phone:(310) 306-1500

  Please join us to get to know fellow IEEE Student Members and Young Professionals for Sunday Brunch

Space is limited to 50 people, and therefore advanced registration/RSVP is required.

Title:
Alumni Weekend IEEE Pancake Breakfast
Date:
April 26th
11:00 AM (1 hour)
Location:
19 Rosy Lane
College Place, WA
Abstract:

The Walla Walla IEEE Student Branch invites you to a pancake breakfast at Dr. Doug Logan's house, former dean of engineering at Walla Walla University. Come for free food and network with WWU alumni.

Title:
ASQ RRD series webinar: Reliability of AI
Date:
April 27th
9:00 AM (1 hour)
Abstract:

Registration Link: https://asq.webex.com/weblink/register/rf28bc2df4626a12b2a8f4ced017302ba

This introductory webinar reframes AI systems as engineered systems that must be reliable, auditable, and safe in changing environments. It surveys common failure modes of deployed models (data drift, distribution shift, miscalibration, pipeline faults, and human misuse) and outlines an assurance toolbox: testing beyond accuracy, uncertainty-aware “don’t know” behavior, monitoring, versioning, rollback, and governance. The goal is to help reliability engineers apply familiar reliability thinking (FMEA-like reasoning, controls, continuous improvement) to build trustworthy AI in production.

Speaker: Dr. Rong Pan

Title:
2026 GET-AI SERIES: 1. From Prompt to Power - The Gen AI Starter Lab
Date:
April 27th
5:00 PM (2 hours)
Location:
5270 California Ave
Irvine, CA
Abstract:

We are excited to continue the Orange County Computer Society (OCCS) Global Emerging Technologies (GET) Series—a monthly platform dedicated to spotlighting transformative innovations in computer science and technology. Hosted by the IEEE Orange County Computer Society Chapter, this series brings together professionals, students, and tech enthusiasts to explore the cutting edge of what’s possible.

Following a highly engaging March session filled with thought-provoking conversations on Advancement in Digital healthcare , we’re thrilled to bring you a powerful double-feature this April—exploring both the strategic and technical sides of artificial intelligence.

Curious about Generative AI? This hands-on lab simplifies core concepts—from tokens and LLMs to RAG, Agents, and MCP—while showing how they work together in real systems. By the end, you’ll gain the skills and confidence to build your own AI-powered applications.

Session 1: Understanding Generative AI — Core Principles and Industry Impact (40 mins)1. What is GenAI

Understand how AI generates content and why it’s transforming every industry.

2. Tokens & How LLMs Think

Learn how text is broken into tokens and how that impacts cost, speed, and output.

3. Models & Ecosystem

Explore key GenAI players and choose the right model for your use case.

4. Prompting (Vibe Programming)

Master the art of guiding AI using structured, effective prompts.

5. RAG (Retrieval-Augmented Generation)

Enhance AI accuracy by grounding responses in your own data.

6. Agents (Automation Layer)

Move beyond chatbots to AI systems that can reason, plan, and take actions.

7. MCP (Tool Integration Layer)

Enable AI to securely discover and interact with real-world tools and APIs.

Session 2: GenAI in Action — From Prompt to Working Prototype (60 mins)

1. Hands-On Build

Follow along in a live demo as we integrate concepts and build an AI-powered application in real time using Visual Studio Code and Python notebooks

2. Architecture & Best Practices

Understand how all components fit together in a real-world AI system.

3. Next Steps

The journey doesn’t end here—stay with us for what’s next.

 

Gora Datta  

FHL7,SMIEEE,SMACM

Chair IEEE Computer Society – OC Chapter

Chair IEEE Engineering in Medicine and Biology Society (EMBS) - OC Chapter

Chair & Board Member IEEE Blockchain Technical Community

Founding Chair IEEE P3271.01 Working Group – Standard for Recurring Transactions Using Distributed Ledger Technologies (DLTs)

📧 gora.datta@ieee.org 
🔗 LinkedIn: linkedin.com/in/goradatta

Title:
IEEE End of the Year Banquet
Date:
April 27th
5:00 PM (3 hours)
Location:
Reno, NV
Abstract:

Join us for the IEEE End-of-Year Banquet as we celebrate a successful year of growth, innovation, and community within the IEEE Student Chapter at the University of Nevada, Reno.

This event brings together students, faculty, and members to reflect on the year’s achievements, recognize outstanding contributions, and connect with peers in a more relaxed and social setting. The evening will include food, networking opportunities, and acknowledgments of members who have made an impact throughout the year.

Whether you’ve been actively involved or are simply interested in IEEE, all are welcome to attend and celebrate with us.

Title:
Open Source FPGA Projects Roundtable
Date:
April 28th
10:00 AM (1 hour)
Abstract:

Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.  

Title:
IEEE EDS Distinguished Lecture - Multifunctional materials for emerging optoelectronic technologies
Date:
April 28th
2:00 PM (2 hours)
Location:
Holmes Hall
Honolulu, HI
Abstract:

Dr. Federico Rosei from the University of Trieste will be presenting a Distinguished Lecturer Seminar titled "Multifunctional materials for emerging optoelectronic technologies" on Tuesday April 28th at 11:00 AM. Attendance will be eligible for seminar credit.

Title:
MOVE USA Apr 2026 Tech Talk - Living with Intelligent Systems
Date:
April 28th
5:00 PM (1.5 hours)
Abstract:

Living with Intelligence:  How AI, Sensing, and Robotics Are Shaping Everyday Life

What if the environments around us could actively support our health, safety, and daily routines? AI, sensing, and robotics are rapidly moving beyond labs into the spaces where we live and work—transforming homes, campuses, and communities into intelligent, responsive ecosystems. Drawing on work from Kennesaw State University’s Prototype Living of Tomorrow (PLOT), a 25-acre living laboratory, this talk explores real-world applications including ambient and wearable sensing, wellness monitoring, and AI-driven robotic systems. It highlights both the measurable benefits and current limitations of these technologies, while addressing critical questions around privacy, autonomy, and trust. Attendees will gain a clear, practical view of how intelligent environments are being built today—and what it means for tomorrow.

Title:
IEEE Event with Dr. Alfredo Costilla Reyes
Date:
April 28th
5:00 PM (2 hours)
Location:
Davis, CA
Abstract:

In addition to our first Computer Vision workshop, we will host another workshop with Dr. Reyes.

Title:
NAVIGATING YOUR FUTURE
Date:
April 29th
6:00 PM (2 hours)
Location:
Fourth Avenue Building
Portland
Abstract:

The IEEE Oregon Section Young Professionals (YP) and Women in Engineering (WIE) affinity groups are excited to host this in-person event at Portland State University for all EE/ECE students!

This is a great opportunity for students to informally interact with, and learn from, three IEEE young professionals who were in the same shoes not too long ago. All EE/ECE students are strongly encouraged to attend and bring in all their school- or career-related questions they are looking to get some insights for!

There will be FREE food and drinks :)

 

Title:
Key Considerations for Successful High-Speed Board Design
Date:
April 30th
5:30 PM (1.5 hours)
Location:
SCDI (Sobrato Campus for Discovery and Innovation)
Santa Clara, CA
Abstract:

Key Considerations for Successful High-Speed Board Design
Ujjwal Datt Sharma

Abstract: Successful high-speed board design requires more than meeting electrical and functional requirements. Engineers must make balanced decisions that affect performance, reliability, manufacturability, cost, and schedule across the full product lifecycle. This talk provides a practical overview of the key considerations that should guide high-speed board design from concept through implementation. It emphasizes the value of thoughtful early decisions in reducing downstream problems during validation and bring-up. Attendees will gain a broader understanding of how disciplined design practices can improve hardware quality and support smoother product development.  

