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93 meetings

Title:
Speaker Series Event
Date:
March 2nd
5:00 PM (1 hour)
Location:
Stanford, CA
Abstract:

As part of the Stanford IEEE continuing Speaker Series throughout the year.

Title:
Open Source FPGA Projects Roundtable
Date:
March 3rd
10:00 AM (1 hour)
Abstract:

Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.  

Title:
IEEE X MESA: SMUD Hydro Generation Information Session
Date:
March 3rd
12:00 PM (1 hour)
Location:
TEB
Sacramento, CA
Abstract:

Join the Sacramento State IEEE student chapter in collaboration with MESA for a discussion about SMUD's Hydro Generation department. Our speaker, Dan Stricklin, is a Sac State alumnus with 20 years of experience in the utility industry.

Dan will share insights from his experience in the industry, information on career paths within SMUD, and what it is like working with hydroelectric generation. Q&A to immediately follow the presentation.  This event is open to all, with internship and employment opportunities for several engineering disciplines including electrical, mechanical, civil, and Instrument & Controls.Food will be provided!
Title:
Student Officer Meeting
Date:
March 3rd
3:30 PM (0 minute)
Location:
Lilibridge
Pocatello, ID
Abstract:

Officer Meeting to plan for the next 2 weeks. 

To go over the Schedule, Budget, and Special Opportunities the student branch/club has. 

Title:
Recent Advancements in Image Generation and Understanding
Date:
March 3rd
5:30 PM (1 hour)
Abstract:

2nd Lecture of IEEE CS San Diego's 2026 Invited Seminar Series (Virtual)

Title:
The Making of a Chip: Technology, Tools, and Careers
Date:
March 3rd
6:00 PM (2 hours)
Location:
Riverside Hall
Sacramento, CA
Abstract:

The Making of a Chip is an introductory technical and career-focused session designed to provide participants with a comprehensive overview of the complete ASIC development lifecycle. The event will guide attendees through each critical phase of chip creation, starting from system and ASIC/VLSI specifications, progressing through design and verification, and concluding with post-silicon validation.

Participants will gain insights into how real-world requirements are translated into silicon-ready designs, the role of RTL design and functional verification, and the importance of validation after fabrication to ensure performance, reliability, and compliance. In addition to the technical flow, the session will highlight current industry practices, tools, and skills required at each stage of the semiconductor lifecycle.

The event will also focus on career opportunities for graduates in the semiconductor industry, outlining various job roles such as ASIC/VLSI design engineer, verification engineer, validation engineer, and related entry-level positions. Industry expectations, essential skill sets, and career pathways will be discussed to help students and early-career professionals prepare for roles in chip design and development.

This session is ideal for engineering students and graduates who are interested in understanding ASIC/VLSI design workflows and exploring career opportunities in the semiconductor domain.

Title:
SusTech Talk March 2026 - Sand-Like Particles for High-Temperature Thermal Energy Storage
Date:
March 3rd
6:00 PM (1 hour)
Abstract:
POSTPONED - NEW DATE TBA“Sand-Like Particles for High-Temperature Thermal Energy Storage: Enabling a Resilient Renewable Energy Future” 

with Shin Young Jeong, faculty member of the Center for Advanced Turbomachinery and Energy Research, University of Central Florida.

Date/Time: Tuesday, March 3, 6pm - 7 pm Pacific Time

Abstract:

The transition to renewable energy has increased the need for reliable, large-scale storage to balance intermittent generation with continuous demand. Thermal energy storage (TES) offers a cost-effective solution by capturing excess energy as heat and releasing it when needed, supporting long-duration storage and grid stability. Unlike batteries, TES can scale to industrial levels, provide process heat, and deliver electricity through power cycles. Recent advances use abundant, low-cost materials such as sand-like particles serving as both heat transfer media and storage. This talk will highlight emerging TES technologies and their role in a resilient, decarbonized energy future.

 

Title:
IEEE Alaska - March ExCom Meeting
Date:
March 3rd
7:00 PM (1.5 hours)
Abstract:

IEEE Alaska Executive Committee Meeting

Tuesday, March 3, 2026 ⋅ 6:00 – 7:30pm (Alaska Time - Anchorage)

Jeremie Smith is inviting you to a scheduled Zoom meeting using the IEEE Alaska Section Account

Join Zoom Meeting
https://zoom.us/j/98832778456?pwd=WnhVWFpOOGQ0YkZEVnlqMlJjWG5lZz09

Meeting ID: 988 3277 8456
Passcode: 269832

Please register if you will be attending.

Title:
IEEE Hawaii March ExCom
Date:
March 3rd
7:30 PM (1 hour)
Location:
Holmes Hall
Honolulu, HI
Abstract:

March Executive Committee Meeting

Title:
Inbox Detox Committee Meeting - after Feb. Board and Mini Series 2026
Date:
March 4th
10:00 AM (1 hour)
Abstract:

Dear All, 

Reminder: there will be an Inbox/Detox working group meeting tomorrow, Wednesday March 04th, at 1pm Eastern (Noon Central, 11am Mountain, 10am Pacific, 11:30pm IST).

Webex Meeting Link: https://ieee.webex.com/meet/awalter

See you in the meeting.

Best regards,
Chris Gunning and Mousmi

 

 

Title:
IEEE-USA Livestream Webinar: Beyond the Application: How Strategic Networking Unlocks the Hidden Job Market
Date:
March 4th
11:00 AM (1 hour)
Abstract:

In today’s saturated job market, submitting applications alone is rarely enough. This session explores advanced job-search strategies that go beyond online postings, with a focus on purposeful networking that leads to real conversations, referrals, and opportunities. Participants will learn how to identify the right people to connect with, how to approach networking in a professional and authentic way, and how to position themselves for roles that may never be publicly advertised. This webinar is designed to help job-seeking professionals compete effectively in a highly crowded market.

 

Title:
IEEE UWT Student Branch - CAD (OnShape) Workshop
Date:
March 4th
12:30 PM (0 minute)
Location:
Cherry Parkes
Tacoma, WA
Abstract:

This workshop focuses on teaching beginner engineering IEEE members on CAD (computer-aided design) via OnShape to provide skills on design for any engineering projects. This goes over the OnShape UI and shortcuts and features available in the software, and has students develop their own designs for practice. 

Title:
IEEE OC PES/IAS Chapter ExCom Meeting - March 4th 2026, MOVED ON-LINE
Date:
March 4th
6:00 PM (0 minute)
Abstract:

IEEE Orange County PES/IAS Chapter's ExCom meeting

All IEEE OC PES/IAS Chapter members are requested to attend this meeting. 

To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.

 

The zoom link is given below: 

Topic: IEEE OC PES/IAS ExCom meeting
Time: Mar 4, 2026 06:00 PM Pacific Time (US and Canada)
Join Zoom Meeting
https://tae.zoom.us/j/86949880492?pwd=UP0LCD1qQXesboqCIbnbSagUtVOyKf.1

 

Meeting ID: 869 4988 0492
Passcode: 228799

Title:
Start up a Consulting Business Firm
Date:
March 4th
6:20 PM (2.2 hours)
Abstract:

Hello Foothill Section members,

Notice is given that Consultants Network will host a seminar with topic: "Start up a Consulting Business Firm" on March 4, Wednesday, 6:30pm PST.

We will discuss how to set up a consulting business firm and let's share experience and expertise how to run a successful consulting firm.

Zoom Link: https://us02web.zoom.us/j/81121875392?pwd=VU5BNWZ2dVI0MzlzbWtCMWhQUXYxZz09

Meeting ID: 811 2187 5392

Passcode: 930305

Nick Ng

email nicky.ng@ieee.org

Consultants Network Chair

https://foothill.ieee-bv.org/section-officers/

 

Title:
Tech Talk: Emotional Intelligence in AI
Date:
March 4th
7:00 PM (1 hour)
Abstract:

The San Francisco Bay Area chapter of the IEEE Computer Society invites to our free and open Virtual Tech Talks (no IEEE membership required):

Speaker: Dr.K.Venkata Nagendra (Connect on LinkedIn)

Title: Emotional Intelligence in AI

Abstract: AI emotional intelligence, also known as emotion AI or affective computing, is the ability of AI to detect, interpret, and simulate human emotions using through facial expressions, body language, voice tone and other cues. While AI can analyze emotional cues and even generate responses that seem empathetic, it lacks true consciousness, empathy, and personal experience, which are fundamental to genuine emotional intelligence. Instead of replacing human emotional intelligence, AI serves as a tool that can enhance it by providing insights, analyzing data at scale, and creating more natural human-machine interactions. AI technology uses various methods to recognize and respond to human emotions, including: Facial Recognition Technology is used to analyze facial expressions and detect emotions such as happiness, sadness, anger, and fear. This technology uses algorithms to analyze facial features such as the shape of the mouth, eyes, and eyebrows. And another one, Voice Recognition Technology is used to analyze the tone and pitch of a person's voice to detect emotions such as happiness, sadness, and anger. This technology uses machine learning algorithms to analyze speech patterns and identify emotional cues. The Benefits of Emotional Intelligence in AI, Creating More Meaningful Interactions between Humans and Machines, Enhanced education, shaping the Future of AI.

Bio: Dr. Kolluru Venkata Nagendra,  graduated from Sri Venkateswara University in Tirupathi with a bachelor's degree in computer science. He later graduated from Jawaharlal Nehru Technological University in Hyderabad with a master's degree in computer applications. After that, he graduated from Acharya Nagarjuna University in Guntur with a Master of Technology in Computer Science and Engineering. Additionally, he graduated from Vikrama Simhapuri University in Nellore, Andhra Pradesh, with a Ph.D. in computer science. He graduated from Srinivasa University in Mangalore with a PDF (Post Doctoral Fellowship) in CSE. In addition to writing numerous computer science textbooks, Dr. Nagendra is the author of more than 70 research papers that have been published in journals with UGC and Scopus indexes. He served as a judge and reviewer for numerous conferences and journals. Having worked at several engineering colleges for more than 17 years, he is currently employed SRKR Engineering College, Bhimavaram, Andhra Pradesh. His research interests encompass Machine Learning, Deep Learning, and Data Mining.

