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96 meetings

Title:
IEEE RAS Chapter Seattle Kickoff Meeting
Date:
October 15th
7:00 PM (1 hour)
Abstract:

Please join us for the IEEE Robotics and Automation Society (RAS) Chapter Seattle Kickoff Meeting!

We are excited to bring together IEEE RAS members, robotics and automation professionals, researchers, students, and enthusiasts in the Seattle area to kickoff the chapter and discuss opportunities for collaboration, technical activities, and community engagement.

Come meet fellow RAS members, learn about the chapter’s plans, and help shape future events and activities

Title:
IEEE Hawaii Women in Engineering the Hitachi Rail Tour
Date:
October 16th
12:30 PM (2 hours)
Location:
96-004 Ala ʻIke St
Pearl City, HI
Abstract:

Join the IEEE Hawaiʻi Section Women in Engineering (WIE) for a technical tour of Hitachi Rail.

Participants will have an opportunity to learn about rail transportation technology and the engineering systems that support safe and reliable rail operations. The tour will provide insight into the multidisciplinary work associated with rail systems, including operations, electrical and mechanical systems, communications, controls, safety, and maintenance.

This event offers students, IEEE members, and engineering professionals an opportunity to connect engineering concepts with real-world transportation applications, ask questions, and learn more about careers in the rail industry.

RSVP Deadline: Oct 12th, Monday at 11:59 PM HST

Advance registration is required. Space may be limited. Additional information regarding the meeting location, parking, required identification, attire, and safety requirements will be provided to registered participants.

Attendees must follow all safety instructions provided by Hitachi Rail personnel and IEEE event organizers. Closed-toe shoes are recommended, and photography may be restricted in certain areas.

Title:
Oct 16: IEEE Day-Innovators night with US Senator Maria Cantwell
Date:
October 16th
5:45 PM (3 hours)
Location:
UW Bothell – North Creek Events Center
Bothell, WA
Cost:
Admission fee may apply
Abstract:

IEEE Day – Innovators Night 
Share Your Ideas. Connect with Your Future.


Join us on Friday, October 16, 2026,  at 5:45 PM,

for an inspiring evening of innovation, discovery, and connection

with U.S. Senator Maria Cantwell.  

Savor & Spark

A delicious dinner,  Warm Camaraderie, and Innovation

 

Bring your ideas, curiosity, and enthusiasm. Meet engineers, technology leaders, scientists, and students; discover exciting projects; and make connections that could spark your next collaboration, internship, job opportunity, or capstone project.

Senator Cantwell serves as Ranking Member (Chair) of the Senate Committee on Commerce, Science, and Transportation. Her decades leadership in innovation, public policy, and the future of our country have helped our country to regain the leading position of the world.

She cares deeply about supporting technical people, research and STEM education.  Senator Cantwell will join us early to view innovation posters and discuss with participants’ inventions and ideas.


 This is a rare opportunity to exchange ideas and celebrate with the people shaping our future. Students, faculty, industry professionals, IEEE members, emerging and experienced innovators, and families are all welcome.


IEEE—the Institute of Electrical and Electronics Engineers—traces its heritage to the AIEE, founded in 1884, with Thomas Edison and Alexander Graham Bell among its early leaders. Today, IEEE connects a worldwide community dedicated to advancing technology for humanity. The IEEE Seattle Section proudly serves approximately 4700 members across more than 34 technical societies, bringing together a remarkable breadth of engineering and scientific expertise.

This gathering is also part of the IEEE New Era AI World Leaders Summit 2026.

Registration  & Admission at vTool events.
•    Students, faculty, and IEEE members: per person, member family .
•     Non IEEE Guests : per person


 Poster Submission

Come share what you are creating, discover what is possible, and meet the people who could help shape your future. We look forward to welcoming you! 

Poster Presentations and Innovator Awards

This year’s recognitions include the Grand Innovator Award and several Category Innovator Awards, selected by attendee voting .  We warmly invite you to explore and chose up to 3 categories and share your creativity with our community.

Award Categories
  1. Computing, Artificial Intelligence, and Applications

  2. Health care and Medicine

  3. Aerospace, Satellites and Next‑Generation Communications

  4. Hardware, Storage, Circuits, and Systems

  5. Power and Future Applications

  6. Robotics and UAVs

Student posters will also be honored in a separate award group, celebrating the creativity and promise of emerging innovators.

Come share what you are creating, discover new possibilities, and meet the people who may help shape your future. We are delighted to welcome you and celebrate your work.

1. IEEE membership Poster presenters are asked to hold active IEEE membership. If you are not yet a member, you are warmly invited to join at ieee.org/membership/join before submitting your entry.

2. Individual or team entries You may participate either individually or as a team. For team entries, at least one author and one presenter should be an IEEE member.

3. In‑person participation 

Presenters are expected to attend the event in person with an event ticket so they can share their ideas and engage with attendees.

4. Original work We kindly request that all posters reflect your own original research, innovation, or project.

5. Poster format Please prepare your poster for easel display. Posters are typically mounted on a 24″ × 36″ (2′ × 3′) rigid foam board. Tri‑fold boards are not used for this event.

6. We  welcome active demonstration, please indicate on the form submission.

To participate, please download the IEEE Day – Innovators Night Poster Participation Form, complete it and submit through Form Submission.

IEEE Day – Innovators Night Poster Participation Form

Poster Submission

Title:
IEEE Southern/Southwest Joint Area Meeting, Fall 2026
Date:
October 17th
8:30 AM (7 hours)
Location:
Belanich Engineering Center
san diego, CA
Abstract:

There will be a in-person Southern/Southwest Joint Area meeting on October 17, 2026. The morning will include all officers of the Sections to join and learn first about Region 6 latest news and then focus on Sections activities. The afternoon session will have parallel sessions: 1. Section activities and 2.  student actives/training.  It will be a great chance to network with other IEEE leaders and learn about their activities, as well as meet the student chapter leaders. 

Updates on Section activities and Student Officer Training are included.  There will be a great opportunity to expand your knowledge of what IEEE has to offer your members and to learn how to better engage them.

- Please register so we can get a headcount of expected attendance.

Refer to this event notice, as it will be updated as the missing details are filled in.

Please use the following link to book your hotel room before 10/1/2026.. IEEE Region 6 Joint Meeting Booking Link - Hilton Garden Inn Old Town San Diego There is a free shuttle from the San Diego Airport to the Old Town Transit Center,https://www.san.org/before-you-go-travel-tips/courtesy-shuttles/ You can walk to the hotel from the Old Town Transit Center in 6 minutes (0.2 miles). The meeting place is at University of San Diego (USD).  