 

Speaker biography: Ujjwal Datt Sharma is a Hardware Engineer with 10 years of experience in high-speed system design, signal integrity, and AI hardware architecture. He specializes in motherboard design, FPGA-based systems, and data center switch platforms. He holds a Bachelor of Science in Electrical and Electronics Engineering from Manipal Institute of Technology, Karnataka (KA), India, and a Master of Science in Electrical and Computer Engineering from the University of New Haven, Connecticut (CT). His work focuses on developing reliable, high-performance hardware systems for next-generation computing and networking applications.

Title:
Reliability Modeling Approaches: Physics or AI/ML
Date:
May 1st
8:00 AM (1 hour)
Location:
ARMS 3115
West Lafayette, IN
Abstract:

This presentation provides a high-level description of CALCE-UMD activities in reliability physics of microelectronic systems, starting with a brief history and continuing on to recent trends in multiscale modeling of the reliability of advanced microelectronic packaging. The discussion includes specific focus on the importance of considering material microstructure in predictive reliability physics modeling; and explores the role of reliability physics in the context of AI/ML* approaches for reliability modeling.
In Topic 1, we will examine three examples where microstructure-sensitive modeling can provide important insights into material behavior: (i) organic interposers/substrates that are based on fabric-reinforced composites; (ii) solder alloys with heterogeneous multiscale microstructure; (iii) sintered silver materials with agglomerated nanoporous microstructure. In Topic 2, we will qualitatively explore the interplay between reliability physics and AI/ML in influencing both epistemic as well as aleatory uncertainties in reliability predictions.
*AI/ML: Artificial Intelligence / Machine Learning

Title:
Macropad Workshop: Part II
Date:
May 1st
12:00 PM (2 hours)
Location:
60
Chula Vista, CA
Abstract:

Macropad Workshop Continuation

Title:
SSCS Distinguished Lecture - Circuit Labs at the Lunch Table with MOSbius
Date:
May 1st
4:00 PM (1.5 hours)
Location:
F101 (Come through main entrance and go back to the right)
San Diego, CA
Abstract:

ABSTRACT

Learning integrated circuit design requires gaining a broad range of skills and knowledge including circuit analysis and design, signals & systems, applied electro-magnetics, and semiconductor physics. Learning theory has always been most accessible through books or now the internet. Simulation tools are now also widely available on personal computers, including open-source versions. But, learning measurements so far has been mostly confined to school or industry laboratories. Yet, physical intuition and practical experience keeps playing a significant role in the development of successful, high performance integrated circuits. We will present the MOSbius platform that allows a student or designer to experiment with IC-style, analog, CMOS circuits at the lunch table. This unique platform uses a custom chip with CMOS building blocks that can be wired on a breadboard or with a programmable on-chip switch matrix. Measurements can be conducted using an affordable, all-in-one, USB lab instrument. Ready-to-go experiments are provided to learners and instructors on https://mosbius.org. Nothing can substitute for the aha moment when you observe a circuit finally working. The debugging process to bring-up the circuit teaches the designer essential lessons that carry over to high performance circuits in highly scaled technologies. The MOSbius platform aims to make lab experience widely accessible and affordable to learners.
Title:
Idaho Science Olympiad State Competition -- volunteers needed!
Date:
May 2nd
7:15 AM (6.2 hours)
Location:
BSU Student Union Building
Boise, ID
Abstract:

We need volunteers for the Idaho Science Olympiad State Competition on May 2nd at BSU.

The Science Olympiad is an annual STEM competition for middle school and high school students. It's a lot of fun to watch, and it's even more fun help out by supervising and scoring one of the 23 STEM events. This is a great opportunity for IEEE members to help make a difference!

See https://idahoscioly.org/ for more details.

Two events where we can use help are: Electric Vehicle andRobot Tour Each event lasts only a few minutes for each team but teams come in throughout the day from 9:00 AM to 2:30 PM. Event Supervisors (Volunteers) should show up at least by 8:15 to help teams check in (Impound) their devices. The location with be the BSU SUB 2nd floor. The Idaho Science Olympiad (IDSO) provides breakfast, lunch, and free parking to all volunteers. You can register below or email me or call (voice mail or text) to volunteer. Sincerely,
Gary Carlsonidahosciolygc@gmail.com208-362-4999 

 

Title:
Distinguished Lecturer Tour: Federated Intelligence Over the Air: From Centralized to Collaborative Sensing
Date:
May 4th
11:00 AM (1 hour)
Location:
Hector J. MacLeod Building - MCLD
Vancouver, BC
Abstract:

Abstract: The next generation of wireless networks will no longer be confined to moving bits — they will sense, communicate, and learn simultaneously. This convergence is anticipated to enable distributed intelligence across devices, unlocking new capabilities for real-time perception and decision-making in dynamic environments. In this talk, two complementary advances in federated signal processing will be presented. First, an over-the-air federated edge learning (OTA-FEEL) framework with integrated radar sensing will be discussed. By leveraging echoes from the environment, rather than treating them solely as interference, robust model aggregation will be maintained while ensuring high-quality sensing and communication performance. A joint scheduling and beamforming design will be presented, supported by low-complexity optimization techniques, to preserve aggregation accuracy under realistic wireless conditions. Second, FedTrack, a novel federated learning–inspired algorithm for distributed target tracking, will be presented. By treating local log-likelihood functions as loss functions in a distributed optimization framework, FedTrack enables devices to collaboratively estimate a moving target’s position and velocity. This communication-efficient method closely approximates centralized maximum likelihood estimation, achieving accuracy near the Cramér–Rao bound while reducing reliance on a central coordinator. Together, these developments illustrate how federated intelligence over the air can transform 6G networks into systems that not only communicate but also sense and learn collaboratively. Implications for autonomous systems, smart cities, and beyond will be discussed, with emphasis on the central role of signal processing innovations in realizing this vision.

 

Title:
Open Source FPGA Projects Roundtable
Date:
May 5th
10:00 AM (1 hour)
Abstract:

Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.  

Title:
MOVE Virtual Operations Class - Part 1 of 3
Date:
May 5th
5:00 PM (1.5 hours)
Abstract:

 May 2026 MOVE USA Operations Training Opportunities

 

MOVE Operations Class – 3-part Virtual Series 

IEEE MOVE USA is offering a dynamic three-part Virtual Operations Class designed for volunteers preparing for MOVE truck deployment, as well as those interested in learning more about the program. Attendance is required for existing drivers and crew members and anyone seeking to advance to a MOVE Truck Driver or Crew Member role.  Attendance is encouraged for All MOVE volunteers.   

The course covers key topics including deployment expectations, truck equipment, and essential safety procedures. Each of the three sessions is conducted virtually and lasts approximately 90 minutes to two hours.

Participants will also gain an understanding of the differences among the three MOVE USA trucks, providing prospective drivers and crew members with a solid foundation in both the shared systems and the unique features of each vehicle.

Title:
Cu-Cu Hybrid Bonding and Co-Packaged Optics
Date:
May 5th
6:00 PM (2 hours)
Location:
Broadcom Inc Building 1
Irvine, CA
Abstract:

Cu-Cu Hybrid Bonding and Co-Packaged Optics

John H Lau

Unimicron Technology Corporation

John_Lau@Unimicron.com

 

 

Cu-Cu hybrid bonding is one of the flip chip assembly technologies. The advantages of hybrid bonding are: (a) higher density, (b) finer pad pitch, and (c) better performance. In this lecture, some fundamentals and more than 10 high-volume manufacturing products using hybrid bonding will be presented. On the other hand, co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the chiplets such as the optical engine (OE) which consists of photonic ICs (PIC) and the electrical engine (EE) which consists of the electronic ICs (EIC) as well as the switch ASIC (application specific IC). The advantages of CPO are: (a) to reduce the length of the electrical interface between the OE/EE (or PIC/EIC) and the ASIC, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. In the next few years, we will see more implementations of Cu-Cu hybrid bonding and a higher level of heterogeneous integration of PIC and EIC, whether it is for performance, form factor, power consumption or cost. The content of this lecture is shown below.