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
March 4th
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
Definition of Inertia Ancillary Service - Dr. Ross Baldick
Date:
March 5th
9:00 AM (1.0 hour)
Abstract:

The first part of this presentation provides background on ancillary services in North American electricity markets, highlighting both "old" and "new" ancillary services, the co-optimization of ancillary services with power in the market design, the emerging issue of inertia in the light of retiring thermal generation, and the increasing role of inverter-based resources in providing ancillary services.  A key challenge with inverter-based resources providing ancillary services is appropriately defining energy storage requirements. This issue is illustrated and resolved in a proposed new inertia ancillary service.

Speaker: Prof. Ross Baldick, University of Texas at Austin

https://teams.microsoft.com/meet/2476815349011?p=fL1Q4CmZI1Bm33fkJY

Title:
TEMS Silicon Valley Chapter is co-hosting the 2026 CES Download Event
Date:
March 5th
5:30 PM (2.5 hours)
Location:
Plug and Play Tech Center
Sunnyvale, CA
Abstract:

TEMS Silicon Valley Chapter is co-hosting the 2026 CES Download Event.

Join us on March 5, 2026, for a Hybrid presentation.

Come for a glimpse into the latest and most innovative technologies unveiled at the recent Consumer Electronics Show in Las Vegas.

This is the annual IEEE SFBA Consumer Technology Society (CTSoc) event providing a comprehensive summary of the latest and unique tech innovations from the January 2026 Consumer Electronics Show (CES). This annual CES Download event has proven to be very popular, as many people working in related industries do not get to attend CES in Las Vegas.

Presenters: Tom Coughlin and Avery Lu

For details, online attendance info, and registration: https://events.vtools.ieee.org/m/536441

Title:
From Idaho to the Moon: Building the Future of Intelligent Robotic Mapping
Date:
March 5th
5:30 PM (1.5 hours)
Location:
Micron Center for Materials Research (MCMR)
Boise, ID
Abstract:

Annika Thomas is a Ph.D. candidate at MIT whose work lies at the intersection of robotics, computer vision, and spatial intelligence. After beginning her academic path in Idaho at Renaissance High School and The College of Idaho, she went on to study mathematics, physics, and engineering through a dual-degree program at Columbia University, then to MIT. Over the course of her studies, she has contributed to astrophysics research, rocket propulsion, and the design and deployment of satellites currently in orbit, and she has worked in field robotics labs around the globe.

Her current research focuses on developing photorealistic, semantically rich, and shareable map representations for autonomous robots using Gaussian Splatting and multi-modal sensor fusion. These structured world models enable multi-agent mapping, loop closure, and planetary-scale localization. Applications range from terrestrial robotic perception to lunar surface mapping for upcoming space missions with NASA.

Her journey illustrates how a STEM career can unfold from small-town beginnings to cutting-edge global research. Alongside her technical work, she is committed to clear and accessible scientific communication, which has led her to share ideas on collaborative robotics for lunar and Martian exploration through TEDx talks and international presentations across four continents. Annika ultimately aims to launch her own lab centered on intelligent mapping and embodied AI while contributing to a more inclusive culture for women in STEM.

The talk is co-hosted by the following organizational units in the IEEE Boise Section:

IEEE Boise Communications Society/Robotics & Automation Society/Signal Processing Joint Chapter
IEEE Boise Computer Society Chapter
IEEE Boise Women In Engineering Affinity Group
IEEE Boise Young Professional Affinity Group
IEEE Boise State University Student Branch

This talk is free and open to the public. Registration is optional but helps us plan the headcount.

Title:
2026 CES Download - Tom Coughlin and Avery Lu
Date:
March 5th
5:30 PM (2.5 hours)
Location:
440 N. Wolfe Road, Suite 71,
Sunnyvale,, CA
Abstract:

Greetings and welcome to our annual IEEE San Francisco Bay Area Consumer Technology Society (CTSoc) event, bringing a comprehensive summary of latest and most innovative technologies unveiled at the 2026 Consumer Electronics Show (CES) in Las Vegas.

CES has long been the world's premier showcase for consumer technology, and its scope continues to expand well beyond traditional consumer electronics across a diverse range of categories—from wearables and smart home ecosystems to autonomous robotics, commercial and recreational drones, cutting-edge medical and healthcare devices, automotive technology, sustainable energy and accessibility innovations, that are reshaping how we live, work, and interact with the world around us.

Please join us as our expert speakers distill the most significant trends and breakthrough technologies from the show.

Speakers:
Tom Coughlin:
President, Coughlin Associates
2024 IEEE President & IEEE Fellow, Tom is a world-renowned digital storage expert and industry analyst. Having served as the global leader of IEEE, he brings unparalleled insight into the hardware and infrastructure driving the latest consumer trends.

Avery Lu: Partner & Head of Business Development, Aventurine Capital Group
2025-2026 Chair of the IEEE Santa Clara Valley Section, Avery is a seasoned venture capitalist and deep-tech executive. His expertise in semiconductors and AI allows him to identify the startups and technologies with the highest potential for commercial success and market disruption.

This will be a hybrid event (in-person and online). Register early, do not miss this event to get a glance into the future of consumer technologies.

In-Person joining locations -
Plug and Play Tech Center, Sunnyvale, San Francisco Room
440 N. Wolfe Road, Suite 71, Sunnyvale, California, United States 94085

Online Webex joining links -
https://ieeemeetings.webex.com/ieeemeetings/j.php?MTID=mc80980714596e97a1dd28469dd72f589
Meeting number:2534 876 5158
Join from a video system or application
Dial 25348765158@ieeemeetings.webex.com
You can also dial 173.243.2.68 and enter your meeting number.
To dial from an IEEE Video Conference System: *1 2534 876 5158
Tap to join from a mobile device (attendees only)
+1-415-655-0002,,25348765158## United States Toll
1-855-282-6330,,25348765158## United States Toll Free

Event Day Logistics
'When guests arrive, please park in the back of the building and enter through the back door. Once inside the building, proceed to the Front Desk. From the Front Desk, walk up the stairs or take the elevators to the 2nd Floor. Once on the 2nd Floor, please follow the signs leading to the San Francisco Room.'

Submit your Questionshttps://form.typeform.com/to/NnBZ2CRN
Title:
SFBAC Officers Training
Date:
March 7th
8:00 AM (6 hours)
Location:
Plug and Play Tech Center
Sunnyvale, CA
Abstract:

PLEASE NOTE THAT THIS IS FOR CHAPTER OFFICERS OF SANTA CLARA VALLEY SECTION, SAN FRANCISCO SECTION AND OAKLAND-EAST BAY SECTION ONLY

Greetings!

This year's officer training is being conducted for officers of San Francisco Bay Area Council at the Plug and Play Tech Center in San Jose, CA. This is meant to provide the Chapter officers with training related to the different aspects of the chapter operations. Below are some of the topics that will be covered in the training:

1. vTools

2. Concur Expense

3. Nextgen banking and reporting

4. Senior member elevation program

5. How to run an effective chapter

6. Web presence

 

 

More detailed agenda will be shared soon along with presenter details.Please register using the link and save the date for the officer training.
Title:
Foundations of Artificial Intelligence and Machine Learning
Date:
March 7th
12:00 PM (0 minute)
Abstract:

Pragathi Prema Kumar will lead this session on the Foundations of Machine Learning and Artificial Intelligence session.  Participants will gain foundational skills and knowledge on how to incorporate ML / AI into computing and computer science projects. 

This is the first of several San Diego IEEE WIE hosted sessions designed to engage participants on the latest innovations and empower them to learn more.

Title:
Electronic Component Art
Date:
March 8th
4:00 PM (1 hour)
Location:
Chan Shun Pavillion
College Place, WA
Abstract:

Learn how to solder by making art with electronic components!

Title:
SRS ABT CODE?
Date:
March 9th
3:04 PM (2 months)
Location:
san bernardino, CA
Abstract:

every mon/thurs we give a breakdown on making a personal project and work on technical prep workshops. 

Title:
Open Source FPGA Projects Roundtable
Date:
March 10th
10:00 AM (1 hour)
Abstract:

Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.  

Title:
San Diego IEEE Electronics Packaging Society (EPS) Meeting - Part 2
Date:
March 10th
5:00 PM (1.5 hours)
Location:
Qualcomm Building S
San Diego, CA
Abstract:

We are organizing part2 of the IEEE San Diego Electronics Packaging Society (EPS) chapter meeting.

Agenda: The following topics would be discussed as follow up from the first meeting in February 2026.

  1. List of IEEE EPS technical and non-technical events
  2. Collaboration with IMAPS
  3. Additional officers beyond the 4 assigned, especially webmaster
  4. Budget feedback from SD section, plan for EPS subsidy

 

Title:
The FPGA: 40 Years of Change
Date:
March 10th
7:00 PM (2 hours)
Location:
925 Thompson Place
Sunnyvale, CA
Abstract:

This is a hybrid in-person and online event. Pre-registration is required for either.

In 1984, the Field Programmable Gate Array (FPGA) was invented at Silicon Valley startup Xilinx by its co-founder Ross Freeman. It was not an obviously good technology as it had serious drawbacks in speed, cost, power, and capacity.  However, its novel design transformed the technology industry as it rode the wave of Moore’s Law. As this transformation was not a straight road, companies that did not recognize fundamental industry changes created by the FPGA fell by the wayside.  If companies did not stretch to find new uses for this technology, or did not deploy its resources in building a new ecosystem, they also failed.

Xilinx’s FPGA invention led to the major industry transformation of the Fabless semiconductor model, and step-by-step Xilinx navigated this field of potential failure. These steps tell of a company growing from a hyper-lean adrenaline-driven startup to a multi-billion-dollar success story. Not every step was correct, and certainly there was some luck.  However, considerable effort was required to achieve that luck, and even more effort to capitalize on it.

In this talk, IEEE Fellow Steve Trimberger will discuss change: the changing value of semiconductor scaling, the changing needs of EDA, the changing barriers to entry, the changing application of the technology, and the changing role of consultants and corporate relationships over the course of many years. These changes got us to 2026 – what change is next?

Please note that an IEEE Milestone for the FPGA will be dedicated on Thu, March 12. Information about attending its dedication online will be available soon.

Title:
IEEE-USA Livestream Webinar: Put Your Retirement Plan to Work
Date:
March 11th
11:00 AM (1 hour)
Abstract:
This webinar will cover the value of your company’s 401(k) plan, including employer matching and the options available when retiring or leaving your organization. We will also review investment choices outside of your 401(k) and conclude with a brief recap of current market conditions. 