For questions, please contact  Area Chairs:    Scott Tamashiro or Zhensheng Zhang,    tamashiro@ieee.org ,    zhenshengz@gmail.com

 

For the students

IEEE Student Officers are invited to join in-person to get more details around student activities from Region 6 Student Activities Coordinator, Alberto Tam Yong. The student session will start at 1pm. For student questions or concerns, contact the respective Area Chair and/or the IEEE Region 6 Regional Student Activities Committee Chair, Alberto Tam Yong ( alberto.tamyong.us@ieee.org ).

Student Travel. One representative covered per guidelines, review and submit form for tracking: https://forms.gle/WzUE2oBLL16pft5X6

 

Remote Option

This meeting is also available to join on WebEx.  Please details below.

Title:
IEEE Region 6 Central Area Meeting
Date:
October 17th
8:30 AM (7.5 hours)
Location:
David Packard Electrical Engineering
Stanford, CA
Abstract:

Central Area Fall Meeting is planned for October 17, 2026. Officers of the Sections and Student Branches are invited to attend this meeting. 
Date: October 17, 2026, 8:30 am to 4:00 pm
Location: Stanford University, Packard Electrical Engineering building. Packard 101 and Packard 201
Please register on vTools so we can get a headcount of expected attendance.
Refer to this event notice, as it will be updated with new information.
Please use the following link to book your hotel room before 10/9/2026.
 Hotel Link: Please note that we have committed ourselves to a block of rooms and we expect you to use this link to reserve your hotel room for Friday, October 16, checking out on October 17, 2026. Overnight valet only parking is and car rental requires Region 6 Director approval. 
Last day to book: October 9, 2026. 
Here's your reservation link which you can use to make a reservation (if you live more than 50 miles from Stanford):
Book your group rate for IEEE Region 6, Educational
Event Summary:
IEEE Region 6, Educational (Central Area)
Hotel offering your special group rate:
•    Hotel Citrine, Palo Alto, a Tribute Portfolio Hotel for 169.00 USD per night - Last Day to Book : Friday, October 09, 2026
For questions, please contact the Central Area Chairs:    Mostafa Mortezaie
mortezaie@ieee.org

(408)306-1919

Students are invited to join to get more detailed information about student activities.
 For student questions or concerns, contact the Central Area Chair or the IEEE Region 6 Student Activities Committee Chair, Alberto Tam Yong alberto.tamyong.us@ieee.org.


Remote Option
This meeting is also available to join online.  Details will be provided later.

Regards,
Mostafa Mortezaie
IEEE Region 6, Central Area Chair
mortezaie@ieee.org
Phone: (408)306-1919

 

For IEEE Student Officers:

In-person Student Trainings are scheduled at the upcoming IEEE Region 6 Area Meetings.

  • Consider this the continuation to the basic virtual training session.
  • One representative per student branch is invited and travel expenses are covered by the Region.
  • I invite you to attend, register and prepare travel arrangements ASAP.

Student Travel guidelines for IEEE Region 6 Area Meetings:

IEEE Region 6 will cover the expenses for 1 student representative per student branch, preferably the Chair.

  • This includes travel cost and 1 night hotel. (If an exception is needed due to flight availability, it needs to be approved on a case-by-case basis.)
  • If the Chair is unavailable, another representative may be appointed or selected to represent the student branch.
  • If students share a hotel room and commute together, more students may be acceptable, as long as the financial cost is equivalent or the same.
  • Student Branch Representatives are expected to attend the entirety of the meeting for volunteer leadership training.
  • All attendees must register for the event.
  • Students living within a 50-mile radius of the Area meeting location do not normally receive any travel or meal reimbursements.
    Other exceptions may be reviewed on a case-by-case basis.
  • Volunteers will be reimbursed using the Concur platform. For general guidance on expenses, refer to the IEEE Expense Reimbursement Guidelines for Volunteers.

Student officers are expected to attend the virtual IEEE Student Branch Officer Training - Fundamentals, or review the materials before the in-person meeting.

Alberto Tam Yong
IEEE Region 6; Student Activities Committee, Chair
alberto.tamyong.us@ieee.org

Title:
Cub Fun Day
Date:
October 17th
9:00 AM (6 hours)
Location:
Rio Linda, CA
Abstract:

Cub Fun Day is an all-day fun-filled event for cub scouts that features family camping, games, races, outdoor skills, and STEM activities. The Sacramento Valley IEEE Section will provide STEM activities: Making a bracelet using colored pony beads (the colors spell your name in Morse Code); Sending a Morse Code message using a 3-color LED and plastic fiber optic cable (to simulate the internet); Powering a Snap Circuits helicopter (to understand how voltage affects a DC motor); and Taking apart an outdoor solar-powered night light (in order to understand how energy is converted.)

Title:
IEEE x CPES Scavenger Hunt
Date:
October 17th
12:00 PM (3 hours)
Location:
San Luis Obispo, CA
Abstract:

Come join our Scavenger Hunt between IEEE Cal Poly and CPES in the Embedded Systems Lab!

Title:
Engineering Enterprise AI Agents: From Orchestration to Grounding
Date:
October 17th
4:00 PM (1 hour)
Abstract:

Abstract:
Moving AI agents from prototypes to production requires more than a powerful language model. Enterprise systems must orchestrate agents and tools, manage context, enforce security and tenant isolation, integrate with existing services, and ground responses in complex organizational knowledge.

In this session, we explore these challenges through two complementary perspectives. The first part presents a working model inspired by an enterprise customer service scenario to demonstrate architectural patterns for building enterprise Copilot systems, including multi-tenant design, multi-agent and tool orchestration, security, graphical workflow design, and direct MCP-based tool invocation. The model illustrates how these capabilities can come together to enable flexible and governed agent workflows.

The second part focuses on keeping agents grounded so they answer from real data instead of hallucinating. Following one customer question end to end, it covers identity files that set an agent’s rules and boundaries, MCP-connected knowledge bases, and the search layer underneath. Topics include why vector search alone misses exact names and terms, how hybrid retrieval fixes that, how multimodal embeddings reach knowledge in tables and images, and the compute, memory and cost walls retrieval hits as knowledge bases grow to billions of documents, along with the techniques that get past them.

Together, the talks provide an end-to-end technical perspective on building production-oriented agentic AI systems, connecting orchestration, tools, security, context, and grounding into a cohesive architecture.

Speakers:

Anuj Kapoor is a Senior Software Engineer at Microsoft with over 16 years of experience building enterprise software and distributed systems. His current interests include agentic AI, enterprise Copilot architectures, multi-agent orchestration, context engineering, and secure AI systems. He enjoys exploring practical approaches for taking AI agents beyond prototypes and integrating them with complex enterprise applications.