 

Title:
The Role of RF-to-THz Technologies for Communication and Sensing Advancements: Challenges, Opportunities and Technology Directions
Date:
May 5th
6:30 PM (0 minute)
Location:
Cal Lutheran Center for Entrepreneurship (Hub101)
Westlake Village, CA
Abstract:

Future of communication and sensing network is being transformed with the advancement in next generations of wireless with Beyond-5G, beyond-WiFi-8, ICAS, NTN, VR/XR/Metaverse, Digital-Twin and other emerging applications. Higher quality of experiences for connected future with ubiquitous lowest latency and superhigh data rate connectivity services will require innovative wireless technologies and communication hardware combined with AI/ML. Mobile platform integrated RF systems with antenna front ends are common factor for most of the wireless applications. Emerging usage scenarios will need intelligent mobile platforms with ultra-small form-factor, requiring co-design and heterogeneous integration of dis-similar semiconductor device, circuit and antenna technologies, in order to satisfy the desired application-specific performance criteria for the evolving use cases.

This presentation will present the emerging technology trends and will focus on the antenna-integrated RF to mm-wave/THz array integrated frontend opportunities and challenges demanding new technology, design, development and integration. Example architectures to enable
multifunction microsystem platform will be discussed.

Title:
IEEE Alaska - May ExCom Meeting
Date:
May 5th
7:00 PM (1.5 hours)
Abstract:

IEEE Alaska Executive Committee Meeting

Tuesday, May 5, 2026 ⋅ 6:00 – 7:30pm (Alaska Time - Anchorage)

Jeremie Smith is inviting you to a scheduled Zoom meeting using the IEEE Alaska Section Account

Join Zoom Meeting
https://zoom.us/j/98832778456?pwd=WnhVWFpOOGQ0YkZEVnlqMlJjWG5lZz09

Meeting ID: 988 3277 8456
Passcode: 269832

Please register if you will be attending.

Title:
IEEE-USA Livestream Webinar: Leading a Next-Generation Microelectronics Hub
Date:
May 6th
11:00 AM (1 hour)
Abstract:

What does it take to lead the acceleration of microelectronic technologies and deliver solutions to establish a trusted and resilient domestic supply chain?

What are the challenges and benefits to leading the acceleration of microelectronic technologies and delivering solutions to establish a trusted and resilient domestic supply chain?

Join the dialogue as we discuss a premier collaborative, public-private ecosystem that engages broadly across innovative partners in industry, academia, and government to rapidly advance defense and commercial applications. This unique environment empowers members to discover new technologies, share capabilities, develop a skilled workforce, and launch groundbreaking innovation into scalable commercial production for the benefit of National Security and economic dominance.

Title:
Neoteric Frontiers in Cloud and Quantum Computing
Date:
May 6th
5:00 PM (1 hour)
Abstract:
Speaker: Dr. Rajkumar Buyya (IEEE Fellow, ACM Fellow)
Hosted by IEEE Signal Processing Society, San Diego ChapterOrganized under the IEEE San Diego Section technical program.
The twenty-first-century digital landscape is being reshaped by the convergence of Cloud computing, Internet of Things (IoT), Artificial Intelligence (AI), and emerging Quantum computing paradigms. Cloud computing has evolved into a utility model, delivering infrastructure, platforms, and software as scalable, on-demand services over distributed global systems.
This talk presents a forward-looking vision of next-generation computing systems and explores key architectural innovations for building elastic, distributed, and intelligent cloud platforms. It covers integration of edge resources with large-scale data centers, enabling seamless deployment of AI and data-intensive applications.

The session will highlight Aneka 6G, a next-generation cloud application platform supporting Big Data and AI workloads, along with real-world deployments across domains such as healthcare, satellite imaging, and natural language processing.

The talk will also introduce emerging frameworks including QFaaS (Quantum Function-as-a-Service) and the iQuantum Simulation Toolkit, outlining how quantum computing can be integrated into modern cloud infrastructures.

The presentation concludes with insights into future research directions in cloud and quantum computing, focusing on scalable, intelligent, and hybrid computing environments. The session will include a live Q&A with the speaker. 
Title:
Distinguished Lecture : Transformer–Based Power Flow Controller for the Modern Grid
Date:
May 6th
5:30 PM (1.5 hours)
Abstract:

Power transformers are used to convert voltage from one level at the generation as step-up transformers to other levels at the end customers as step-down transformers. Power transformers are also used to change the phase angle of the voltage to control the flow of active power in the line. Changing voltage or phase angle cannot control active and reactive power flows independently. 

 

Sen Transformer (ST) marks the first breakthrough in bulk power system design in more than a century, hosting a range of benefits over traditional power flow solutions. The ST, which offers a plethora of power flow control features, such as independent active and reactive power flows, voltage, phase angle, impedance (XL or XC and R or –R, all independently variable), all in one unit, uses time‐tested components, such as transformer and load tap changers that are proven to be reliable, cost‐effective, and portable. While enhancing the active power flow to the line’s thermal limit, the reduction in reactive power flow leads to an efficient operation of the entire electrical grid.

 

A commercial-grade ST was designed to operate at 33 kV with a throughput rating of ±6.5 MVA. The unit was manufactured, tested and connected to the U.S. grid in Lenox, MA. The test results show that the bidirectional active and reactive power flows can be regulated independently, proving that the ST is a practical solution to meet utilities’ needs in terms of reliability, cost-effectiveness, component non-obsolescence, efficiency, portability and interoperability.

 

Title:
IEEE OC PES/IAS Chapter ExCom Meeting - May 6th 2026, MOVED ON-LINE
Date:
May 6th
6:00 PM (0 minute)
Abstract:

IEEE Orange County PES/IAS Chapter's ExCom meeting

All IEEE OC PES/IAS Chapter members are requested to attend this meeting. 

To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.

 

The zoom link is given below: 

Topic: IEEE OC PES/IAS ExCom Meeting
Time: May 6, 2026 06:00 PM Pacific Time (US and Canada)
Join Zoom Meeting
https://tae.zoom.us/j/85986909926?pwd=ArQwXkiC0CEzssriEAh4rXa8D9gS5C.1

 

Meeting ID: 859 8690 9926
Passcode: 785872

Title:
IEEE SCV Networking Event at the Sensors Converge 2026
Date:
May 6th
6:30 PM (2 hours)
Location:
Santa Clara Convention Center
Santa Clara, CA
Abstract:

Maximize your time at the Sensors Converge 2026. The IEEE Santa Clara Valley (SCV) Section invites all professionals and members attending Sensors Converge to an exclusive evening of networking and industry connection.

This is your opportunity to meet key leaders, innovators, and fellow engineers from the local tech community outside of the main exhibition hours.

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
May 6th
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
2026 SSCS/CSU Colloquium on Integrated Circuits
Date:
May 7th
10:00 AM (2 hours)
Location:
Electrical Engineering and Computer Sience
Long beach, CA
Abstract:

2026 SSCS/CSU Colloquium on Integrated Circuits is a technical event hosted by the IEEE Solid-State Circuits Society (SSCS) San Fernando Valley Chapter in collaboration with CSU Long Beach, CSU Northridge, and the IEEE Coastal Los Angeles Section Systems Council. The colloquium will feature technical talks on integrated circuit design, networking opportunities, and discussions with industry experts and researchers in analog and mixed-signal electronics. The event will take place on May 7, 2026, at California State University, Long Beach, and is open to students, faculty, and professionals interested in semiconductor and IC technologies.