 

Title:
A Scalp-EEG Tool for Epilepsy Diagnosis: Getting Patients the Right Answers, Faster
Date:
March 11th
11:30 AM (1 hour)
Abstract:

Every year, over one million people in the U.S. rush to the emergency room after experiencing their first seizure or seizure-like event. For many, the journey that follows is frustrating and uncertain. Epilepsy is notoriously difficult to diagnose - so much so that nearly 30% of patients receive the wrong diagnosis. The most common mistake? Being told they have epilepsy when they do not. These misdiagnosed patients spend months or even years trying ineffective medications, enduring unnecessary side effects, and living with the fear of seizures they don’t actually have only to later discover they have a completely different condition. Why is diagnosing epilepsy so difficult? Unlike other diseases, there has been no reliable biomarker. Our team has identified an EEG-based biomarker for epilepsy, a game-changing discovery that is currently being tested in three major epilepsy centers across the U.S. This new tool, EpiScalp, has the potential to revolutionize epilepsy diagnosis, ensuring patients receive the right answers and the right treatment from their very first visit to a neurologist.

Title:
CHEERS OCEANEERS! March11th, 2026
Date:
March 11th
5:30 PM (3 hours)
Location:
Quantum Brewing
San Diego, CA
Abstract:

CHEERS OCEANEERS! March 11th 2026

Reading the Water: What Environmental DNA Taught Me About Making Decisions in the Dark

Our main presenter this month is Bilgenur Baloğlu, PhD — the scientist who learned to make 
decisions in the dark, then taught others to do the same.

In this presentation, Bilgenur traces her journey from detecting species in Singapore's reservoirs 
using environmental DNA, to co-founding Wild Genomics, to building an executive advisory practice — 
and reveals why the judgment required to run a field experiment and the judgment required to run a 
company are not as different as you'd think. The presentation will cover:

●  Dirty Data, Real Deadlines: What happens when your replicates disagree, your season is ending, 
and you have to decide anyway — and why that's the best training ground for leadership.

●  Building Wild Genomics: How she co-founded an atmospheric eDNA company that reads biodiversity 
from the air itself — hardware, molecular biology, bioinformatics, and all the chaos in between.

●  When the Fog Is Human: What changes when uncertainty stops being biological and starts being 
about people, capital, and governance.

●  The Framework: The structured judgment method she now uses with founders, investors, and senior 
operators who can't afford to wait for clean data — because no one
ever has it.

***

Welcome to the monthly event for the IEEE Oceanic Engineering Society (OES), San Diego Chapter, which is hosting this meeting jointly along with TMA BlueTech (The Maritime Alliance), and MTS (Marine Technology Society).

Please join us for the main presentation and also plenty of time for networking and friendly conversation about everything oceanic, engineering, science, Blue Tech, and more.  No need to be an IEEE or OES member, or TMA, or MTS.  Everyone is invited.

This month, we will be at Quantum Brewing again, a cool science-themed brewery founded by a biochemist.

No ticket required, but please order something for yourself from the brewery.

Please grab a bite from a nearby restaurant, which is okay to bring into the brewery per the owner.

The food and drinks are not being funded by the hosts.  Please open your own tab.

Title:
March 2026 Networking Night - IEEE Orange County Section
Date:
March 11th
6:30 PM (2 hours)
Location:
Sgt. Pepperoni's Pizza Store
Irvine, CA
Abstract:

Join us for delicious pizza from Sgt Pepperoni's Pizza Store and meet other IEEE members in person at our monthly networking event in Irvine! There will be Senior IEEE members who can provide endorsement for members looking for senior membership. Please register with your IEEE #. There will be both meat and vegetarian pizza. If you have any projects, please bring them along!

Group photo - February 2026: https://r6.ieee.org/ocs/2026/02/networking-night-2026-february/

Title:
Projected Field Electromagnets for Controllable Magnetic Field at a Point
Date:
March 11th
6:30 PM (1.5 hours)
Location:
1120 Ringwood Ct.
San Jose, CA
Abstract:

Ian Walker of GMW Associates will review the development of projected-field electromagnets for device testing.

Title:
Give to Gain: Investing in Women to Strengthen Leadership and Innovation
Date:
March 12th
9:00 AM (1 hour)
Abstract:

Celebrate International Women's Day 2026 with our virtual panel "Give to Gain: Investing in Women to Strengthen Leadership and Innovation." This engaging international dialogue brings together leaders from higher education, engineering, and IEEE WIE to explore how investing in women creates stronger leadership pipelines and accelerates innovation in STEM and beyond.

 

Title:
Seattle EMC and AP/ED/MTT Joint Chapter Half-Day Workshop on EMC and Aerospace Measurement Challenges
Date:
March 12th
1:00 PM (4 hours)
Location:
2-122
Seattle, WA
Abstract:

 

TECHNICAL PROGRAM

This program is dedicated to the memory of Omar Zubi, Boeing's longtime EMC Lab Manager, who passed away suddenly on January 31, 2026.

 

EMC Challenges for ‘New Space’ Small Satellite Development

By Russell Carroll, EMI/EMC Consulting Engineer, EMI Sleuth, El Segundo, CA, USA

Abstract: This presentation discusses EMC challenges seen by engineers in the ‘new space’ world of small satellite development. These challenges include non-standardized launch vehicle and host interface requirements, unspecified lightning protection requirements, and schedule constraints on EMC testing and development. Technical challenges include power and signal isolation, crosstalk from long pigtails in wire harnesses, limited physical space for filters and shielding, and large apertures in the vehicle faraday cage.

Speaker Biography: Russell Carroll is a consulting engineer with extensive experience in the analysis, design, and testing of electromagnetic effects on units and systems including space satellites and industrial electronics. His research is focused on developing useful analysis tools and methods for unit and system level EMC analysis. Mr. Carroll is a registered Professional Engineer and an iNARTE certified EMC Engineer. He received the B.S. and M.S. degrees in electrical engineering from the University of Alaska Fairbanks in 2013 and 2014. He may be reached at russell@emisleuth.com.

CISPR and ANSC C63® Overview on Site Validation Measurements from 18 GHz to 40 GHz - Latest Advances in EMC Test Site Evaluation Using Advanced Antenna Measurement Techniques

By Zhong Chen, Chief Engineer, ETS-Lindgren, Cedar Park, Texas, USA

Abstract: This presentation introduces a novel approach for EMC chamber validation beyond 18 GHz, currently under consideration in ANSI C63 and CISPR standards. By integrating Cylindrical Mode Filtered Site Voltage Standing Wave Ratio (CMF SVSWR) with Compressed Sensing (CS), we address inherent challenges in traditional SVSWR methods, such as inconsistency and slow data acquisition. CMF SVSWR utilizes circular path measurements and mode domain post-processing to discern antenna and chamber reflections, crucial for comprehensive VSWR analysis. Compressed Sensing, a data-driven machine learning technique, exploits signal sparsity to reconstruct data from fewer randomly sampled measurement points, thereby reducing test times and eliminating the need for precise turntable positioning.

Speaker Biography: Zhong Chen is Chief Engineer at ETS-Lindgren, located in Cedar Park, Texas. He has more than 25 years of experience in RF testing, anechoic chamber design, as well as EMC antenna and field probe design and measurements. He is an active member of the ANSC C63® committee currently serving as Vice-Chair and is the immediate past Chair of Subcommittee 1 which is responsible for the antenna calibration (ANSI C63.5) and chamber/test site validation standards (ANSI C63.4 and the ANSI C63.25 series). Mr. Chen is chair of the IEEE Standard 1309 committee responsible for developing calibration standards for field probes, and IEEE Standard 1128 for absorber evaluation. He is a former member of the IEEE EMC Society Board of Governors and the Antenna Measurement Techniques Association (AMTA) Board of Directors. He is a past Distinguished Lecturer for the EMC Society and is recognized as an AMTA Fellow. His research interests include measurement uncertainty, time domain measurements for site validation and antenna calibration, and development of novel RF absorber materials. Several papers authored and co-authored by Mr. Chen have received best paper recognition at global conferences. Zhong Chen received his M.S.E.E. degree in Electromagnetics from the Ohio State University at Columbus. He may be reached at zhong.chen@ets-lindgren.com.

EMC Lab Tour and Demo Overview

By Dennis Lewis, Technical Fellow, The Boeing Company, and Zhong Chen, ETS-Lindgren

Abstract: 

We will demonstrate how data post-processing can be used to extract antenna and chamber parameters.

The first demo highlights time-domain techniques for evaluating absorber performance in anechoic chambers. In aerospace EMC testing, measurements are typically performed per MIL-STD 461, which requires only 10 dB attenuation above 250 MHz—allowing chambers to remain relatively reflective and without system-level validation. Using time-gated antenna reflection measurements, we show a practical method to verify and quantify actual chamber performance.

If time permits, we will also demonstrate the Cylindrical Mode Filtered (CMF) technique. This method measures the antenna pattern with an intentional offset (e.g., placing the antenna at the edge of the turntable). The complex S21 versus angle at each frequency is transformed into the spectral domain, where filtering removes chamber contributions mathematically, producing a “clean” antenna pattern even in a nonideal environment. For site validation, standing-wave ripples are obtained by comparing the original chamber pattern to the filtered result. The demo will cover the full measurement workflow, including real-time post-processing. The CMF SVSWR technique is under consideration in the draft ANSI C63.25.3 by ANSC C63 and in CISPR 16 site validation standards for EMC test sites from 18 GHz to 40 GHz.

Title:
IEEE OC Section ExCom Meeting - March 12th 2026, MOVED ON-LINE
Date:
March 12th
6:30 PM (1.8 hours)
Abstract:

IEEE Orange County Section Executive Committee Monthly meeting - occurs every 2nd Thursday of the month. This March is an exception as our IEEE OC Chair was not available on the second Thursday of the month. 

All IEEE OC Committee/Chapter/Affinity/SIG Chair/Key Volunteers (or their proxy) are requested to attend. Other IEEE members are also welcome to attend. Please RVSP here to receive the meeting login information. Routine attendance is required to qualify for your chapter annual IEEE rebate.

To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.