Aaditya Chauhan is a Senior Software Development Engineer at Amazon and a specialist in large-scale search and retrieval systems, with over 12 years of experience in distributed systems and enterprise search. He leads a team building vector search, hybrid retrieval, and RAG infrastructure for large-scale consumer applications. His retrieval research has been published in IEEE Access, at ICEIS, and at EMNLP 2026 workshops, and he has written on hybrid search for InfoQ. He reviews for IEEE Access and for workshops at NeurIPS, KDD, and EMNLP and is an IEEE Senior Member.

Title:
Excomm (Oct) - PES Chapter of IEEE Boise Section (Monthly)
Date:
October 19th
10:30 AM (1 hour)
Location:
Micron Engineering Center (MEC)
Boise, ID
Abstract:

This is the monthly PES chapter's Executive Committee meeting.  Typically, an hour to discuss old business and new business.

We focus on the upcoming events. James Mercier on September 21st. 
Senior member activity, Section Picnic, and Holiday Party, Future City Event. + technical events.

Title:
Phoenix Life Member Affinity Group October Meeting
Date:
October 19th
11:00 AM (2 hours)
Location:
Building 3
Scottsdale, AZ
Abstract:

First Luncheon Meeting of the 2026-2027 Year

Title:
III-Nitride Ferroelectrics for Low-Power and Extreme Environment Electronics
Date:
October 19th
3:30 PM (1 hour)
Location:
Vernier Science Center
Portland
Abstract:
III-Nitride Ferroelectrics for Low-Power and Extreme Environment Electronics

Deep Jariwala, Department of Electrical and Systems Engineering, University of Pennsylvania, USA

Date: October 12, 2026

Time: 3:30 pm to 4:10pm

Location: PSU Vernier Science Center room 105

Dense and reliable data storage combined with fast and high band-width access in novel memory devices has become the frontier for research in modern computing hardware. In this regard there have been several advancements across a variety of technologies in the past three decades. Ferroelectric materials and devices are among the forefront of these technologies due to their low-power and fast switching abilities but suffer from integration challenges. Simultaneously, developing data-heavy computing architectures in extreme environments is a growing need and a frontier challenge since silicon carbide (SiC) which is the leading logic technology for elevated temperature environments is limited by computing power and lack of memory devices that can operate at elevated temperatures. In this talk, I will try to make the case of how novel III-nitride materials might present interesting avenues to overcome some of the above limitations being faced by both Silicon and Silicon Carbide (SiC) hardware.

 

Title:
IEEE Life Members - Mentoring - One-on-One or with Groups
Date:
October 20th
10:00 AM (1.5 hours)
Abstract:

The session is being presented by Gustavo Giannattasio, the Life Member Group Mentoring Coordinator.

Participate in vibrant, intimate gatherings where experienced mentors share their journeys, guiding you and your peers through the complexities of career development. Group mentoring is more than just networking; it’s about forging connections, exchanging diverse perspectives, and empowering one another to reach new heights.

By combining student engagement, the wisdom of IEEE Life Members, and collaboration with groups such as IEEE Young Professionals, IEEE Women in Engineering, and IEEE Senior Members, this initiative aims to foster a supportive community that inspires collective growth.

This initiative will go beyond technical training. It focuses on the human, operational, and leadership capabilities that employers worldwide identify as essential in early-career professionals, such as:

  • Communication Excellence
  • Problem-Solving & Critical Thinking
  • Organizational & Personal Effectiveness
  • Leadership & Collaboration
  • Operations & Industry Acumen

Experience matters. Mentorship multiplies it. Help IEEE build well-rounded professionals, not just graduates.

 

For additional details, visit: https://www.ieee.org/membership/mentoring

 

Title:
Tunnels Tour
Date:
October 20th
3:00 PM (1 hour)
Location:
Kaiser Borsari Hall
Bellingham, WA
Abstract:

We'll be touring the tunnels that run beneath campus. These tunnels transport power, water, heat, and electricity to all the buildings on the premises.

Title:
Heterogeneous Integration Technologies for AI System Scaling: Redefining Interconnects, Cooling and 3D Integration
Date:
October 20th
4:00 PM (2 hours)
Location:
Qualcomm Building Q Auditorium
San Diego, CA
Abstract:

The fields of advanced packaging and heterogeneous integration (APHI) have evolved at an unprecedented rate of innovation in recent years. This has been driven by two key driving factors: integrated circuit chiplets and AI compute needs. Together, these have driven the industry towards adopting package-level interconnect and bonding processes that are blurring the boundary between on-chip and off-chip interconnects, ever larger package substrates, 3D stacking, liquid cooling solutions, advanced power delivery architectures, and photonic I/Os. In this presentation, we will first review recent industry trends in APHI. Next, we will present our research in designing and fabricating passive-chiplets to build package functions that enable higher levels of integration density and performance, including cooling chiplets for 3D ICs that feature monolithic microfluidic cooling channels with high density through-silicon-vias, fiber-attach chiplets that self-align a bundle of fibers to a photonic integrated circuit at high precision, and mm-wave interconnect chiplets that provide broadband and low-loss connectivity for MMICs. Further, we will present advances in large area glass-core package substrates, including co-packaged optics. The schedule is as follows: 

4-4.30 pm - Networking

4.30-6 pm - Lecture

Title:
IEEE/CN - October 2026 Meeting (Away) "2026 IGE SHOWCASE"
Date:
October 20th
4:30 PM (4 hours)
Location:
TDLLN Building 3 – Survivance
La Jolla, CA
Abstract:

Tuesday, October 20, 2026

4:30pm – 7:30 pm

 

San Diego IEEE Consultants' Network October 2026 Meeting ("Away Game")

 

=> 2026 IGE SHOWCASE

Title:
The current state of the art in computer aided engineering for design simulations
Date:
October 20th
5:30 PM (1 hour)
Abstract:

7th Lecture of IEEE CS San Diego's 2026 Invited Seminar Series (Virtual)

Title:
IEEE Richland Section Ex-Com Meeting Oct 20
Date:
October 20th
5:45 PM (1.2 hours)
Location:
1435 George Washington Way
Richland, WA
Abstract:

Scheduling IEEE Richland EX-COM Meeting for 2026

Location: Round Table Pizza, 1435 George Washington Way, Richland, WA 99352

Food and social gathering at 5:45 PM, business meeting at 6:00 PM

Date(s) –  Oct 20, Nov 17

________________________________________________________________________________

Microsoft Teams Need help?