Title:
Power Distribution in Heterogeneous Integrated Packaging for Data Center Computing
Date:
May 7th
12:00 PM (1 hour)
Abstract:

Join us for an insightful webinar with Francesco Carobolante, founder of IoTissimo® LLC and an EPS Distinguished Lecturer, as he explores the critical challenges and innovative solutions that advanced packaging can provide to address the "Power Wall". With over 30 years of industry experience and a tenure at Intel’s Corporate Strategy Office, Francesco will delve into the Heterogeneous Integration Roadmap (HIR) perspective on scaling high-power AI processors. This session will analyze how signal BW and energy requirements dictate the options available for architecting the package structure, including Vertical Power Delivery, integrated voltage regulators and advanced thermal management techniques. Discover how these architectural shifts are enabling the next generation of data center performance.

Title:
Effective Networking: Grow Your Circles of Influence
Date:
May 7th
6:30 PM (1.5 hours)
Location:
Alameda Hall
Santa Clara, CA
Cost:
Admission fee may apply
Abstract:

Networking expert Cesar Plata will lead us through a dynamic, interactive session where we will practice proven techniques to expand your professional reach. Key topics include:

  • The Law of Attraction & Marketing Yourself: Learn how to position yourself effectively.
  • Networking Etiquette: Master the art of starting and leaving conversations gracefully.
  • The Elevator Pitch: Refine and deliver your personal pitch with confidence.
  • Strategic Growth: Explore effective tradeshow tips and learn how to connect and leverage as a team.
  • Event Mastery: Gain insights on how to organize events and, most importantly, have fun while networking!
Title:
HyperXite Info Session
Date:
May 7th
6:30 PM (1 hour)
Location:
Engineering Hall
Irvine, CA
Abstract:

Join us for a night to learn all about the Hyperloop concept and UCI HyperXite's project on developing streamlined sustainable transportation. As recruitment season starts, this info session will explain all the ins and outs of this Senior Design Project, offering experience to work with power electronics, control systems, magnetic levitation, and linear induction propulsion! 

Title:
IEEE ASU ComSoc Keynote Speech Series
Date:
May 8th
11:00 AM (1 hour)
Location:
GWC
Tempe, AZ
Abstract:

The IEEE ASU ComSoc Student Branch Chapter is dedicated to fostering an active community of students and researchers passionate about communications, networking, and emerging wireless technologies. Our mission is to create a dynamic environment for professional development, mentorship, and technical exchange. As a core part of this mission, we host a Keynote Speech Series featuring distinguished leaders whose work informs and inspires our members. These sessions are designed to bridge the gap between cutting-edge research and industry practice, providing our student community with direct access to the visionaries shaping the future of connectivity.

Title:
Searchable Encryption: Foundations, Privacy Challenges, and Emerging Directions
Date:
May 8th
11:00 AM (1 hour)
Abstract:

Please join us on May 8 for an insightful online presentation on advancements in searchable encryption, presented by Dr. Khosro Salmani

 

Summary: Searchable encryption has emerged as a key cryptographic technology for enabling efficient search over encrypted data while preserving confidentiality in untrusted environments. In this talk, I will introduce the fundamental concepts of searchable encryption methodologies and discuss the privacy challenges that have shaped their evolution. The presentation will review the historical development of searchable encryption, highlighting how early designs addressed basic functionality and how subsequent approaches responded to increasingly sophisticated privacy threats, such as access-pattern and leakage attacks. I will then present a structured classification of searchable encryption methodologies, offering a conceptual framework that helps clarify existing designs and their privacy trade-offs. This classification aims to strengthen the foundation for reasoning about privacy guarantees and to support the design of more robust and practical schemes. The talk will also touch on emerging directions, including usability considerations and the interaction between searchable encryption and modern data-driven systems. The goal of this talk is to provide an accessible introduction to searchable encryption and its privacy challenges, while motivating researchers and practitioners to further explore open problems and contribute to advancing privacy-preserving search technologies.

Title:
IEEE Pizza with a Professor
Date:
May 12th
5:00 PM (1 hour)
Location:
Davis, CA
Abstract:

Join our second pizza with a Professor!

Title:
San Diego IEEE Electronics Packaging Society (EPS) Meeting - Part 3
Date:
May 12th
5:00 PM (1.5 hours)
Location:
Qualcomm Building S
San Diego, CA
Abstract:

We are organizing part3 of the IEEE San Diego Electronics Packaging Society (EPS) chapter meeting.

 

Title:
MOVE Virtual Operations Class - Part 2 of 3
Date:
May 12th
5:00 PM (1.5 hours)
Abstract:

 May 2026 MOVE USA Operations Training Opportunities

 

MOVE Operations Class – 3-part Virtual Series 

IEEE MOVE USA is offering a dynamic three-part Virtual Operations Class designed for volunteers preparing for MOVE truck deployment, as well as those interested in learning more about the program. Attendance is required for existing drivers and crew members and anyone seeking to advance to a MOVE Truck Driver or Crew Member role.  Attendance is encouraged for All MOVE volunteers.   

The course covers key topics including deployment expectations, truck equipment, and essential safety procedures. Each of the three sessions is conducted virtually and lasts approximately 90 minutes to two hours.

Participants will also gain an understanding of the differences among the three MOVE USA trucks, providing prospective drivers and crew members with a solid foundation in both the shared systems and the unique features of each vehicle.

Title:
The Intelligence of the Machine.. The Rigor of the Road!!
Date:
May 12th
5:00 PM (2.5 hours)
Location:
In-Person at: SEMI Headquarters
Milpitas, CA
Cost:
Admission fee may apply
Abstract:
IEEE Event Agenda - Tuesday May 12, 2026

🔹 5:00 PM – 5:30 PM

   Registration, Refreshments, Food & Networking (Meet & Greet)

Featured Speakers & Sessions

🔹 5:30 PM – 6:15 PM

Topic 1: Industry Talk – Standardizing Automotive Firmware for SDVs

Experts from Mercedes-Benz, Arm, and Athos Silicon will discuss the urgent need for a standardized, secure, and vendor-agnostic firmware foundation.

Key focus areas:

  • Overcoming fragmented firmware ecosystems
  • UEFI as a scalable automotive standard
  • Enabling functional safety, cybersecurity, and interoperability
  • Supporting chiplet-based and next-gen ADAS architectures

Speakers:

🔹 6:15 PM – 6:45 PM

Topic 2: Academic Keynote – Safe Embodied AI: From Theory to Deployment

Prof. Ding Zhao (Carnegie Mellon University)

Topics include:

  • Rare-event safety in autonomous systems
  • Safe reinforcement and imitation learning
  • Generalizable and adaptive AI safety
  • Future of trustworthy embodied AI at scale

Speaker:

🔹 6:45 PM – 7:15 PM

 Topic 3: Industry Talk – Static Safety Is Dead: Continuous Risk & Compliance for SDVs

Akshay Chalana (CEO & Co-founder, Saphira AI)

Modern vehicles evolve continuously through software updates, AI-driven functionality, and increasing connectivity—yet safety and cybersecurity practices remain largely static.

This talk explores:

  • What breaks when traditional safety assumptions no longer hold
  • Real-world ADAS/autonomy failure propagation: dataset bias, requirement drift, and system boundary ambiguity
  • Cross-domain challenges between safety and cybersecurity
  • A new model for continuous, system-aware risk assessment and compliance
  • Treating compliance artifacts as live infrastructure integrated into development pipelines

This session provides a practical path to maintaining certification-grade rigor while operating at software velocity.

Speaker:

🔹 7:15 PM – 7:30 PM

 Q&A and open discussion - Aditi Ramadwar

     About This Technical Forum

This technical forum brings together OEMs, Tier-1 suppliers, semiconductor leaders, researchers, and innovators to address the challenge of fragmentation and define a unified, future-ready mobility stack.