 

  

Title:
Eaton Seattle Satellite Tour
Date:
March 13th
10:30 AM (1.5 hours)
Location:
1604 15th St SW
Auburn, WA
Cost:
Admission fee may apply
Abstract:
Eaton is one of the world's leading manufacturers of electrical distribution equipment, with a presence in over 160 countries. Eaton's Seattle satellite facility is one of 16 nationwide facilities dedicated to producing custom-made equipment for regional customers. The Seattle satellite facility produces panelboards, switchboards, and enclosed circuit breakers. This tour will take attendees onto the shop floor during business hours, where they will have the opportunity to see equipment during production, learn about Eaton's custom solutions, and speak with plant personnel. Note: The tour will take place at an operational manufacturing facility. All attendees are asked to bring hard toe boots and safety glasses. Lunch will be provided after the tour. Please indicate any dietary restrictions during registration. For more info on Eaton: Eaton - About usFor more info on Eaton's Seattle satellite facility: Seattle satellite
Title:
DL - Advanced photonic materials for sustainability
Date:
March 13th
11:00 AM (1 hour)
Location:
Jacobs School of Engineering
La Jolla, CA
Abstract:

In this talk I will provide a comprehensive overview of our research on developing novel materials for photonics while combining experimental and computational tools. First, I will discuss our progress towards discovering new optical emitters for thermophotovoltaics that operate >1,500 oC. Second, I will share how we established a field termed ‘transient photonics’, where we developed optical devices that vanish in water after stable operation. Third, I will present how the alloying of metals can be effectively used to engineer the electromagnetic spectrum, relevant for photo-catalysis. An outlook of potential research directions in photonics with burgeoning materials will be presented.

Title:
Photonics research across borders: opportunities and challenges of globalization
Date:
March 13th
1:30 PM (1 hour)
Location:
Jacobs School of Engineering
La Jolla, CA
Abstract:

The unavoidable globalization of our society is currently also echoed in research. In this talk, I will provide my perspective of working in four countries (three continents) while performing research in both academia and national laboratories and collaborating with industries. I will present suggestions on how to (i) quickly adjust to different working cultures, (ii) navigate language barriers to effectively communicate, and (iii) foster knowledge when exchanging ideas while pondering the ascending interdependence of countries. Junior investigators in photonics are living in exciting times to advance innovation and can excel upon adjusting themselves to the current, global landscape in research.

Title:
IEEE Foothill YP & Members: Pi Day Pizza & Networking Mixer
Date:
March 14th
12:00 PM (2 hours)
Location:
1 N Indian Hill Blvd
Claremont, CA
Abstract:

 

Join the IEEE Foothill Section for a casual "Pi Day" Pizza & Mixer in Claremont!

Since it’s March 14th (3.14), we are celebrating the best way engineers know how—with circular food and great conversation. This event is all about direct connection, bringing together Students, Young Professionals (YP), and Section Members for a lunch of informal networking and community building.

There is no formal agenda or presentation—just a space for our local engineering community to meet face-to-face and celebrate Pi Day together.

What to bring/expect:

  • Networking: Shake hands and meet the people driving technology in the Foothill area.

  • Career Growth: Bring your resume or digital contact info if you're looking for feedback or new opportunities.

  • Advice: Students and recent grads are encouraged to come and ask seasoned professionals for career insights.

  • Community: Find out how to get more involved with the IEEE Foothill Section.

 

Please RSVP by registering so we can get an accurate headcount for the space. We look forward to seeing you there!

Title:
IEEE MOVE USA - 10th Anniversary Townhall
Date:
March 17th
6:30 AM (1.5 hours)
Abstract:

Come join us for MOVE’s 10th Anniversary Town Hall Meeting—a special opportunity to celebrate a decade of impact and hear from leaders shaping the future of MOVE.

Featured speakers include:

  • Mary Ellen Randall, MOVE Founder & IEEE President

  • Barry Tilton, IEEE-USA President

  • Brad Kieserman, Vice President, Disaster Operations & Logistics, American Red Cross National Headquarters

  • MOVE Global and Local Leads: Francisco Carrero, Loretta Arellano, and Sadhana Attavar, highlighting key achievements from 2025 and what’s ahead in 2026

Learn more about MOVE’s 10-year journey, upcoming milestones, and the celebrations planned throughout the anniversary year. We hope you’ll join us for this engaging and informative event.

Title:
Open Source FPGA Projects Roundtable
Date:
March 17th
10:00 AM (1 hour)
Abstract:

Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.  

Title:
Agentic AI in Enterprises: From Fundamentals to Production Implementation
Date:
March 17th
5:30 PM (1.2 hours)
Abstract:

Abstract: Agentic AI is rapidly transforming enterprises from reactive chatbot deployments to autonomous, goal-driven systems capable of reasoning, planning, and acting across complex business workflows. In this technical talk, Agentic AI in Enterprises: From Fundamentals to Production Implementation, we move from first principles—agent architectures spanning perception, memory, reasoning, and action; Chain-of-Thought and advanced reasoning patterns such as ReAct and reflection; Retrieval-Augmented Generation (RAG); tool use; and memory hierarchies to real-world production systems delivering measurable ROI. Through three detailed end-to-end case studies in e-commerce customer support, healthcare prior authorization, and autonomous procurement, attendees will see complete workflow breakdowns illustrating how agents integrate with enterprise systems, apply multi-step reasoning, manage long-running context, and operate securely at scale. We will also confront the hard problems: hallucination, prompt injection, observability for non-deterministic systems, governance, cost control, and build-vs-buy strategy. Designed for engineering leaders, AI practitioners, architects, and technical executives, this session connects foundational concepts with real-world operational considerations, providing practical architectural patterns, evaluation frameworks, and implementation guidance to help organizations deploy agentic AI systems that are reliable, secure, and scalable in production environments.

Title:
IEEE Richland Section Ex-Com Meeting Mar 17 2026
Date:
March 17th
5:45 PM (1.2 hours)
Location:
1435 George Washington Way
Richland, WA
Abstract:

Scheduling IEEE Richland EX-COM Meeting for 2026

Location: Round Table Pizza, 1435 George Washington Way, Richland, WA 99352

Food and social gathering at 5:45 PM, business meeting at 6:00 PM

Date(s) – Feb 17, Mar 17, Apr 21, May 19, June 16, July 21, Aug 18, Sept 15, Oct 20, Nov 17, and Dec 15

________________________________________________________________________________

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Join the meeting now

Meeting ID: 243 106 218 013 08

Passcode: Xe2Zg9bj

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+1 509-408-1681,,938429775# United States, Liberty Lake

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Title:
Micromachined fluidic devices - accessing the 3rd dimension for new capabilities
Date:
March 18th
1:00 PM (1 hour)
Location:
Scrugham Engineering & Mines (SEM)
Reno, NV
Abstract:

This presentation will also address pathways for utilizing micromachined fluidic devices

Title:
Making Room for Batteries in Japan: The Need for Regulatory Evolution
Date:
March 18th
4:00 PM (1 hour)
Abstract:

The large-scale deployment of battery energy storage systems (BESS) is technically essential for enabling renewable energy to function as a primary power source in modern power systems. However, implementation has progressed more slowly than required, largely due to limited economic viability under current market mechanisms. From a system engineering perspective, storage plays a critical role in maintaining frequency stability, balancing supply and demand, mitigating variability, and enhancing overall system resilience. As renewable penetration increases and system inertia declines, the need for fast-response resources such as BESS becomes increasingly urgent, including from an energy security standpoint.

This presentation provides an overview of the current situation in Japan, including market and operational frameworks relevant to storage deployment. It further examines recent technical challenges associated with high renewable penetration—such as frequency control, reserve management, and system stability—and discusses emerging operational strategies and technological trends in storage integration and grid support functions.

Title:
Eastern Idaho Section ExCom
Date:
March 18th
4:30 PM (1.5 hours)
Abstract:

Bi-Monthly ExCom Meeting held on the third Wednesday of every odd month. 

Title:
Chapter Open House and talk on AI Infrastructure
Date:
March 18th
4:45 PM (1.2 hours)
Location:
Dr. Martin Luther King, Jr. Library (SJSU)
San Jose, CA
Abstract:

Join us for a talk on how SmartNICs and RDMA Power AI in the Cloud, and get insights into the state of the Chapter.

Training modern Large Language Models (LLMs) requires tens of thousands of GPUs acting as a single "AI Supercomputer." To build this "AI Hypercomputer," we must first address the CPU bottlenecks of traditional general-purpose networking. This talk begins by analyzing why standard TCP/IP processing limits Model Training performance and introduces the concept of "Kernel Bypass" and the role of SmartNICs in offloading network processing from the host CPU. We will explore why modern AI clusters have moved toward hardware offloads (like RDMA) to achieve the high throughput and low latency required for GPU-to-GPU communication. We will also discuss the specific challenges of running lossless transport protocols over lossy Ethernet, where congestion and packet drops can cause severe performance degradation ("tail latency") in large-scale training jobs. The session concludes by analyzing the architectural design patterns required to optimize flow control and ensure reliable delivery in massive AI infrastructure environments.

This event features a leading industry expert from Google addressing this important topic, followed by updates on the state of our chapter from the IEEE CIS SCV Chair.

🎤 Talk 1
The Infrastructure of AI: How SmartNICs and RDMA Power the Cloud
Speaker:
Sujithra Periasamy, Google

🎤 Talk 2
State of the Chapter
Speaker: Dr. Vishnu S. Pendyala, Chair, IEEE CIS Santa Clara Valley Chapter

Title:
2026 Monthly San Diego IEEE EXCOM - March Meeting
Date:
March 18th
5:30 PM (2.5 hours)
Location:
ATEC
San Diego, CA
Abstract:

 SDIEEE EXCOM Meeting

Executive Committee meeting to discuss all San Diego IEEE activities.  All IEEE members welcome to attend. Please RSVP. 

  • 5:30 pm - 6:00 pm,    Networking and food!
  • 6:00 pm - 8:00 pm,    meeting (in person and/or remote) 

To add to the agenda, please email upalmahbub@yahoo.com.   

 

Title:
Birds of a Feather: Our Favorite DIY Projects
Date:
March 18th
9:30 PM (2 hours)
Location:
Zippy's Vineyard
Honolulu, HI
Abstract:

Our Favorite DIY Projects

Our Birds of a Feather (BOF) meetings are about sharing.
Come and share (tell us about) your favorite hand-built project.