Join the meeting now

Meeting ID: 243 106 218 013 08

Passcode: Xe2Zg9bj

Dial in by phone

+1 509-408-1681,,938429775# United States, Liberty Lake

Find a local number

Phone conference ID: 938 429 775#

For organizers: Meeting options | Reset dial-in PIN

________________________________________________________________________________

Title:
The Invariant Assurance Framework: Preserving Trust in AI-Assisted Systems delayed to Oct 20 6PM virtual only
Date:
October 20th
6:00 PM (1 hour)
Abstract:

 

Please Join us

October 20th  6 pm by  Mona Garg 

The Invariant Assurance Framework: Preserving Trust in AI-Assisted Systems

(sponsored by  IEEE Seattle TEM Chapter) 

Abstract : 

The Invariant Assurance Framework: Preserving Trust in AI-Assisted Systems

Generative AI is changing how software and technology systems are built. It can now help write code, review designs, identify problems and make recommendations that once depended heavily on human experts. This creates a new challenge: as AI works faster and takes on more decision-making, how do we make sure critical security rules are still being followed?

This talk introduces the Invariant Assurance Framework (IAF), a practical approach for keeping humans in control of the most important risk decisions. The framework follows three steps: first, define the security rules that must never be broken; second, automatically check important changes against those rules before they go live; and third, continuously monitor the system to make sure those rules remain true over time.

Using examples from high-risk systems such as payments and AI agents, the session will show how organizations can use AI to improve speed and productivity without losing security, accountability or human judgment.

Speaker

 

Mona Garg is a Principal Security Engineer specializing in the security of large-scale payment systems that power global commerce. She brings deep expertise in application and platform security, threat modeling, and secure system design, combining technical depth with a pragmatic, risk-based approach.

Her work focuses on advancing payment security and addressing emerging security challenges in AI-assisted and agentic systems. Earlier in her career, Mona helped strengthen the security of critical financial platforms at Visa.

She holds a master’s degree in Information Security Policy and Management from Carnegie Mellon University and writes and speaks on emerging challenges at the intersection of security, AI, and risk.

Seattle Section EXCOM imediatly follow the speech  on October 20th 7PM 

 

Title:
Please Join the IEEE Seattle Section Sept/ Oct EXCOM on Oct 20 7pm Virtual only
Date:
October 20th
7:00 PM (1.5 hours)
Abstract:

 

Please Join Us

IEEE Seattle Section September/October EXCOM Meeting
October 20 | 6:00–8:30 PM
In Person and Remote

Agenda

6:00–7:00 PM — Presentation
The Invariant Assurance Framework: Preserving Trust in AI-Assisted Systems
Sponsored by the IEEE Seattle TEM Chapter

7:00–8:30 PM — EXCOM Meeting

1. Welcome and Recognition: Spotlight new members, newly elevated Senior Members and IEEE Fellows, and new society officers.

2. Approval of Minutes: August 2026 meeting minutes.

3. Treasurer’s Report

4. Elections: Discuss the upcoming elections for 2027 Seattle Section officers and officers of selected chapters.

5. Section Business: 

6. Chapter, Affinity Group, and Student Branch Reports

7. Other Business

II,  Prior to  Seattle Sction EXCOM , please join the 

October 20th  6 pm by  Mona Garg 

The Invariant Assurance Framework: Preserving Trust in AI-Assisted Systems

(sponsored by  IEEE Seattle TEM Chapter) 

Abstract : 

The Invariant Assurance Framework: Preserving Trust in AI-Assisted Systems

Generative AI is changing how software and technology systems are built. It can now help write code, review designs, identify problems and make recommendations that once depended heavily on human experts. This creates a new challenge: as AI works faster and takes on more decision-making, how do we make sure critical security rules are still being followed?

This talk introduces the Invariant Assurance Framework (IAF), a practical approach for keeping humans in control of the most important risk decisions. The framework follows three steps: first, define the security rules that must never be broken; second, automatically check important changes against those rules before they go live; and third, continuously monitor the system to make sure those rules remain true over time.

Using examples from high-risk systems such as payments and AI agents, the session will show how organizations can use AI to improve speed and productivity without losing security, accountability or human judgment.

 

Seattle Section EXCOM imediatly follow the speech  on October 20th 7PM 

 

Title:
IEEE iGET 2026 – Five Days of Innovation, Research, AI & Global Collaboration
Date:
October 21st
8:00 AM (5 days)
Location:
7905 Irvine Center Dr
Irvine, CA
Cost:
Admission fee may apply
Abstract:

Dear Colleagues,

We are excited to invite you to IEEE iGET 2026 – Global Emerging Technology Conference, hosted in Southern California for the first time, taking place October 21–25, 2026, in Irvine, Orange County, California.



What to Expect

Expert-Led Workshops
Hands-on and practical sessions covering Agentic AI, LLMs, domain-specific AI, responsible innovation, production AI systems, AI-agent evaluation, autonomous-agent controls, and more.

Global Hackathons – 1,700+ Participants Worldwide

IEEE iGET 2026 is connected with two global innovation initiatives:

  • OneAquaHealth Global Hackathon
  • Climate Chain Global Hackathon

Together, these programs have engaged 1,700+ participants worldwide, bringing together students, researchers, developers, healthcare professionals, technologists, and innovators to develop solutions to real-world challenges.

OneAquaHealth focuses on the intersection of human health, aquatic ecosystems, environmental sustainability, digital health, data, and community engagement. Participants have explored solutions spanning environmental monitoring, health technologies, data visualization, sustainability, and digital-health standards.

The OneAquaHealth program also included multiple learning sessions with international experts, helping participants move from challenge identification to solution development.

A major highlight of IEEE iGET 2026 will be the recognition of the OneAquaHealth Global Hackathon Winner during the Award Ceremony on Friday, October 23.

The conference will also recognize:

  • Best Student Poster Award
  • Best Paper Award

The Climate Chain Global Hackathon complements this effort by encouraging solutions around climate resilience, sustainability, AI, blockchain, and emerging technologies.

Together, these initiatives showcase how global collaboration can translate emerging technologies into solutions with meaningful societal impact.

Industry Keynote Speakers
Hear from experienced industry leaders and experts sharing insights on AI, healthcare innovation, emerging technologies, enterprise transformation, and responsible innovation.

50+ Scientific Paper Presentations
Explore cutting-edge research and technical advances across AI, engineering, healthcare, and emerging technologies.

Student Poster Competition – 25+ Submissions
Discover innovative student research and connect with the next generation of researchers and engineers.

Student Entrepreneur & Pitch Program
An opportunity for students and aspiring founders to present ideas, receive feedback, build connections, and explore entrepreneurship.

Title:
Power System Modeling: What Makes a Model Meaningful
Date:
October 21st
11:00 AM (1 hour)
Abstract:

TBD

Power system models are essential for planning, analysis, and operational studies, but a model that reproduces a measured response is not necessarily a meaningful model. This presentation examines what makes a power system model meaningful in practice, drawing on extensive experience in model development, parameterization, validation, field testing, and application of generic and vendor-specific models.

The presentation will discuss the role of models, the information they can reliably represent, and their inherent limitations. It will also consider how modeling objectives, available data, model structure, and parameter uncertainty affect the interpretation and use of simulation results. Examples from generation, inverter-based resources, and transmission systems will illustrate why meaningful modeling requires more than simply matching measurements.