Who Should Attend:

  • Automotive engineers and architects
  • Safety and cybersecurity specialists
  • Semiconductor and embedded systems professionals
  • Researchers in autonomous vehicles and AI safety
  • Technical decision-makers from OEMs and suppliers
  • Students in Automotive, Compute, Mechanical & Electrical Engineering 

We would be delighted if you could join us and participate in shaping the future of intelligent transportation.

Title:
IEEE New Era AI 2026 workshop " Building AI Applications with Amazon Bedrock" by Amazon Lambda
Date:
May 12th
5:30 PM (2.5 hours)
Location:
Harding Building
Seattle,, WA
Cost:
Admission fee may apply
Abstract:

Early Bird:  50% off before May 1st,  In-person maximum 70 Seats,  Remote: no limit. 

 50% off: Student  ,  IEEE member: ,  Non-IEEE ,   

Remote   Certificate    

In this hands-on workshop, participants build  AI applications using Amazon Bedrock. Through guided
labs, they progress from foundational text generation and chatbots to advanced patterns including RAG,
multimodal image processing, structured data extraction, and security guardrails. Each lab produces a working
prototype that participants can extend. Along the way, participants gain experience with prompt engineering
techniques, learn to work with both text and image APIs, and explore how to secure AI applications with content
filtering, PII masking, and prompt attack prevention. The workshop is designed to be modular — participants can
focus on the tracks most relevant to their interests and move at their own pace.

Who Is This For?
The skills from this workshop apply across industries and roles. 
 Healthcare professionals can use image understanding and multimodal capabilities to prototype tools for
analyzing medical imagery like X-rays or pathology slides. 
 Data scientists and analysts can apply text extraction and summarization patterns to process research
papers, survey responses, or unstructured datasets at scale. 
 Software engineers can integrate RAG-based chatbots into existing applications to surface answers from
internal documentation or knowledge bases. 
 Business analysts can use structured data extraction to pull insights from contracts, customer feedback, or
financial reports without writing complex parsing logic. 
 Students and Researchers in any field can prototype AI assistants that help with literature review, data
labeling, or experiment documentation.
Whether you write code daily or have never touched Python, the workshop's modular structure lets you engage at
the level that fits your background.

Speakers 

Nithin Vommi is an Engineering Manager at Amazon Web Services, where he has spent nearly a decade building
and scaling large-scale distributed systems. He leads AWS Lambda streaming and queueing platforms, focusing on
serverless architectures and event-driven systems. Nithin has published technical articles, holds patents, and
speaks at AWS events including re:Invent. Over his time at AWS, he has launched more than a dozen customer-
facing features on serverless platforms, several highlighted at AWS re:Invent and broadly adopted by enterprises.
His current interests include serverless, generative AI, and event-driven design patterns.


Tejas Ghadge
is engineering head for AWS Amplify, AWS Lambda Event Driven Applications and AWS Lambda
Developer Experience where he leads an organization of 100+ engineers/managers across multiple sites in US and
Canada. With over 14 years of experience at AWS, Tejas brings deep operational and architectural experience from
- operating large scale (millions of requests per second) event driven systems, leading and analyzing hundreds of
operational incidents and successfully launching dozens of delightful customer features for AWS Lambda and AWS
Amplify customers.

 

Technical Requirements

Laptop with a modern web browser (Chrome, Firefox, or Edge)
2. Stable internet connection
3. No local software installation required — labs run in a browser-based IDE and a temporarily provided AWS account
4. No prior machine learning or data science experience required

Key Takeaways for Participants
1. How to use Amazon Bedrock APIs for text generation, embeddings, image generation, and multimodal tasks.
2. Working prototypes across five tracks: text generation, RAG chatbot, document summarizer, image generator/editor, multimodal chatbot, and structured data extractor
3. Practical prompt engineering techniques applicable across models — summarization, content creation, translation, analysis, and code generation
4. Hands-on experience implementing guardrails for content blocking, PII masking, and prompt injection defense

  •  IEEE  Professional certificate and Hrs will be offered to those attendees who pass a simple quiz at the end of class, with a fee.  

Parking : 

Click on the following link: https://www.offstreet.io/events/XM21K0JV
and enter your vehicle license plate.

Title:
IEEE Speaker: Chip Design with Jigneshkumar Patel
Date:
May 12th
6:00 PM (1 hour)
Location:
Davis, CA
Abstract:

Hear about chip design from our guest speaker Jigneshkumar Patel.

Title:
CHEERS OCEANEERS! May 13th, 2026
Date:
May 13th
4:30 PM (4 hours)
Location:
Quantum Brewing
San Diego, CA
Abstract:

CHEERS OCEANEERS! MAY 13th 2026

This month, our main presenter will be Dan Wolfson, and his presentation is about a San Diego startup called Poseidon AmphibWorks that is building the world's first highway-legal electric hydrofoiling "Boat-Car" amphibious vehicle.  Marine-oriented businesses like kelp farms, wave power, ocean researchers, etc., could drive these from their land-based facilities into the water and back. 

Please see more info in Dan's bio in the section below.

This month, we will also do something special - the winners of the Marine Technology Society (MTS) student science fair will start early and present their projects.  We did this last year, and the students demonstrated very impressive technologies!  We really appreciate seeing the advancement of science for the next generation.

 

***

Welcome to the monthly event for the IEEE Oceanic Engineering Society (OES), San Diego Chapter, which is hosting this meeting jointly along with TMA BlueTech (The Maritime Alliance), and MTS (Marine Technology Society).

Please join us for the main presentation and also plenty of time for networking and friendly conversation about everything oceanic, engineering, science, Blue Tech, and more.  No need to be an IEEE or OES member, or TMA, or MTS.  Everyone is invited.

This month, we will be at Quantum Brewing again, a cool science-themed brewery founded by a biochemist.

No ticket required, but please order something for yourself from the brewery.

Please grab a bite from a nearby restaurant, which is okay to bring into the brewery per the owner.

The food and drinks are not being funded by the hosts.  Please open your own tab.

Title:
IEEE OC Section ExCom Meeting - May 14th, 2026, IN-PERSON
Date:
May 14th
6:30 PM (2 hours)
Location:
ETAP, 17 Goodyear
Irvine, CA
Abstract:

IEEE Orange County Section Executive Committee Monthly meeting - occurs every 2nd Thursday of the month. 

All IEEE OC Committee/Chapter/Affinity/SIG Chair/Key Volunteers (or their proxy) are requested to attend. Other IEEE members are also welcome to attend. Please RSVP here to receive the meeting login information. Routine attendance is required to qualify for your chapter's annual IEEE rebate.

To AVOID unauthorized attendance, you MUST REGISTER for this event so that you can be sent the meeting link.

 

  

Title:
HOLD - YP Driving Range Social
Date:
May 14th
8:30 PM (2 hours)
Location:
Honolulu, HI
Abstract:

Driving Range

Title:
Wild Horse Wind Farm Tour
Date:
May 15th
11:00 AM (3 hours)
Location:
Wild Horse Wind & Solar Facility
Ellensburg, WA
Abstract:

IEEE Seattle Section and Central Washington University IEEE Student Branch are cohosting a tour to the Wild Horse Wind Farm, a 273 MW wind farm designed by Puget Sound Energy that consists of 149 wind turbines to power over 58000 homes.

Whether you're interested in a career in power engineering or you just want to go for a tour just for fun, this is a great opportunity to build connections with the broader IEEE community across Washington State and learn something new.

The details about the schedule are listed below.

Agenda
11:00 AM - 11:30 AM: Arrival and Networking
11:30 AM - 12:00 PM: Check-in
12:00 PM - 2:00 PM: Tour

Title:
General Body Meeting III
Date:
May 15th
12:00 PM (2 hours)
Location:
60
Chula Vista, CA
Abstract:

gbm3

Title:
Spring Speaker Series 3
Date:
May 17th
5:00 PM (2 days)
Location:
Stanford, CA
Abstract:

Continuation of Speaker Series at Stanford IEEE.