What makes it special?

Should our young engineers (or students) build it too?

Are there "simple" and inexpensive projects that really show off (visualize or experience) an engineering concept?
So much of modern technology is invisible. Miniaturized into invisibility. 
Are there projects that bring concepts back into view?

Are there projects we should bring to the young engineers?

 

 

This meeting is a no-host event. Come and share a drink or a meal together.

 

Title:
Silicon Metasurfaces for DNA Synthesis
Date:
March 19th
11:30 AM (1.7 hours)
Location:
==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road
Sunnyvale, California, CA
Abstract:
Silicon Metasurfaces for DNA Synthesis

 

Abstract:

Ready access to long, accurate, and diverse synthetic DNA is essential for the rapid growth of synthetic biology — a field that genetically programs living cells with new functions. Modern microarray-based DNA synthesizers can generate diverse pools of oligonucleotide (single stranded DNA) sequences in parallel. However, each sequence is produced in limited quantity, and their yields decline with increasing oligo length due to cumulative synthesis errors. These limitations complicate downstream sequence segregation and gene assembly. Attempts to address these challenges by enlarging and spacing synthesis sites farther apart reduce the total number of sequences that can be generated simultaneously, thereby compromising synthesis diversity.

 

In this talk, I will introduce B-MOS (Metasurface Oligonucleotide Synthesizer for Engineered Biology) — a novel platform that integrates silicon nanophotonics with solid-phase DNA synthesis to overcome these challenges. B-MOS employs dielectric metasurfaces composed of arrays of high-index and low loss silicon nanoantennas (metasurfaces) patterned on glass as optically programmable synthesis sites. The unique optical signature of each metasurface — its spectral and polarization response — is lithographically encoded into the geometry and orientation of the silicon nanoantennas. Under global illumination, only the metasurface tuned to the wavelength and polarization of the laser absorbs the optical energy and transduces it into highly localized heat to site-selectively activate the synthesis reactions. Tuning the laser enables switching between the synthesis sites without moving parts or complex optical projection systems that lead to alignment errors.

 

As these nanostructures support sharp (high-Q) optical resonances, crosstalk between the synthesis sites is minimized. These sharp resonances allow the dense spectral packing of independently addressable synthesis within the tunable range of the laser, thereby maximizing synthesis diversity.

 

Using temperature as a programmable biochemical control knob, I will demonstrate site-selective enzymatic incorporation of fluorescent nucleotides onto surface-bound DNA using the enzyme terminal deoxynucleotidyl transferase. I will further discuss how integrating B-MOS with microfluidics can enable post-synthesis site-selective amplification and spatial segregation of oligo strands for reliable gene assembly.

 

Finally, I will outline how B-MOS can be extended to RNA and peptide synthesis as well as other enzyme-driven processes. By resonant nanophotonics with programmable biochemical control, B-MOS establishes a scalable physical foundation for high-precision biomolecular manufacturing and next-generation molecular technologies.

 

Speaker:Dr. Punnag PadhyPostdoctoral ScholarDepartment of Materials Science and EngineeringStanford University AGENDA:

Thursday March 19, 2026

11:30 AM: Networking, Pizza & Drinks

Noon -- 1 pm: Seminar

Please register on Eventbrite before 9:30 AM on Thursday March 19, 2026

IEEE members  non IEEE members

(discounts for unemployed and students )

Title:
IEEE PES Lecture: Power Electronics Modernizing the Power Grid
Date:
March 19th
5:00 PM (1.2 hours)
Abstract:


The present power grid faces increasing challenges arising from congestion and blackouts associated with high penetration of distributed energy resources (DERs) and growing demand, compounded by lagging infrastructure upgrades. This presentation discusses how advanced power electronics is modernizing existing transmission and distribution networks. It further highlights the development of universal One-Cycle Control–based power electronic systems for rapid and precise control of grid operations, with objectives including the enhancement of power quality, provision of reactive power support, and mitigation of congestion. Case studies demonstrate that these approaches enhance system resilience, operational flexibility, and overall efficiency, thereby supporting sustainable long-term growth.

About the Speaker:

Keyue Ma Smedley, Keyue Smedley, IEEE Fellow, received her BS in EE from Zhejiang University and her MS and Ph.D. in EE from Caltech. Dr. Smedley was the chief designer of magnet power converters for all accelerator rings at DOE Superconducting Super Collider Lab in early 1990s. She is currently a Professor in EECS, University of California, Irvine (UCI) and Founder/Director of the UCI Power Electronics Lab since 1992.  In addition, she is a co-founder of One-Cycle Control, Inc., that commercializes OCC technology. Dr. Smedley’s research is in power electronics. She is the inventor of the One-Cycle Control (OCC) method. Initially groundbreaking in high-fidelity audio applications during 1990s, OCC later unified four-quadrant control of single and three-phase power converters in the early 2000s. Today, OCC technology is widely applied across various market sectors, including professional audio, renewables, storage, power quality, grid stabilization, and defense. Dr. Smedley’s team also invented the Hexagram multilevel converter in the late 2000s, deployed and tested the first fault current limiter on the U.S. grid in the 2010s, and demonstrated OCC-DVC technology for fast and precise grid control during the same period. More recently, her team has achieved breakthroughs in full-range gain control of resonant switched-capacitor converters, opening the door to magnetic-less power conversion and enabling significant reductions in the size and weight of power electronic converters. Dr. Smedley is dedicated to innovation and impact. Her research has yielded >200 publications, >15 US and international patents, two startup companies, and wide industry acceptance. She has received numerous recognitions, including UCI Innovation Award in 2005, IEEE Fellow in 2008, and a DOD Achievement Award in Pentagon 2010 with OCC, Inc. She was an IEEE PEL Distinguished Lecturer in 2021-2024. Dr. Smedley won 2024 IEEE Power Electronics Society RD Middlebrook Achievement Award.

Title:
Understanding Tier 4 Emissions for Generator Sets
Date:
March 19th
5:30 PM (3 hours)
Location:
Zio Fraedo's
Pleasant Hill, CA
Cost:
Admission fee may apply
Abstract:

Stationary generator sets operated in regions governed by a local environmental review board may be subject to strict emissions regulations. Many of these areas, known as non-attainment zones, have enacted clean air requirements that adhere to the EPA’s Tier 4 standard, effective in 2015. For these stringent applications, Cummins provides Tier 4 gensets that reduce the exhaust constituents to the industry’s lowest emissions standard. This presentation will offer insights on how to design a reliable system that meets local and national code requirements.

Title:
LTSpice : Legacy Relic or IC Designer's Secret Weapon
Date:
March 23rd
7:00 PM (1 hour)
Abstract:

The Story of the Last Survivor

In the "Wild West" days of Silicon Valley, IC design was a frontier defined by PhD-level experimentation. Every major player took the foundational SPICE code from Berkeley, optimized it, and branched off. While those early simulators formed the foundation of the current EDA industry, nearly every one of them has long since vanished and remain only on backup tapes somewhere in the basements of Silicon Valley.


Except for one - LTSpice


Through a stroke of marketing genius, Linear Technology turned their internal high-performance SPICE engine into a gift for the masses. By bundling it with their entire product library and giving it away for free, LTSpice became the most widely used circuit simulator on the planet. Yet, in a strange twist of irony, it is now least used in the very field for which it was originally built - Integrated Circuit (IC) design.

Today's IC designers have access to the most advanced simulators in the world, but only when they are assigned to a projects with the budgets to pay for a limited number of licenses often more expensive than their annual salaries, and only authorized to use those licenses for the project at hand.


Join us for this seminar as we strip away the "hobbyist" label and show you how to leverage LTSpice as a professional IC designer.

We spend millions on EDA tools to verify our designs. Use LTSpice to invent them.

 

Title:
Open Source FPGA Projects Roundtable
Date:
March 24th
10:00 AM (1 hour)
Abstract:

Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.  

Title:
Wearable Sensors and Artificial Intelligence Algorithms for Monitoring Chronic and Infectious Diseases
Date:
March 25th
11:00 AM (1 hour)
Abstract:

The majority of the health care costs related to the treatment of chronic and infectious diseases are attributed to direct care costs (e.g., hospital admissions and readmissions). The prevalence of chronic diseases and associated costs in the United States is growing at an alarming pace. The COVID-19 pandemic has further impacted the health of high-risk individuals by increasing the likelihood of more severe illness for those with underlying health conditions and associated healthcare costs. There have been ample efforts from researchers and clinicians to develop remote healthcare systems and wearable devices to manage patients with chronic and infectious diseases in home settings, which has reduced the burden on inpatient care facilities and gained further momentum during the COVID-19 pandemic. Yet, there is a lack of reliable wearable devices that can provide clinically acceptable information to healthcare professionals, as well as a lack of emphasis on validating wearable and artificial intelligence technologies in representative populations to enable a reliable and equitable remote health management system. This talk will present the challenges and potential solutions for developing tools (i.e., wearable sensors and computational algorithms) for reliable and equitable remote patient monitoring systems for chronic and infectious diseases.

Title:
IEEE OC PES Chapter Planning Meeting - March 25th 2026
Date:
March 25th
12:00 PM (1 hour)
Location:
Applied Innovation Building
Irvine, CA
Abstract:

This is an in-person planning meeting for PES ExCom 

  

Title:
Co-Packaged Optics: Heterogeneous Integration of Chiplets in Switches, Photonic ICs and Electronic ICs
Date:
March 26th
12:00 PM (1 hour)
Location:
SEMI Headquarters
Milpitas, CA
Abstract:

Come join us for lunch, and this important talk - IN-PERSON ONLY

Co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) such as the photodiode laser, etc. and the electrical engine (EE) which consists of the electronic ICs (EIC) such as the laser driver, transimpedance amplifier, etc. as well as the switch ASIC (application specific IC). The advantages of CPO are: (a) to reduce the length of the electrical interface between the OE/EE (or PIC/EIC) and the ASIC, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. In the next few years, we will see more implementations of a higher level of heterogeneous integration of switch, PIC and EIC, whether it is for performance, form factor, power consumption or cost. The content of this lecture:
— Silicon Photonics
— Data Centers
— Optical Transceivers
— Optical Engine (OE) and Electrical Engine (EE)
— OBO (on-board optics)
— NPO (near-board optics)
— CPO (co-packaged optics)
— 3D Integration of the PIC and EIC
— 3D Heterogeneous Integration of PIC and EIC
— 3D Heterogeneous Integration of ASIC Switch, PIC and EIC
— 3D Heterogeneous Integration of ASIC Switch, PIC and EIC with Bridges
— 3D Heterogeneous Integration of ASIC Switch, EIC and PIC embedded in Glass-core Substrate
— Various Forms of CPO

Title:
IEEE PES Lecture: Key Components in Power System Protection & Automation and Introduction of LV MCC
Date:
March 26th
5:00 PM (1.2 hours)
Abstract:


This presentation provides a practical, engineering-level overview of the key components that form the backbone of modern power system protection and substation automation in a 138 kV transmission environment.