Title:
Tunnels Tour
Date:
October 21st
3:00 PM (1 hour)
Location:
Kaiser Borsari Hall
Bellingham, WA
Abstract:

We'll be touring the tunnels that run beneath campus. These tunnels transport power, water, heat, and electricity to all the buildings on the premises.

Title:
IEEE CS Career Catalyst 2026 - Career Connect S3: "The Frontier: AI, Silicon & Emerging Tech"
Date:
October 21st
5:00 PM (1 hour)
Abstract:

Join us for a moderated panel discussion exploring the frontier of AI, silicon, and emerging technologies, and what these developments mean for building a career in these fields. The conversation will feature perspectives from industry leaders on the latest trends, opportunities, and career paths across emerging technology, followed by a Q&A with IEEE CS Career Catalyst scholars.

Moderator:Sid Banyal, Career Connect Lead

Panelists:To be announced

Title:
2026 Monthly San Diego IEEE EXCOM - October Meeting
Date:
October 21st
5:30 PM (2.5 hours)
Location:
ATEC
San Diego, CA
Abstract:

 SDIEEE EXCOM Meeting

Executive Committee meeting to discuss all San Diego IEEE activities.  All IEEE members welcome to attend. Please RSVP. 

  • 5:30 pm - 6:00 pm,    Networking and food!
  • 6:00 pm - 8:00 pm,    meeting (in person and/or remote)
  • Meeting Adjourned 

To add to the agenda, please email upalmahbub@yahoo.com.   

 

Title:
Industry Panel
Date:
October 21st
6:00 PM (2 hours)
Location:
The Well Terrace Suite
Sacramento, CA
Abstract:

Want to hear what it’s really like to work in industry? Join us for our in-person Industry Panel featuring professionals from AMD, NVIDIA, Nor-Cal Controls, AXIA Electric, and IEEE Young Professionals next week on WEDNESDAY 10/21! Don’t miss the chance to learn about career opportunities and collaborate with fellow engineers! 

 

Wednesday, October 21st, 6-8PM

📍Well Terrace Suite 

 

Food will be provided!

 

Tentative Agenda:

6:00 PM – 6:15 PM
Introduction of each panelist and the company they represent

6:15 PM – 7:00 PM
Panelists present their slideshows covering information about the electrical engineering industry, career advice for students, and related topics

7:00 PM – 7:45 PM
Open Q&A with IEEE members

7:45 PM – 8:00 PM
Closing remarks and event wrap-up

Title:
IEEE Hawaii YP October ExCom
Date:
October 21st
8:30 PM (1 hour)
Location:
733 Bishop Street
Honolulu, HI
Abstract:

October ExCom

Title:
Introduction to Operations Engineering
Date:
October 22nd
10:30 AM (1.2 hours)
Abstract:

This presentation provides a practitioner’s perspective on power system operations and the role of operations engineering in maintaining the reliability of the bulk electric power system.

Speaker: Daniel Tiang, Manager of Operations Planning at the California Independent System Operator (CAISO), will introduce the role of CAISO and discuss how transmission operations engineers plan for near-real-time system conditions, coordinate transmission outages, support real-time system operators, and perform studies to identify and mitigate reliability concerns.

Title:
IEEE PES Lecture: From Grid-Forming SSTs to Multi-Terminal MVDC Networks: Control Foundations for SST-Enabled Hybrid AC/DC Power Systems
Date:
October 22nd
5:00 PM (1 hour)
Abstract:


The growing use of converter-interfaced generation, energy storage, and large electric loads is creating new challenges for power-system stability, resilience, and expansion. Although solid-state transformers (SSTs) and medium-voltage DC technologies have advanced substantially, most research continues to treat them as individual devices rather than coordinated building blocks of future grid architecture.

This lecture traces a control-centered progression from grid-forming SSTs, through grid-forming control of multi-terminal MVDC networks, to SST-enabled multi-terminal MVDC systems. It first introduces Dual-Measurement Frequency Droop (DMFD), which enables grid-forming operation at both AC terminals of an SST. This allows multiple SST-connected systems to establish interconnected microgrids during upstream outages, regulate voltage and frequency, coordinate photovoltaic and battery resources, and maintain connected renewable generation without high-speed communications.

The same control principle is then extended to multi-terminal MVDC networks to coordinate grid-forming behavior across AC and DC terminals, improve disturbance sharing, and reduce dependence on fixed master-slave roles. The lecture concludes by introducing an emerging architecture in which the internal converters and DC buses of SSTs form meshed MVDC interconnections without additional converter stations.

Together, these developments could reposition SSTs from advanced transformer replacements to strategic grid infrastructure, enabling multi-path power delivery, graceful degradation and recovery, and a phased transition from legacy AC systems to resilient hybrid AC/DC networks. Data centers and other critical large loads provide a compelling application, particularly when strengthening the surrounding sub-transmission system is as important as protecting the load itself.

 

 

Dr. Hisham Mahmood is a Senior Research Engineer at Pacific Northwest National Laboratory, where he leads research on medium- and high-voltage DC grid architectures, solid-state transformers, and the control of converter-dominated power systems. His research has progressed from autonomous power management and coordination of islanded microgrids to grid-forming SSTs, SST-enabled hybrid AC/DC systems, and multi-terminal MVDC and HVDC networks. His current work includes advanced control and architecture development for MVDC grids, offshore-wind integration through multi-terminal HVDC systems, and system-level modeling of power-electronic interfaces.

Before joining PNNL, Dr. Mahmood was an Assistant Professor at Florida Polytechnic University and held research and engineering positions at Western University, the University of Exeter, and Hit Power Ltd. He received the Ph.D. degree in electrical engineering from Western University and the M.Sc. degree in control engineering from Lakehead University. Over more than 15 years across national laboratories, academia, and industry, he has led and contributed to multiple U.S. Department of Energy-funded research projects and published extensively on microgrid power management, distributed energy storage, and power-electronic converter control. He is a Senior Member of IEEE and has been listed among the world’s top 2% scientists in Stanford University’s science-wide citation database.

Title:
Workshop: Decoding AI Hardware - Materials, Metrology, and Failure Analysis in Advanced Packaging
Date:
October 23rd
9:00 AM (4.5 hours)
Location:
Covalent Corp.
Sunnyvale, CA
Abstract:

This no-cost workshop brings together five industry experts (plus an optional lab tour) to discuss the latest 2.5D/3D/3.5D semiconductor packaging solutions for HPC and AI. It highlights the growing challenges of fault isolation (FI) and failure analysis (FA) in dense interconnects such as hybrid bonding and micro bump arrays, reviews new thermal management options (metallic TIMs, low-temp solders), showcases advanced non-destructive inspection tools (computed laminography and high resolution CT), and introduces cutting edge microscopy techniques (SAM and PiFM) for defect characterization, while outlining emerging FI-FA workflows and tool roadmaps for reliable, scalable AI and data center hardware. Attendees will gain insight into current industry troubleshooting workflows and a forward-looking roadmap of the tools and techniques being developed to address advanced packaging failures. Additionally, the optional lab tour can help the attendees understand the tools and techniques discussed in the lectures. 