Title:
Electrostatic Discharge (ESD): From the Zap to Your Fingertip to a Manufacturing Challenge for 3D Integrated Circuits
Date:
May 18th
11:00 AM (2 hours)
Location:
SRP's PERA Club
Tempe, AZ
Abstract:

May 2026 Phoenix LMAG Luncheon and Meeting

Registration Fee: for attendees is . This will include a light lunch.

Please respond by May 7.
Students are invited with no fee but need to RSVP.
Tau Beta Pi Alumni and members are invited as paying attendees, please RSVP.
Bring the fee to the meeting or make a check out to “IEEE Phoenix Section LMAG” and mail to Gary Frere, his address is:


Gary Frere
6708 E. Palm Ln.
Scottsdale, AZ 85257-2516

For online attendees the fee is . When you RSVP as a WebEx attendee that is considered a commitment for the fee to be sent to Gary Frere. You will be provided the URL for the WebEx portion of the meeting.

 

Title:
Third Annual IEEE Build-Up Substrate Symposium
Date:
May 19th
8:00 AM (2 days)
Location:
SEMI World Headquarters
Milpitas, CA
Cost:
Admission fee may apply
Abstract:

(We anticipate closing registration in late April due to limited facility space; we apologize in advance if we cannot register you.)

 The 2026 Build-up Substrate Symposium (BUSS) convenes global leaders in semiconductor packaging, substrate technology, and AI-driven systems.  Under the theme “Next-Gen Substrates: Accelerating Innovation in the AI Era,” the symposium explores how advanced substrates are enabling transformative breakthroughs in chiplet integration, heterogeneous systems, and Co-Packaged Optics (CPO).
    As AI, HPC, and edge computing drive unprecedented performance demands, next-generation substrates are emerging as the foundation for scalable, high-performance, and energy-efficient solutions. Chiplets and CPO are rapidly gaining traction as a critical enabler of high-bandwidth, low-latency interconnects, further elevating the role of substrates in next-gen architectures.
    BUSS 2026 showcases innovation across the entire ecosystem—from materials to manufacturing and integration —- highlighting how substrate advancements are powering the future of semiconductor technologies, including the convergence of optics and electronics.

Title:
CANCELLED! IEEE Build-Up Substrate Symposium (BUSS)
Date:
May 19th
9:00 AM (2 days)
Location:
location to be announced
Milpitas, CA
Cost:
Admission fee may apply
Abstract:

We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China.
However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. As the US Congress debates H.R. 3249, the Protecting Circuit Boards and Substrates (PCBS) Act, this Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.

Title:
MOVE Virtual Operations Class - Part 3 of 3
Date:
May 19th
5:00 PM (1.5 hours)
Abstract:

May 2026 MOVE USA Operations Training Opportunities

 

MOVE Operations Class – 3-part Virtual Series 

IEEE MOVE USA is offering a dynamic three-part Virtual Operations Class designed for volunteers preparing for MOVE truck deployment, as well as those interested in learning more about the program. Attendance is required for existing drivers and crew members and anyone seeking to advance to a MOVE Truck Driver or Crew Member role.  Attendance is encouraged for All MOVE volunteers.   

The course covers key topics including deployment expectations, truck equipment, and essential safety procedures. Each of the three sessions is conducted virtually and lasts approximately 90 minutes to two hours.

Participants will also gain an understanding of the differences among the three MOVE USA trucks, providing prospective drivers and crew members with a solid foundation in both the shared systems and the unique features of each vehicle.

 

Title:
<Rescheduled to May 20> IEEE Computer Society Talks on Scalable Systems
Date:
May 20th
5:30 PM (2.2 hours)
Location:
UW1
Bothell, WA
Abstract:

The IEEE Computer Society Seattle Section and the IEEE UW Bothell Student Chapter invite you to an evening of engaging session featuring two expert speakers sharing insights on cutting-edge advancements in Artificial Intelligence and large-scale data systems.

As part of the program, Madhvi Sharma, Senior Engineering Manager at Oracle Health Data Intelligence, will present “Transforming Healthcare with AI”.

Isaac Dasari, Data Engineer specializing in large-scale data and analytics systems, will present “Designing Petabyte-Scale Data Systems for Modern Analytics and AI”.

Why Attend?

    • Gain insights from industry experts
    • Discover real-world applications of AI and data engineering
    • Network with peers and professionals
    • Stay ahead in the rapidly evolving tech landscape

Hosted by: IEEE Computer Society Seattle Section & IEEE UW Bothell Student Chapter
Audience: Software engineers, system architects, cloud engineers, IoT developers, and students interested in scalable system design

We look forward to seeing you there!

Title:
Brew with the Crew: High-fidelity Modeling and Simulation of Hydrodynamic Torque Converter: Demonstrating Synchronous Generation from Variable Speed Prime Movers.
Date:
May 21st
3:45 PM (1 hour)
Location:
1175 Pier View Dr
Idaho Falls, ID
Abstract:

Join us for the upcoming technical talk —attend in person at Stockman’s Restaurant or virtually via Microsoft Teams 

Title:

High-fidelity Modeling and Simulation of Hydrodynamic Torque Converter: Demonstrating Synchronous Generation from Variable Speed Prime Movers

Abstract:

The integration of inverter-based energy resources is increasingly replacing conventional synchronous generators in the bulk power system, impacting system inertia and deteriorating grid strength due to the limited over-current capability of power electronic converters. Hydrodynamic Torque Converter (HTC), a mechanical isolator that allows interfacing a variable speed prime mover with the grid through a synchronous generator, has the potential to mitigate these issues by mimicking the operation and grid impacts of conventional synchronous generators. In the context of wind power, Type-5 wind turbine uses HTC to isolate wind speed variations from the grid-connected generator, supporting synchronous operation. However, high-fidelity models of Type-5 wind turbine drivetrains are not widely available for grid integration and transient stability studies. Additionally, the limited deployment of Type- 5 turbines hinders the assessment of their contribution to bulk grid resilience. This talk will focus on modeling a Type-5 rated HTC, based on the automobile grade hydrodynamic converter physics, along with necessary geometry scaling and angular position biasing. The talk will also cover steady-state analysis driven initialization routine, hydraulic fluid flow control, and convective heating from torque limiting action. The developed model will further illustrate transient instability mitigations from step electric load changes and wind speed disturbances, thereby showcasing HTC’s grid synchronism ability, and potential for variable speed, in-stream hydropower, and hydrokinetic systems.    

Speaker: S M Shaiful Alam

S M SHAFIUL ALAM (Senior Member, IEEE) received the B.S. and M.S. degrees in electrical and electronic engineering from Bangladesh Univarsity of Engineering and Technology, Dhaka, Bangladesh, in 2008 and 2011, respectively, and the Ph.D. degree in electrical engineering from Kansas State University, Manhattan, USA, in 2015. He is currently a Research Scientist with Idaho National Laboratory, USA, and the Power and Energy Systems Group, EES&T Directorate. His current research interests include reliable and sustainable integration of energy systems, especially the modeling and validation of the operation and control of hybrid energy systems through digital real-time simulation with hardware-in-the-loop testing. Additional information on his research activities is available through Google Scholar.

 

 

 

 

 

 

 

 

 

 

Title:
OpenClaw Architecture: From Tool‑Orchestrated Agents to Perception‑Aware Autonomous Systems
Date:
May 21st
5:00 PM (0 minute)
Abstract:

Agentic AI systems are evolving from tool‑driven workflows into autonomous agents that can perceive, react, and operate in dynamic environments. This talk uses OpenClaw as a reference architecture to explore how agentic systems can move beyond single‑machine orchestration toward perception‑aware, production‑ready deployments.