The session begins by examining the role of protective relays (IEDs) in detecting faults, executing high-speed tripping logic, and ensuring selective fault isolation. It then explores how RTUs and station gateways interface field devices with SCADA systems, enabling real-time monitoring, control, and event analysis from remote control centers.

This session also introduces the fundamentals of Low Voltage Motor Control Centers (LV MCCs) used in industrial plants, utilities, and infrastructure facilities.

 

 

 

 

Bio: Megha is a Protection & Substation Automation Engineer with expertise in transmission-level substations, including 138 kV protection systems and digital substation architectures. Specializing in relay engineering, GOOSE-based interlocking, SCADA integration, and Ethernet network design compliant with IEC 61850, she focuses on designing reliable, redundant, and high-performance protection schemes. Megha has contributed to projects involving distance protection, busbar differential schemes, breaker failure logic, and substation automation system (SAS) implementation. She is passionate about bridging practical engineering with modern digital protection technologies.

Title:
IEEE SSCS Oregon Chapter March Meeting and Seminar (Hybrid)
Date:
March 27th
11:00 AM (1 hour)
Location:
Jones Farm Conference Center
Hillsboro
Abstract:

IEEE SSCS Oregon Chapter November Meeting and Seminar

Join us for a talk from SSCS Distinguished Lecturer Prof. Vanessa Chen from Carnegie Mellon University on Friday, March 27th, 2026. The seminar will be held from 11:00am to 12:00pm (PST) via a Hybrid format. Please register for the meeting link and information.

 

Topic:

 AI-Enhanced RF/Mixed-Signal Circuits for Reliable Operations

 

Abstract:

AI-driven design and optimization are revolutionizing RF and mixed-signal circuits for operation in extreme environments, including high radiation and wide temperature ranges. This talk explores the use of reinforcement learning (RL) and generative models to improve circuit robustness and adaptability. RL-based self-healing techniques leverage embedded electromagnetic sensors for real-time monitoring and dynamic fault recovery, while generative models accelerate design space exploration, enabling resilient and efficient circuit topologies. The presentation will highlight AI-enhanced designs such as adaptive power amplifiers, PMICs, and multispectral sensors that enhance performance and reliability in harsh environments.

 

Speaker Biography:

Vanessa Chen received her Ph.D. in Electrical and Computer Engineering from Carnegie Mellon University in 2013, where she worked on energy-efficient, ultra-high-speed ADCs with real-time calibration and interned at IBM T. J. Watson Research Center. She previously held circuit design roles at Qualcomm in San Diego and Realtek in Taiwan, focusing on self-healing RF and mixed-signal circuits. Her research explores AI-enhanced circuits and systems, including intelligent sensory interfaces, RF/mixed-signal hardware security, and ubiquitous sensing and computing. Dr. Chen is a recipient of the NSF CAREER Award, the CMU College of Engineering Dean’s Early Career Fellowship, Apple NSI Faculty Fellow, and the IBM PhD Fellowship. She has served on program committees for ISSCC, VLSI Symposium, CICC, A-SSCC, and DAC, as an Associate Editor for several IEEE journals, and is currently an IEEE SSCS Distinguished Lecturer for 2025–2026.

Title:
Designing Your Early Career: LinkedIn, Resume & Interview Strategy That Works
Date:
March 27th
6:00 PM (0 minute)
Abstract:
Designing Your Early Career: LinkedIn, Resume & Interview Strategy That Works

Breaking into today’s competitive job market requires more than technical excellence. It requires clarity, positioning, and the ability to communicate your value with confidence.

In this practical and engaging session, career strategist Shima Ghaheri shares how hiring managers actually evaluate candidates — and how students and early-career professionals can strategically present their academic work, projects, internships, and experiences to stand out.

Participants will learn how to:

  • Build a LinkedIn profile that signals clarity and direction

  • Structure resumes around measurable impact rather than task lists

  • Approach interviews with preparation and strategic storytelling

  • Translate technical competence into compelling professional narratives

Designed specifically for college students and entry-level professionals, this session offers actionable tools to move from being “qualified on paper” to being selected with confidence. By making hiring systems more transparent, the session aims to reduce opportunity gaps and empower participants to compete through preparation, clarity, and strategy.

Whether you are preparing for internships, full-time roles, or your next career move, this session will equip you with frameworks you can implement immediately.

Title:
Leadership Hike
Date:
March 28th
12:00 PM (4 hours)
Location:
24241 CA-238
Hayward, CA
Abstract:

Hike at Green Belt Trail with Leadership Workshop, followed by lunch provided at Buffalo Bils.

Title:
2026 IEEE Utah Section Recognition Dinner
Date:
March 28th
5:00 PM (2.5 hours)
Location:
250 W 2100 S Expy
Salt Lake City, UT
Cost:
Admission fee may apply
Abstract:

IEEE Utah Section Recognition Dinner on Saturday, 28 March 2026, at the Bhansa Ghar (bhansagharut.com) in SLC at 6:00 PM.

The attendee will select his/her dinner (entree, non-alcoholic beverage, dessert) at the event Bhansa Ghar - Salt Lake City, UT - Menu (bhansagharut.com).

Title:
EMBS OC Meet, Greet & 2026 Season Launch
Date:
March 30th
4:00 PM (3 hours)
Location:
100
Irvine, CA
Abstract:

At our EMBS Orange County Kickoff Session and Social Mixer, Chair Gora Dutta will explore the rapidly expanding global digital health landscape and the career pathways emerging across this high-impact sector. As healthcare systems adopt AI-enabled tools, interoperable standards such as HL7, and scalable digital infrastructure, demand is growing for professionals in clinical informatics, health data engineering, cybersecurity, implementation science, product innovation, and public health analytics. This session will provide insight into the skills, research directions, and cross-sector opportunities shaping the future workforce—helping attendees position themselves for meaningful, future-ready careers in digital health.

Warm regards,
Pradyumna Kodgi
Vice Chair, IEEE Engineering in Medicine & Biology Society (EMBS) – Orange County
Senior Member, IEEE

Title:
Open Source FPGA Projects Roundtable
Date:
March 31st
10:00 AM (1 hour)
Abstract:

Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.  

Title:
Northwest Energy Systems Symposium (NWESS) 2026 - Powering Progress "Navigating a Transforming Utility Landscape"
Date:
April 1st
7:30 AM (2 days)
Location:
1315 NE Campus Parkway
Seattle, WA
Cost:
Admission fee may apply
Abstract:

The theme of the NWESS 2026 conference is Powering Progress “Navigating a Transforming Utility Landscape”. 

NWESS 2026 is a 2 day symposium that focuses on a wide range of topics and provides information on how to best address some of the most pressing energy issues facing our region.

The symposium is an industry driven conference; the topics are suggested and voted on by the Industry. The symposium is a combination of presentations and discussions.

Key Note Speakers to open the conference 

  • Michel Vargo, Puget Sound Energy

Topics to be presented at NWESS 2026 include:

  • Risk Based Management (wildfire mitigation)
  • Seismic Transformer Study
  • Transformer Loading
  • AI for Power Utilities by NVIDIA & NEETRAC
  • Preparing for Middle Housing and EPRI Tool for Secondary Design
  • Load Seer - Top Down and Bottom Up and how you plan for electrification and climate change
  • Data Center Load Growth -The Opportunity, The Risk and the Reality
  • Integrated Load Planning Study
  • EPRI E-Roadmap Tool / NEVI
  • The Grid Center for Reliable Electricity Delivery (GridCRED)

NWESS  is sponsored by the electric energy industry in the Pacific Northwest, the IEEE and the Electrical Energy program at the University of Washington.

University of Washington, Dept. of Electrical & Computer Engineering

Pacific Northwest National Laboratory

Bonneville Power Administration

Electric Power Systems Inc

Snohomish County PUD

Puget Sound Energy

Seattle City Light

Peninsula Light

Tacoma Power

Title:
Augmented Intelligence for End-to-End Design
Date:
April 1st
5:30 PM (2 hours)
Location:
Building 5
san jose, CA
Abstract:

Chiplet and disaggregated architectures are rapidly becoming mainstream across applications from edge to server. Yet the resulting design complexity exceeds the capabilities of today’s tools, flows, and methodologies—particularly when aiming for highly optimized solutions at scale.

Augmented Intelligence, the combination of human expertise and machine intelligence, offers a transformative approach to this challenge. By assigning strategic, high-level decision-making to engineers and delegating computationally intensive, iterative tasks to AI, this framework enables multi-level and multi-domain optimization. The result is the ability to generate a far greater number of custom-optimized designs with the same resources—delivering competitive products with higher quality and faster time-to-market.

At Intel, in collaboration with partners, we have developed and deployed Augmented Intelligence solutions spanning silicon to system design and hardware to software design. These efforts have demonstrated efficiency gains exceeding 90% in critical areas. In this talk, I will share practical examples and key insights from several years of applying Augmented Intelligence to end-to-end design, highlighting how human–AI collaboration is reshaping the path to innovation.

 

There will not be any recording.  Please attend in person.

Title:
IEEE OC PES/IAS Chapter ExCom Meeting - April 1st 2026, MOVED ON-LINE
Date:
April 1st
6:00 PM (0 minute)
Abstract:

IEEE Orange County PES/IAS Chapter's ExCom meeting

All IEEE OC PES/IAS Chapter members are requested to attend this meeting. 

To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.