Four guided training talks with small-group interaction:
9:00: Advanced Packaging for AI – Challenges and Roadmaps in Fault Isolation and Failure Analysis
9:30: Metal TIM and Low-Temp Solder Paste for HPC and AI Industry Challenges
10:00: Failure Analysis of Electronic Components for AI and Data Center Infrastructure
10:30:  High-Resolution 3D X-Ray Inspection for Advanced Packaging Integration
11:00: Scanning Acoustic Microscopy (SAM) and Photo-induced Force Microscopy (PiFM) for Defect Identification and Characterization in AI Hardware

11:30: lunch, social/networking, and optional lab tours

Title:
SERVE & SUPPORT — IEEE YP UTAH FOOD BANK VOLUNTEER DAY
Date:
October 23rd
12:00 PM (1.5 hours)
Location:
3150 S 900 W
Salt Lake City, UT
Abstract:

Many Hands Make Light Work!

Join IEEE Young Professionals at the Utah Food Bank for a hands‑on volunteer shift focused on supporting our local community. During this 90‑minute warehouse session, volunteers will help sort donated food, assemble food boxes, and prepare meal kits that go directly to individuals and families in need.

Warehouse Volunteer Activities (Ages 12+) Volunteering in the warehouse includes:

  • Sorting and organizing incoming food donations

  • Filling boxes with food that will be distributed throughout the community

  • Assembling food kits for home‑delivery programs

  • Supporting general warehouse needs as directed by Food Bank staff

This shift is fast‑paced, collaborative, and a great way to make a meaningful impact in a short amount of time.

We also encourage all volunteers who are able to bring non‑perishable food items to donate. Every contribution helps strengthen the Food Bank’s ability to serve our community.

Thank you for your time and willingness to serve — we look forward to seeing you soon!

Attendance is limited to 15 volunteers. Please RSVP to reserve your spot.

Title:
Alaska LNG Project Update by Glenfarne Alaska
Date:
October 23rd
12:30 PM (1.5 hours)
Location:
Engineering & Industry Building (EIB)
Anchorage, AK
Abstract:

Please join us for the IEEE Alaska October Section meeting.

This month’s program features an update on the Alaska LNG Project by Glenfarne Alaska's Doug Fletcher, VP of Construction and Ella Ede, Community Affairs & Workforce Development Lead.

We will meet in person on the UAA campus.  Park in the UAA Engineering & Industry Building south parking lot, come in the west building entrance, and head up to room 413.

UAA parking is free on Fridays.

Zoom will be available for those unable to join us on campus. 

A complimentary light lunch will be provided, so advance registration is required. IEEE membership is NOT required to register.

 
Title:
IEEE PES Orange County Site Visit: TAE Technologies
Date:
October 23rd
5:00 PM (2.5 hours)
Location:
19631 Pualing
Lake Forest, CA
Abstract:


TAE STEM OUTREACH GROUP

Inspiring the Next Generation of STEM Professionals

Connecting students with STEM professionals, career opportunities, and real-world applications.

ABOUT THE GROUP

The TAE STEM (Science, Technology, Engineering, Math) Outreach Group is an employee-led initiative dedicated to engaging students and communities in STEM.  We partner with schools, educators, and organizations to introduce students to STEM careers, demonstrate real-world applications, and encourage future exploration. 


Title:
IEEE vs. CPES vs. Nerdflare Soldering Competition
Date:
October 24th
10:00 AM (4 hours)
Location:
San Luis Obispo, CA
Abstract:

Come join us for a soldering competition between IEEE Cal Poly Student Branch, CPES, and Nerdflare! Top winners will receive Ifixit prizes (i.e. soldering station, gaming console kit, etc.)

Title:
Exploring Grid Inertia (and a Bit of Reactive Power) with Inverter-Based Resources: An Interactive Session
Date:
October 24th
7:30 PM (1.5 hours)
Location:
Y2E2 (Jerry Yang and Akiko Yamazaki Environment and Energy Building)
Stanford, CA
Abstract:

For a century, the grid's stability came for free from the heavy spinning mass of conventional generators. As solar, wind, and battery storage take over, that built-in inertia is disappearing, and the grid has to find new ways to stay steady.

Join Stanford IEEE's Power & Energy Society for an interactive session on grid inertia in an inverter-based world. We'll cover why inertia matters, what inverter-based resources can and can't do to replace it, and how reactive power support fits in. Along the way, we'll walk through real-world case studies of events on the grid and see what they can teach us. Expect live demos, open discussion, and plenty of questions. Open to all majors. No power systems background required.

Details and RSVP: https://luma.com/izp8abza

Title:
IEEE Cal Poly Student Branch General Meeting
Date:
October 26th
6:00 PM (1 hour)
Location:
San Luis Obispo, CA
Abstract:

Come join us for our second general meeting of the year! Lets keep you guys updated on upcoming events.

Title:
Palo Alto Utility's Grid Modernization with Stanford IEEE
Date:
October 27th
11:00 AM (1 hour)
Location:
Stanford University (room TBA)
Stanford, CA
Abstract:

The Stanford IEEE and its internal sub-chapter the Power and Energy Society will be hosting an informative presentation on Palo Alto Utility's Grid Modernization efforts.

Specific location on campus TBA. Details and RSVP: https://luma.com/v5gz9zz9

Title:
SusTech Talk October 2026 - The Manifesto of Hope: A New Social Contract for Our Human Family
Date:
October 27th
6:00 PM (1 hour)
Abstract:
The Manifesto of Hope: A New Social Contract for Our Human Family

Satya Brata Das

Tuesday, October 27, 2026, 6-7 pm PT

The U.S. and a host of major corporations have shelved their efforts to replace carbon-spewing technologies with clean energy. Despite years of international pledges, global efforts have failed to stop rising temperatures from endangering the planet. Yet in The Manifesto of Hope, published this October, the author, a journalist and veteran of global climate conferences, shows that the effort to make the world green and more fair, especially for the Global South, is an unstoppable force. 

Sustainability is being powered by solid economics: Green and renewable energy is much more profitable and economically viable than any new fossil fuel ventures. The world is moving ahead with sustainability plans, and in the absence of the U.S., the leaders will be China and India.