We begin with OpenClaw’s core design—gateway‑based orchestration, tool execution, and local‑first workflows—and examine its limitations when scaling toward real‑time, autonomous behavior. From there, we introduce architectural patterns for integrating perception signals and environment feedback, enabling agents to reason and act in continuously changing contexts.

The session then covers key system challenges, including state management, observability, and coordination, along with practical approaches for scaling these systems across distributed environments. We conclude with concrete architectural principles for building robust, perception‑aware agentic systems that combine infrastructure rigor, extensible toolchains, and real‑world responsiveness.

Title:
CipherHacks
Date:
May 22nd
8:00 AM (2 days)
Location:
SD Central Library Shiley Events Suite
San Diego, CA
Abstract:

CipherHacks is San Diego’s premier student-run cybersecurity hackathon, created by and for high school students. We provide a welcoming, beginner-friendly environment where teens can explore ethical hacking, programming, and digital innovation. Whether it’s their first time coding or their tenth project, students work in teams to build creative solutions, attend hands-on workshops, and connect with mentors and peers who share a passion for tech. CipherHacks operates under the fiscal sponsorship of Hack Club, a 501(c)(3) public charity that supports student-run STEM programs.

Title:
Workshop: Drone Assembly
Date:
May 22nd
12:00 PM (2 hours)
Location:
60
Chula Vista, CA
Abstract:

Drone Assembly Workshop

Title:
IEEE Canada Blockchain Forum 2026 (4th edition)
Date:
May 25th
6:00 AM (8 hours)
Location:
Ontario Investment and Trade Centre
Toronto, ON
Cost:
Admission fee may apply
Abstract:

Theme for 2026: at the intersection of modernised Payments and AI, featuring Stablecoins, protocols such as x402, Agentic AI such as OpenClaw, on the wake of Bill C-15 and the rise of open source AI. We have a packed agenda!

The IEEE Blockchain Forum is returning for the fourth time as part of Toronto Tech Week. The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications.

Expect deep thought leadership, executive talks and panels, and academic presentations. We're talking long-term engineering trends and innovation. You won't find marketing narratives, token launches, or promotions.

Note: The 2025 edition of the forum counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum Enterprise Alliance, EY, Starknet, among others. 

Title:
MOVE USA May 2026 Tech Talk - Wildland Fire Radio Communications
Date:
May 26th
5:00 PM (1.5 hours)
Abstract:

Radio Communications in Wildland Fire Operations

Every firefighter deployed to a wildland fire learns the critical importance of Lookouts, Communications, Escape Routes, and Safety Zones, or LCES, as firefighters call it.  LCES are the four pillars of safe wildland fire operations. Effective radio communications is not just a tool—it is the glue that integrates these four pillars, and the foundational lifeline that separates successful containment from tragedy. Unlike structural firefighting, wildland operations often occur in remote, rugged terrain where cell service is non-existent, and crews are spread across miles of demanding landscape.

The challenging aspects of this environment—intense smoke, roaring fires, extreme heat, and severe topographical interference—place unique demands on communication technology.  Firefighters require robust radio systems, interoperable with multiple agencies, and increasingly augmented by mobile mapping apps.

This presentation will explore the radio systems used to support firefighters and the LCES process in wildland firefighting,

 

Title:
IEEE PES Lecture: Power Management and Control to Balance Residential Microgrids with Individual Phase-wise Generation and Storage
Date:
May 28th
5:00 PM (1.2 hours)
Abstract:


The past decade has seen a significant rise in the proliferation of roof-top photovoltaic (PV) systems with storage units at residential sites. This has affected how power engineers and researchers have previously studied distribution systems as passive networks. With the introduction of these local distributed energy resources, a distribution system has become part of an active network. This modernization of the power distribution network brings along with itself a number of key issues that need to be proactively tackled by the local utilities. In North America, the concept of central generation has transformed into local distributed generation (DG) due to the rise of family-owned rooftop PV systems, storage devices, and electric vehicles. With this phenomenon reshaping the current perspective of distribution networks, the local generation and storage capacities, with their respective controllers, allow for these DG units to be grouped together to form single-phase microgrids most commonly referred to as residential microgrids. This presentation looks into  residential microgrids, which accommodate multiple embedded generation and energy storage units while balancing generation and loading in each phase to achieve overall three-phase system balance.

About the Speaker:

Syed Ahmed Raza Naqvi received his B.Sc. degree in Electronics Engineering from National University of Science and Technology School of Electrical Engineering and Computer Sciences (NUST-SEECS), Pakistan in 2009. He was recipient of Rector’s Gold Medal award for the Best Final Year Project. He completed his M.Sc. degree in Electrical Engineering from King Fahd University of Petroleum and Minerals (KFUPM), Saudi Arabia in 2012 and Ph.D. degree from the University of Western Ontario (UWO), London, Ontario, Canada in 2021. From 2012-2014 he worked as an Instructor at Prince Mohammad Bin Fahd University in Electrical Engineering department where he worked on sustainable energy potential in KSA and on system identification algorithms in power and communication systems. He was the recipient of London Hydro scholarship in 2015 from UWO. Between 2021 and 2022, he worked as a Simulation Specialist for Electrical System Testbenches as part of Application eXpertise and Electrical Simulation (AXES) team at OPAL-RT Technologies, Montreal, Canada, where he was involved in the development and testing of real-time models pertaining to microgrids, AC-DC inverters and DC-DC converters on OPAL-RT’s testbenches and power amplifiers.  He is currently working as a Senior Power Electronics Modeling Engineer at TAE Power Solutions, California, USA, as part of the Power Solutions team. He is currently involved in designing and commissioning of high power and high current DC power supplies for Fusion related research at TAE Technologies Inc. Syed Ahmed Raza Naqvi has published several journal and conference papers in reputable IEEE journals and conferences. His main areas of research include dynamic and steady state control of power systems, power management and control for PV/battery based residential microgrids, design of high power and high current DC power supplies, and application of system identification techniques in non-linear systems.
Title:
The Leadership BluePrint
Date:
May 30th
10:00 AM (5 hours)
Location:
Auditorium @ The Alhambra, Building A7
Alhambra, CA
Abstract:

WIE SFV is proud to partner with the California Institute of Advanced Management for this event.

Unlock your leadership potential through an immersive leadership development seminar designed for aspiring leaders.

The Leadership Blueprint is a transformative leadership development experience that brings together renowned keynote speakers and forward-thinking leaders for dynamic, real-world learning. Rooted in Peter Drucker’s Management as a Liberal Art philosophy, the seminar explores leading oneself, leading others, and leading with impact. Attendees will gain actionable insights, meaningful networking opportunities, and receive an official Certificate of Completion from the California Institute of Advanced Management.

Registration link: leaderbp.eventbrite.com

To be seated with the IEEE group please email lynda@ieee.org after registration.

 

Attendees from IEEE will receive a 25% tuition discount for Fall 2026 enrollment at CIAM.

For details and eligibility verification, please email lynda@ieee.org and include your IEEE membership ID in the subject line:

CIAM Tuition Benefit – IEEE Member [ID]

 

 

 

Title:
IEEE Project Showcase
Date:
June 2nd
5:00 PM (2 hours)
Location:
Davis, CA
Abstract:

Come watch our IEEE members present their projects at project showcase!

Title:
IEEE-USA Livestream Webinar: Lean Thinking for Leaders: Insights of Operational Excellence from Semiconductor Manufacturing
Date:
June 3rd
11:00 AM (1 hour)
Abstract:

In today’s highly competitive and technology-driven environment, operational excellence is no longer optional—it is a strategic necessity. This webinar explores how Lean Thinking principles enable leaders to drive efficiency, eliminate waste, and build high-performance systems that deliver sustainable results.