 

The zoom link is given below: 

Topic: IEEE OC PES/IAS ExCom Meeting
Time: Apr 1, 2026 06:00 PM Pacific Time (US and Canada)
Join Zoom Meeting
https://tae.zoom.us/j/82735823597?pwd=k4j82miSJVCFkVXMsqQBqonFgxGmpb.1

 

Meeting ID: 827 3582 3597
Passcode: 729665

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
April 1st
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
AMA (Ask me Anything) with MIT-Press-Machine-Learning-Books-Author, Prof. Ethem Alpaydın
Date:
April 2nd
10:00 AM (1.9 hours)
Abstract:

Synopsis:
Please feel free to check out the work and thoughts of Prof. Ethem Alpaydın, Ph.D., https://mitpress.mit.edu/author/ethem-alpaydn-10375/ on Google Scholar at https://scholar.google.com/citations?user=lXYKgiYAAAAJ&hl=tr and generally on the Internet.

Then, please feel free to submit your questions to Prof. Ethem Alpaydın

  • via Twitter by using the hashtag #ProfAlpaydinAMA and tagging @vishnupendyala
  • emailing vspendyala(at)hotmail(dot)com with #ProfAlpaydinAMA in the subject

Selected questions will be answered by Prof. Alpaydin during the session. The audience may be able to ask follow-up questions during the session, using the Chat feature.

By registering for this event, you agree that IEEE and the organizers are not liable to you for any loss, damage, injury, or any incidental, indirect, special, consequential, or economic loss or damage (including loss of opportunity, exemplary or punitive damages). The event will be recorded and will be made available for public viewing.

Title:
Technology Roadmapping
Date:
April 2nd
6:00 PM (1 hour)
Abstract:

Technology roadmapping is a comprehensive approach for strategic planning that integrates scientific and technological considerations into product development and business strategy. It provides a structured way to identify new opportunities and align innovations with organizational goals.

Roadmaps can take many forms, but they all share a common feature: the use of simple graphical frameworks to support the synthesis, alignment, and communication of complex strategic issues.

Title:
IEEE at UCSD Spring GBM
Date:
April 2nd
6:00 PM (2 hours)
Location:
La Jolla, CA
Abstract:
IEEE at UCSD will be hosting their final GBM of the year where members can learn about the many wonders IEEE has along with the opportunities our student branch can provide. We will be sharing opportunities for the upcoming quarter along with the following academic year. 
Title:
BSides San Diego - RadioFrequency Village
Date:
April 4th
10:00 AM (7 hours)
Location:
Student Union
San Diego, CA
Abstract:

Join computer, radio, and cybersecurity enthusiasts at BSides San Diego.

The Open Source Digital Radio Local Group (San Diego Section) will be in RF Village answering your questions about using and enjoying the radio frequency spectrum. 

Tickets available at https://www.bsidessd.org

Schedule here: https://www.bsidessd.org/2026-event-details/schedule

 

Title:
IEEE Phoenix Section Annual Banquet
Date:
April 4th
6:00 PM (3 hours)
Location:
2400 Biltmore Estates
Phoenix, AZ
Cost:
Admission fee may apply
Abstract:
Hi All, We invite all IEEE Phoenix Chapter members to the Annual Banquet, scheduled for Sunday, April 11. Save the date for IEEE awards and banquet by registering using the link. Location: BiltmoreTime: Doors open at 6 pm.Price: 
  • IEEE Member: 40$
  • IEEE Member's Guest: 40$
  • IEEE Student Member: 20$
  • IEEE Student Member's Guest: 20$
  • IEEE Non Member: 80$
This is a unique opportunity to network with all our members while enjoying great food, drinks and entertainment.

Regards,Phoenix Opcom
Title:
Spring Speaker Series Start
Date:
April 6th
5:00 PM (2 days)
Location:
Stanford, CA
Abstract:

Continuation of Stanford IEEE Speaker Series

Title:
DC Transmission Grids - Topology, Components, Modelling, Control and Protection Challenges
Date:
April 8th
5:30 PM (1.8 hours)
Location:
1825 Schweitzer Drive
Pullman, WA
Abstract:

High Voltage DC Transmission has seen rapid technology advances in the last 20 years driven by the implementation of VSC (Voltage Source Converters) at GW powers and in particular introduction of MMC (Modular Multilevel Converters). The development of interconnected DC transmission grids requires significant further advance from the existing point-to-point HVDC links. It is widely believed that complex DC power grids can be built with comparable performance, reliability, flexibility and losses as traditional AC grids. The primary motivation for DC grid development is the need for power flow and trading between many DC terminals, as an example in the proposed (350 GW) North Sea DC grid, or EU-wide overlay DC grid. AC transmission is not feasible with long subsea cables, and it is inferior to DC systems in many other conditions. This presentation addresses the options and challenges with DC grid development, referring also to state-of-art technology status.

Zhangbei 4-terminal DC system (China, 2020) represents the first implemented GW-scale meshed DC transmission grid, which employs bipolar ring topology with overhead lines and 16 DC Circuit Breakers. However, multiple studies illustrate advantages of some radial, hub-based or segmented topologies, because of component costs, and challenges with interoperability, ownership, DC markets, operation, security and reliability.   

MMC concepts, including half-bridge and full-bridge modules, will underpin DC grid converters and further advances like hybrid LCC/MMC converters have been implemented recently. DC/DC converters at hundreds of MW are not yet commercially available but there is lot of research world-wide, and some lower-power prototypes have been demonstrated. DC/DC converters may take multiple functions including: DC voltage stepping (transformer role), DC fault interruption (DC CB role) and power flow control. Multiport DC hubs can be viewed as electronic DC substations, capable of interconnecting multiple DC lines.

Very fast DC CB circuit breakers (2 ms) have become commercially available recently, but the cost is considerably higher than AC CBs. Slightly slower mechanical DC CBs (5-8 ms) are also available from multiple vendors, while new technical solutions are emerging worldwide for achieving faster operation with lower size/weight/costs. 

DC grid modelling will face the new challenge of numerous converters dynamically coupled through low-impedance DC cables/lines. A compromise between simulation speed and accuracy is required, leading to some average-value modelling, commonly in rotating DQ frame, but capturing very fast dynamics and variable structure to represent fault conditions.

The principles of control of DC grids have been developed. DC systems have no system-wide common frequency to indicate power unbalance, and voltage responds to local and global loading rather than reactive power flow. DC grid dynamics are 2 orders of magnitude faster than traditional AC systems and most components will be controllable implying numerous, fast control loop interactions. Because of lack of inertia, and minimal overload capability for semiconductors, DC grid primary and secondary control should be feedback-based (man-made), fast, and distributed. International standardization efforts have begun.

The protection of DC grids is a significant technical challenge, both in terms of components and protection logic. The selectivity has been demonstrated within 0.5 ms timeframe using commercial and open-source DC relays. Nevertheless, grid operators have expressed concerns with self-protection on various components, back-up grid-wide protection, interoperability, and in general if we can achieve power transfer security levels comparable with AC grids and acceptable to stakeholders.

Title:
Using Architectural Simulation to Investigate Chiplets for Scalable and Cost Effective HPC Beyond Exascale
Date:
April 10th
12:00 PM (1 hour)
Abstract:

Chiplets have become a compelling approach to scaling and heterogeneous integration e.g. integrating workload-specific processors and massive bandwidth memory systems into computing systems; integrating die from multiple function-optimized process nodes into one product; integrating silicon from multiple businesses into one product. Chiplet-based products have been produced in high volume by multiple companies using proprietary chiplet ecosystems. Recently, the community has proposed several new standards (e.g., UCIe) to facilitate integration and interoperability of any compliant chiplet. Hyperscalers (e.g., Google, Amazon) are actively designing high volume products with chiplets through these open interfaces. Other communities are exploring the end-to-end workflow and tooling to assemble chiplet-based products. High performance computing can benefit from this trend. However, the performance, power, and thermal requirements unique to HPC, present many challenges to realizing a vision for affordable, modular HPC using this new approach. Architectural modeling and simulation will play a critical role in pathfinding for this new potential direction for HPC beyond Exascale.

Title:
REED COLLEGE NUCLEAR REACTOR TOUR
Date:
April 10th
1:00 PM (2 hours)
Location:
3203 SE Woodstock
Portland
Abstract:

Join us for a tour of the Reed college small scale nuclear reactor. This is a good opportunity to learn about small scale clean energy generation. 

Title:
DC Transmission Grids - Topology, Components, Modelling, Control and Protection Challenges - Prof. Dragan Jovcic
Date:
April 10th
5:00 PM (2 hours)
Location:
Electrical and Computer Engineering
Seattle, WA
Abstract:

High Voltage DC Transmission has seen rapid technology advances in the last 20 years driven by the implementation of VSC (Voltage Source Converters) at GW powers and in particular introduction of MMC (Modular Multilevel Converters). The development of interconnected DC transmission grids requires significant further advance from the existing point-to-point HVDC links. It is widely believed that complex DC power grids can be built with comparable performance, reliability, flexibility and losses as traditional AC grids. The primary motivation for DC grid development is the need for power flow and trading between many DC terminals, as an example in the proposed (350 GW) North Sea DC grid, or EU-wide overlay DC grid. AC transmission is not feasible with long subsea cables, and it is inferior to DC systems in many other conditions. This presentation addresses the options and challenges with DC grid development, referring also to state-of-art technology status.

Zhangbei 4-terminal DC system (China, 2020) represents the first implemented GW-scale meshed DC transmission grid, which employs bipolar ring topology with overhead lines and 16 DC Circuit Breakers. However, multiple studies illustrate advantages of some radial, hub-based or segmented topologies, because of component costs, and challenges with interoperability, ownership, DC markets, operation, security and reliability.   

MMC concepts, including half-bridge and full-bridge modules, will underpin DC grid converters and further advances like hybrid LCC/MMC converters have been implemented recently. DC/DC converters at hundreds of MW are not yet commercially available but there is lot of research world-wide, and some lower-power prototypes have been demonstrated. DC/DC converters may take multiple functions including: DC voltage stepping (transformer role), DC fault interruption (DC CB role) and power flow control. Multiport DC hubs can be viewed as electronic DC substations, capable of interconnecting multiple DC lines.

Very fast DC CB circuit breakers (2 ms) have become commercially available recently, but the cost is considerably higher than AC CBs. Slightly slower mechanical DC CBs (5-8 ms) are also available from multiple vendors, while new technical solutions are emerging worldwide for achieving faster operation with lower size/weight/costs. 