At a time when efforts by global politicians have stalled while climate emergency, conflict, and corruption have corroded all our aspirations for a just society in a liveable planet, the author aims to empower citizen leaders to push for tough and enforceable measures to save the planet and our species. Since IEEE Planet Positive 2030 is central to the actionable solutions in the book, this talk is a good opportunity to discuss the implications of Strong Sustainability by Design and how it can be implemented. "The future is a matter of choice, not fate," the author says. "Let us choose to lead." See book announcement on LinkedIn.

 

Title:
IEEE San Diego Section Life Member Affinity Group Monthly Meeting - October 27, 2026
Date:
October 27th
6:00 PM (3 hours)
Location:
124 Solna Hills Drive
Solana Beach, CA
Abstract:

Meeting Announcement: San Diego IEEE Life Members Affinity Group – Tuesday, October 27, 6 pm

Join us for our upcoming gathering!

We are pleased to announce the next meeting of the San Diego IEEE Life Members Affinity Group. All members are warmly invited to join us for an evening of camaraderie, conversation, and connection.  This will be an in person meeting.

·       Date: Tuesday, October 27, 2026

·       Time: 6:00 PM – 8:00 PM

·       Location: Crust Pizzeria

·       124 Solana Hills Dr.

·       Solana Beach, CA 92075

·       Phone: 858.356.9925

Speaker: Vidya Rangaswamy

Topic for Discussion: Application of Power Converters

We encourage all San Diego IEEE Life Members to attend and to bring along any colleagues or friends who may be interested. This is a great opportunity to network, share ideas, and enjoy delicious food in a friendly setting.

Virtual meeting access will also be provided, below is a Webex link:

Webex Meeting Information:

San Diego IEEE Life Member Affinity Group Monthly Meeting

https://ieeemeetings.webex.com/ieeemeetings/j.php?MTID=m3e3423d669b45cd0b8ab0914c703ee35

Meeting number:

2537 838 3419

Meeting password:

ETxFyJ4A4K3

 

 

 

 

Title:
The New Space Economy: Infrastructure, Markets & Emerging Opportunities
Date:
October 28th
7:00 PM (2 hours)
Abstract:

The space industry is evolving into a wider ecosystem of infrastructure providers, data services, and emerging commercial industries. In “The New Space Economy: Infrastructure, Markets & Emerging Opportunities,” Mark Goldstein, President of International Research Center, will provide a strategic overview of the forces shaping this transformation. The session will span transformative launch economics, satellite constellations for broadband and Direct to Device services, Earth Observation, ground networks, and national security demand, while exploring new opportunities in on-orbit compute and orbital data centers, space manufacturing, satellite servicing, commercial space stations, lunar and Mars activity, and space tourism. We’ll examine how investment, public policy, international competition, and technological advances are influencing market development, distinguish near-term opportunities from longer-term ambitions, and explore risks to space infrastructure and the environment. Attendees will leave with a clearer understanding of the space economy’s expanding value chains and their implications for technology leaders, businesses, and governments.

Title:
Stanford MTT-S/APS DL Talk: Scientific Machine Learning for Electromagnetic Field Computations
Date:
October 29th
4:00 PM (1.5 hours)
Location:
David Packard Electrical Engineering Building
STANFORD, CA
Abstract:

Abstract:

A recent report by the US Department of Energy defines the area of scientific machine learning as

“a core component of artificial intelligence (AI) and a computational technology that can be trained, with

scientific data, to augment or automate human skills”, which has “the potential to transform science and

energy research”. In this presentation, we discuss the potential of scientific machine learning methods to

problems in computational electromagnetics starting from standard electromagnetic structure analysis

and multi-physics modeling in the time-domain, employing unsupervised, supervised and reinforcement

learning.

 

An unsupervised learning strategy is based on a modified Physics-Informed Neural Network (PINN). PINNs

directly integrate physical laws into their loss function, so that the training process does not rely on the

generation of training ground truth data from simulations. We introduce a physics-informed deep-

operator-network (PI-DON) for Maxwell’s equations. We show applications of the PI-DON to the analysis,

design and uncertainty quantification study of finite and defect periodic structures, including frequency

selective surfaces and metasurfaces.

Moreover, we demonstrate the impact of machine learning on the computational modeling of radiowave

propagation scenarios and reconfigurable intelligent surfaces, using supervised learning. We build

convolutional neural network models that can process the geometry of indoor environments, along with

physics-inspired parameters, to rapidly estimate received signal strength (RSS) maps. Emphasis is placed

on the generalizability of these models, which is their ability to "learn" the physics of radiowave

propagation and produce accurate modeling predictions in new geometries well beyond those included in

their training set.

 

Finally, the use of reinforcement learning for the optimization of reconfigurable intelligent surfaces will be

discussed.

Title:
Stanford IEEE Fireside Chat: Shang-Yi Chiang
Date:
October 29th
5:00 PM (1 hour)
Location:
Packard Electrical Engineering Building
Stanford, CA
Abstract:

Stanford IEEE hosts a fireside chat with Shang-Yi Chiang, former co-COO of TSMC and one of the most influential figures in modern semiconductor process technology. The conversation will cover the evolution of process technology, the future of the foundry industry, and advanced packaging, followed by open audience Q&A.

Thursday, October 29, 5-6 PM. Free and open to Stanford students, staff, and faculty.

Details and RSVP: https://luma.com/gft0fwna

Title:
Social and Networking Evening at Topgolf
Date:
October 29th
6:00 PM (2 hours)
Location:
780 Logan Ave N
Renton, WA
Abstract:

Join the IEEE Seattle Joint Communications Chapter for a social and networking evening at Topgolf! Take some time to unwind, connect with fellow members, and enjoy a relaxed evening together. Members considering IEEE Senior Member elevation will have the opportunity to ask questions and receive guidance. To help us plan, please register by October 20 once you’ve confirmed that you can attend.

Date: Thursday, October 29 from 6 to 8 PM

Location: Topgolf, 780 Logan Ave N, Renton, WA 98057

Title:
CLASTECH 2026- Exhibitor Registration
Date:
October 30th
8:00 AM (7.5 hours)
Location:
Eravant
Torrance, CA
Cost:
Admission fee may apply
Abstract:

 

 

Dear Exhibitor, this is the page for you to register for a table. Two lunches are included.  Additional lunches can be purchased on the regular attendee page, https://events.vtools.ieee.org/m/568539  The cost for a table is 0.

CLASTECH will be at the Eravant Facility this year.  We will have a 4 speakers on Microwave and Antenna topics.  There will be a box lunch from Panera Bread.