Drawing insights from semiconductor manufacturing—one of the most complex and precision-driven industries in the world—this talk highlights how lean methodologies, data-driven decision making, and continuous improvement practices can transform operations and leadership effectiveness. Participants will learn how leaders can foster a culture of accountability, streamline processes, and align teams toward operational excellence.

This session is designed for engineering leaders, project managers, and professionals who want to leverage lean thinking to enhance productivity, improve quality, and lead impactful organizational transformation.

 

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
June 3rd
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
Distinguished Lecture (VIRTUAL): "Human System Engineering Initiatives: From Human Views to Human Readiness Levels"
Date:
June 5th
9:00 AM (1 hour)
Abstract:

IEEE WIE AG Schenectady is going to organize WIE Distinguished Lecture (virtual webinar) on "Human System Engineering Initiatives: From Human Views to Human Readiness Levels" on 5 June 2026, Friday, 12-1 pm EDT. The speaker is Holly A. H. Handley, PhD, PE, the Interim Dean of the Interdisciplinary Schools and a Professor in the Engineering Management and System Engineering Department of Old Dominion University (ODU).

This talk discusses the role of Human System Engineering within the System Engineering discipline. It describes two initiatives that are enabling better integration of humans and systems. The Human Views comprise a system architecture viewpoint that provides a perspective on the human roles, activities, and information flows required by a complex system. The Human Readiness Levels assess the degree to which human-focused requirements are incorporated into design decisions and the readiness of a system to interact with its human operator. Together these two efforts encourage System Engineering for the total system by supporting a comprehensive integration of the human component into the systems engineering effort, which is critical to the design, development, and operation of successful systems. Current standards and applications of both initiatives will be included.

Title:
Student Design Competition (SDC-2) at IMS-2026
Date:
June 9th
5:00 AM (9 hours)
Location:
Thomas M. Menino Convention & Exhibition Center
Boston, MA
Abstract:

Join us to see students' designs at IMS-2026 in Boston!

Dr. Osman Ceylan (Vice Chair of IEEE Foothill Section and MTTS Chapter) organizes the SDC2 - RF Bias Tee Design for Active Baseband Load-pull Applications.

The competitions will be scheduled into a Morning Session or an Afternoon Session. The schedule will be made available after SDC applications close on 15 April 2026. Winners will be recognized at the Student Awards Luncheon on Thursday, 11 June 2026.

At least one team member must register for IMS2026 and attend the student design competitions in person on Tuesday, 9 June 2026 in order to assist with measurements (where applicable) and answer questions.

Prize Amounts:

1st Place=00

2nd Place =00

3rd Place =0

For more information, click here!

Title:
Women Engineering Legends: A Pioneering Legacy
Date:
June 15th
5:30 PM (1.5 hours)
Abstract:

A Panel Discussion by some of the co-editors and authors of Springer Nature Publishing's

Women Engineering Legends 1952-1976
Title:
SusTech Talk June 2026 - Sand-Like Particles for High-Temperature Thermal Energy Storage
Date:
June 16th
6:00 PM (1 hour)
Abstract:
NEW DATE 16-June“Sand-Like Particles for High-Temperature Thermal Energy Storage: Enabling a Resilient Renewable Energy Future” 

with Shin Young Jeong, faculty member of the Center for Advanced Turbomachinery and Energy Research, University of Central Florida.

Date/Time: Tuesday, June 16, 6pm - 7 pm Pacific Time

Abstract:

The transition to renewable energy has increased the need for reliable, large-scale storage to balance intermittent generation with continuous demand. Thermal energy storage (TES) offers a cost-effective solution by capturing excess energy as heat and releasing it when needed, supporting long-duration storage and grid stability. Unlike batteries, TES can scale to industrial levels, provide process heat, and deliver electricity through power cycles. Recent advances use abundant, low-cost materials such as sand-like particles serving as both heat transfer media and storage. This talk will highlight emerging TES technologies and their role in a resilient, decarbonized energy future.

 

Title:
IEEE-USA Livestream Webinar: Introduction to Startup Accelerators
Date:
June 17th
11:00 AM (1 hour)
Abstract:

Turn an early idea into something real and fundable. In this session, Troy Vosseller from gener8tor, one of the most respected startup accelerators, breaks down how founders move from a concept to a reputable company. You’ll hear what helps inventors gain traction, build a business that can grow, and get in front of investors when it counts

 

Title:
Center for Advanced Signal and Image Sciences (CASIS) 29th Annual Workshop
Date:
June 24th
8:00 AM (2 days)
Location:
Building 661 L-794
Livermore, CA
Abstract:

We are thrilled to host LLNL’s 30th Center for Advanced Signal and Image Sciences (CASIS) workshop. The workshop returns with a full 2-day in-person schedule on Wednesday and Thursday, June 24-25, 2026.

We encourage a broad range of technical topics at the workshop and being non-archival  apart from original work, we are also considering intermediate results from ongoing efforts as well as recently published publications for presentation as a talk and/or a poster. The goal of the workshop is to provide a platform for the exchange of ideas and network with peers across disciplines to foster collaboration and build community. Please submit your abstract by Friday, May 15, 2026. Authors will be notified of the review decisions one week later on May 22,  2026.

Apart from the regular presentation track we will feature parallel tutorials, hands-on mini workshops and a dedicated student track to introduce career opportunities at LLNL.

The workshop will be held in-person at the University of California Livermore Collaboration Center (UCLCC) and requires pre-registration until June 18, 2026. As this is a 2-day whole-day workshop, we will provide coffee and snacks in morning and afternoon breaks as well as a lunch on both days. As this is our 30th anniversary, we will also host a Happy Hour following the regular program on Wednesday, June 24, 2026.

CLICK HERE FOR TALK SUBMISSION, REGISTRATION AND MORE

This year’s workshop features presentations in the following tracks, moderated by the Program Chairs:

  • AI/Machine Learning (PhanNguyen, Kowshik Thopalli)
  • National Ignition Facility (Eugene Kur, Christopher Miller)
  • Non-Destructive Evaluation (Seemeen Karimi, Harry Martz)
  • Quantum Sensing & Quantum Computing (Kristi Beck)
  • Remote Sensing, Non-Invasive Imaging & Inverse Problems (Sean Lehman, Viacheslav Li)
  • Robotics & Automation (Aldair Gongora, Abhik Sarkar)
  • Student Track: All topics (Poster only) (Ted Bauman, Min Priest)

Become part of this great experience and submit your talk proposal at https://engineering.llnl.gov/centers/casis/workshops before May 15, 2025!

Check out this report for last year’s amazing event to see what to expect!

The no-fee CASIS Workshop is sponsored by the LLNL Engineering Directorate and held at the University of California Livermore Collaboration Center (UCLCC). It is organized by the Center for Advanced Signal and Imaging Sciences (CASIS), and is a joint meeting with the local chapters of the IEEE Signal Processing Society and IEEE Computer Society. supported by the IEEE Oakland East Bay Section.  

 

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
July 1st
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
IEEE WIE Pau Hana: Unwind and Connect
Date:
July 1st
9:00 PM (1.5 hours)
Location:
TBD
Honolulu, HI
Abstract:

A professional networking and community-building event organized by the IEEE Women in Engineering (WIE) Affinity Group in Hawaii. The event aims to bring together students, researchers, and industry professionals to foster mentorship, technical exchange, and career development in engineering and related STEM fields.

The event will include a short welcome session, informal networking, and light refreshments to encourage conversation and engagement among attendees. By providing a relaxed and inclusive environment, the activity supports WIE’s mission of promoting diversity, inclusion, and retention of women and underrepresented groups in engineering.

90 meetings. Generated Thursday, April 23 2026, at 1:44:02 AM. All times America/Los_Angeles