DC grid modelling will face the new challenge of numerous converters dynamically coupled through low-impedance DC cables/lines. A compromise between simulation speed and accuracy is required, leading to some average-value modelling, commonly in rotating DQ frame, but capturing very fast dynamics and variable structure to represent fault conditions.

The principles of control of DC grids have been developed. DC systems have no system-wide common frequency to indicate power unbalance, and voltage responds to local and global loading rather than reactive power flow. DC grid dynamics are 2 orders of magnitude faster than traditional AC systems and most components will be controllable implying numerous, fast control loop interactions. Because of lack of inertia, and minimal overload capability for semiconductors, DC grid primary and secondary control should be feedback-based (man-made), fast, and distributed. International standardization efforts have begun.

The protection of DC grids is a significant technical challenge, both in terms of components and protection logic. The selectivity has been demonstrated within 0.5 ms timeframe using commercial and open-source DC relays. Nevertheless, grid operators have expressed concerns with self-protection on various components, back-up grid-wide protection, interoperability, and in general if we can achieve power transfer security levels comparable with AC grids and acceptable to stakeholders.

Title:
Conversational AI: Practical Challenges in Talking to People
Date:
April 14th
7:00 PM (2 hours)
Location:
925 Thompson Place
Sunnyvale, CA
Abstract:

This is a hybrid in-person and online event. Pre-registration is required for either.

Conversational AI systems today speak with remarkable confidence, often giving the impression of understanding and reasoning. However, teams deploying these systems often quickly encounter familiar problems: drift, hallucinations, contradictory answers, and conversations that quietly lose their original purpose. Why do systems that seem so capable end up behaving so unpredictably?

In this talk, Elena Gostrer will examine these behaviors from a practical, product-engineering perspective. Rather than exploring model internals, this talk will focus on what actually happens when humans interact with probabilistic language models – and why traditional software assumptions fail in conversational settings.

Elena will also discuss what architectural patterns teams are adopting to keep in control, and she’ll highlight why combining generative AI with explicit structure, state, and constraints is becoming essential. Attendees will leave with a clearer understanding of why conversational AI breaks, what helps it behave more reliably, and how to think differently about designing human-AI interactions.

Title:
IEEE PES Orange County Site Visit: Southern California Edison (Westminister) Lab Visit
Date:
April 15th
1:00 PM (1.5 hours)
Location:
14799 Chestnut St
Westminster, CA
Cost:
Admission fee may apply
Abstract:


Southern California Edison (SCE) is committed to delivering safe, reliable, affordable, and clean energy by advancing grid modernization and innovation. Through its Grid Technology Development (GTD) organization, SCE evaluates emerging technologies to ensure they are ready for secure and reliable deployment on the electric grid.

The Grid Technology Development (GTD) Labs at the Fenwick facility support technology demonstration, evaluation, proof‑of‑concept validation, and pre‑deployment testing in a secure, fully integrated grid environment. The labs are designed to mirror real‑world grid conditions, enabling evaluation of connected grid technologies across automation, communications, cybersecurity, protection, and distributed energy systems before they are deployed on the operational grid. This approach helps reduce deployment risk, improve reliability, and accelerate grid modernization efforts.

The Fenwick GTD Labs include several specialized environments. The Distribution Automation Lab focuses on waveform analytics for fault detection, remote fault indicators, device management systems, and augmented reality tools for asset inspection and maintenance. The Power Systems Lab provides real‑time digital simulation for hardware‑in‑the‑loop testing, while the Substation Automation Lab validates merging units and virtual protection architectures. In addition, the Grid Edge Technology Lab supports Grid Management System (GMS) interface testing for applications such as FLISR, and the Distributed Energy Storage Lab evaluate smart inverter behavior and DER integration—collectively ensuring technologies are ready for safe, reliable grid deployment.

 

Title:
Spring Speaker Series 2
Date:
April 15th
5:00 PM (1 hour)
Location:
Stanford, CA
Abstract:

Continuation of Speaker Series at Stanford IEEE.

Title:
Characterizing 2nd Law Efficiency of AI Datacenters
Date:
April 16th
5:30 PM (3 hours)
Location:
Zio Fraedo's
Pleasant Hill, CA
Cost:
Admission fee may apply
Abstract:

Datacenter workload fluctuations challenge the design and operation of our critical grid infrastructure. Significant gaps exist in assessment of these fluctuations as to their lifetime and short-term impact on the infrastructure and environment. Some mitigation approaches focus on throttling the datacenter workload, thus impacting the performance. Other approaches include use of alternate generation sources or energy storage systems. While disparate, these approaches are reactive and lack foresight and the intelligence to plan and strategize for optimal power management. We introduce an approach to quantify the transitional entropy generated during datacenter power fluctuations as a metric to evaluate datacenter performance using power demand measurements. A comparative assessment is provided between a BESS optimized datacenter and a regular datacenter to demonstrate the reduction of irreversibilities due to power fluctuations. Workloads are used to characterize the datacenter power demand at the point of interaction with utility. This approach can be scaled from datacenters to servers to chips.

Title:
HOLD - YP Driving Range Social
Date:
April 17th
8:30 PM (2 hours)
Location:
Honolulu, HI
Abstract:

Driving Range

Title:
Quarterly social meeting and program
Date:
April 22nd
11:00 AM (3 hours)
Location:
Golf course restaurant, not pro shop
Livermore, CA
Cost:
Admission fee may apply
Abstract:

Reserve this date for a social gathering and a program of general interest to be determined.   IEEE member fee is subsidized.

Title:
ICOP Hawaii (O'ahu)
Date:
April 23rd
12:00 PM (2 days)
Location:
Address coming soon
Honolulu, HI
Abstract:

IEEE-USA’s Congressional Outreach Program (ICOP) aims to connect IEEE Young Professionals (YPs) and Student Members with their Members of Congress.

ICOP events provide IEEE members the opportunity to meet directly with congressional staff to discuss critical technology policy issues affecting their communities. These events are a unique opportunity to help shape the future of engineering and technology by promoting innovation and research support at the federal level.

No prior policy or political experience is required. Participants will receive training (virtually) prior to the event.

Once you register, you’ll receive additional details and scheduling information. Because Congressional meetings are subject to change, the final schedule will not be confirmed until the week of the event. For more information, please contact the event hosts.

NOTE: This event is for IEEE members on O'ahu. 

Link to register: https://forms.gle/aPYV5PaD3GZeBAqb7

Learn more here: https://ieeeusa.org/public-policy/icop/

For questions, please contact a.grisham@ieee.org or icop@ieeeusa.org.

Title:
Volunteers Needed: IEEE Spring STEM Event for Girls
Date:
April 25th
8:00 AM (7 hours)
Location:
Isbell Middle School - Harvard Blvd Entrance
Santa Paula, CA
Abstract:

“Girls Make STEM with Heart”, the IEEE Buenaventura spring STEM event for middle-school girls, will be on Saturday, April 25 at Isbell Middle School in Santa Paula. If you were involved in previous events, you know what a wonderful experience it is for the students and volunteers and how rewarding.

Here is some background:

  • Students can choose from a variety of workshops covering topics such as chemistry, circuits, light, sound, momentum, solar energy, and numbers.
  • We have at least three mentors per workshop. Each student was able to get plenty of attention.
    At the end of the day, students get to show what they learned to their parents.
  • Isbell Middle School graciously lets us use their classrooms and food service. Each classroom is equipped with a computer projector, movable tables and chairs, and Wi-Fi connectivity.
  • Lunch and materials are provided by IEEE.
  • See the IEEE Foundation Newsletter for an excellent write-up of a past event, and our YouTube channel for a photo montage.

Planning for the event is already underway. If you are interested in volunteering, please contact us at stem2026@ieee-bv.org

Title:
Idaho Science Olympiad State Competition -- volunteers needed!
Date:
May 2nd
8:00 AM (5.5 hours)
Location:
BSU Student Union Building
Boise, ID
Abstract:

We need volunteers for the Idaho Science Olympiad State Competition on May 2nd at BSU.

The Science Olympiad is an annual STEM competition for middle school and high school students. It's a lot of fun to watch, and it's even more fun help out by supervising and scoring one of the 23 STEM events. This is a great opportunity for IEEE members to help make a difference!

See https://idahoscioly.org/ for more details.

Two events where we can use help are: Electric Vehicle andRobot Tour Each event lasts only a few minutes for each team but teams come in throughout the day from 9:00 AM to 2:30 PM.
The location with be the BSU SUB 2nd floor. The Idaho Science Olympiad (IDSO) provides breakfast, lunch, and free parking to all volunteers. You can register below or email me or call (voice mail or text) to volunteer. Sincerely,
Gary Carlsonidahosciolygc@gmail.com208-362-4999 

 

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
May 6th
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
Spring Speaker Series 3
Date:
May 17th
5:00 PM (2 days)
Location:
Stanford, CA
Abstract:

Continuation of Speaker Series at Stanford IEEE.

Title:
Third Annual IEEE Build-Up Substrate Symposium
Date:
May 19th
8:00 AM (2 days)
Location:
Samsung
San Jose, CA
Cost:
Admission fee may apply
Abstract:

(More information will be added in early March.  General Registration should open around March 1st. Sponsors may register at the link below.)

We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China.
However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. This Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.

Title:
IEEE Build-Up Substrate Symposium (BUSS)
Date:
May 19th
9:00 AM (2 days)
Location:
location to be announced
Milpitas, CA
Cost:
Admission fee may apply
Abstract:

We are living in the era of heterogeneous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogeneous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China.
However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. As the US Congress debates H.R. 3249, the Protecting Circuit Boards and Substrates (PCBS) Act, this Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.

Title:
IEEE Canada Blockchain Forum 2026 (4th edition)
Date:
May 25th
6:00 PM (20 hours)
Location:
Ontario Investment and Trade Centre
Toronto, ON
Abstract:

The IEEE Blockchain Forum is returning for the fourth time as part of Toronto Tech Week. The goal of this compact one-day event is to congregate BUIDLers, researchers, academics, and engineers building blockchain protocols, infrastructure, and decentralized software applications.

Note: The 2025 edition of the forum counted with 200 participants and speakers from JP Morgan, the Bank of Canada, Mastercard, the Ethereum Enterprise Alliance, EY, Starknet, among others. 

93 meetings. Generated Tuesday, March 3 2026, at 8:36:59 PM. All times America/Los_Angeles