Space is limited - no onsite registration

1- Prof. Nick Miller, Michigan State., "Large-Signal Characterization and Modeling of GaN HEMTs to 100 GHz"

2- Dr. Hasan Sharifi, HRL Director, "Next-Generation Millimeter Wave Phased Array Technology Enabled By 3D Heterogeneous Integration"

3-  Mahmoud Wagih, Ph. D., University of Glasgow, "Making Microwaves Green: From Life Cycle Assessments to Chipless Sensing Solutions"

4- Satish Sharma, Department of Electrical and Computer Engineering San Diego State University, "Multifunctional Antennas and Arrays for Wireless Communications", 

Here is a link about Eravant https://www.eravant.com/ 

Title:
CLASTECH 2026
Date:
October 30th
8:30 AM (7 hours)
Location:
Eravant
Torrance, CA
Cost:
Admission fee may apply
Abstract:

 

 

CLASTECH will be at the Eravant Facility this year.  We will have a 4 speakers on Microwave and Antenna topics.  There will be a box lunch from Panera Bread.

Space is limited - no onsite registration

List of Speakers:

1- Prof. Nick Miller, Michigan State., "Large-Signal Characterization and Modeling of GaN HEMTs to 100 GHz"

2- Dr. Hasan Sharifi, HRL Director, "Next-Generation Millimeter Wave Phased Array Technology Enabled By 3D Heterogeneous Integration"

3-  Mahmoud Wagih, Ph. D., University of Glasgow, "Making Microwaves Green: From Life Cycle Assessments to Chipless Sensing Solutions"

4- Prof. Satish Sharma, Department of Electrical and Computer Engineering San Diego State University, "Multifunctional Antennas and Arrays for Wireless Communications", 

Here is a link about Eravant https://www.eravant.com/ 

Title:
Scientific machine learning for electromagnetic field computations
Date:
October 30th
9:30 AM (1 hour)
Abstract:

Abstract:

A recent report by the US Department of Energy defines the area of scientific machine learning as “a core component of artificial intelligence (AI) and a computational technology that can be trained, with scientific data, to augment or automate human skills”, which has “the potential to transform science and energy research”. In this presentation, we discuss the potential of scientific machine learning methods to problems in computational electromagnetics starting from standard electromagnetic structure analysis and multi-physics modeling in the time-domain, employing an unsupervised learning strategy based on Physics-Informed Neural Networks (PINN). PINNs directly integrate physical laws into their loss function, so that the training process does not rely on the generation of training ground truth data from simulations. We demonstrate the unconditionally stable solution of coupled electromagnetic-thermal problems based on PINNs and introduce a physics-informed deep-operator-network (PI-DON) for the unconditionally stable solution of Maxwell’s equations. We show applications of the PI-DON to the analysis, design and uncertainty quantification study of finite and defect periodic structures, including frequency selective surfaces and metasurfaces, demonstrating significant computational efficiency gains with respect to the conventional finite-difference time-domain technique (FDTD), including training time of the neural network.

Moreover, we demonstrate the impact of machine learning on the computational modeling of radiowave propagation scenarios. We build convolutional neural network models that can process the geometry of indoor environments, along with physics-inspired parameters, to rapidly estimate received signal strength (RSS) maps. Emphasis is placed on the generalizability of these models, which is their ability to "learn" the physics of radiowave propagation and produce accurate modeling predictions in new geometries well beyond those included in their training set.

 

Title:
Micron Tour (October 2026)
Date:
October 30th
11:00 AM (3 hours)
Location:
Micron Building visitor parking area
Boise, ID
Abstract:

Join the IEEE Club at CWI for a behind-the-scenes tour of Micron Technology in Boise, Idaho.

This tour offers an opportunity to explore the intersection of electrical engineering, materials science, manufacturing, and technological innovation. Attendees will gain insight into Micron’s role in the semiconductor industry and the engineering challenges involved in developing and producing advanced memory solutions.  Participants will learn about semiconductor manufacturing, memory technology, and the engineering processes behind the advanced chips that power modern electronics, computing, and artificial intelligence.

Who should attend: CWI students, IEEE members, faculty, and people interested in semiconductors, electronics, computer engineering, and industrial manufacturing.

Come learn how semiconductor technology moves from engineering concepts to the devices that shape our connected world.

Register with vtools here.  Then, you need to register with Micron with this Envoy link.  Registration ends on the 23rd so Micron can plan accordingly.  We'll be meeting at the Micron visitor parking area by building B36.  See map or map link for visuals.  After your Micron registration, you will receive an email with your pass.  You can print it or download the envoy app.

 

 

Title:
IEEE Region 6 - Joint NE / NW Fall 2026 Area Meeting
Date:
October 31st
8:00 AM (8 hours)
Location:
Pullman, WA
Abstract:

We are holding the Fall 2026 IEEE NE / NW Area meeting on October 31st in Pullman, WA at the Washington State University Campus.

Tentatively we're planning on starting at 8:00 AM and will plan on wrapping up by 4:00 PM, with dinner planned afterwards. The full schedule along w/ details about where we plan on having dinner Friday Night and Saturday Night will be posted when we have more details. 

Please RSVP so we can get an accurate head count for reservations and food.

The Region will cover the costs of attendance for a single delegate from each section in both the NE and NW Areas. We highly encourage sections that are close to the Palouse Section (Boise, Spokane, Central Washington, and Richland) to request approval for a rental car from Joseph, Sean, and Albert as the cost would be less than flying. (Note this is not required, but highly suggested.)

Looking forward to seeing everyone there!

For information on the reserved hotel block to get a link for reserving the room, please contact Sean Collison and Sanjay Samuel.

 

Hotel Details:

Courtyard by Marriott Pullman -  1295 NE North Fairway Rd, Pullman, WA 99163

Last Day to Book : Thursday, October 15, 2026

 

For IEEE Student Officers:

In-person Student Trainings are scheduled at the upcoming IEEE Region 6 Area Meetings.

  • Consider this the continuation to the basic virtual training session.
  • One representative per student branch is invited and travel expenses are covered by the Region.
  • I invite you to attend, register and prepare travel arrangements ASAP.
  • For the Northeast/Northwest Area Meeting, review and submit Student Travel Grant form for tracking: https://forms.gle/KKywoBQ7B4SAoqGp7

Alberto Tam Yong
IEEE Region 6; Student Activities Committee, Chair
alberto.tamyong.us@ieee.org

Title:
From Prototype to Production: Build Your First AI Agent
Date:
October 31st
5:00 PM (2.5 hours)
Location:
San Diego, CA
Abstract:
From Prototype to Production: Build Your First AI Agent

An IEEE SPS San Diego workshop in association with Live AI Dream

Go beyond chatting with AI. Learn how to build an AI helper that follows a task, uses tools, checks its work, and tries again when something goes wrong.

This standalone workshop is part of the IEEE SPS San Diego AI Systems and Practitioner Engagement program. Attend this session on its own—no commitment to future sessions is required.

Build Your First AI Agent — Chhavi Jain

5:00–6:00 PM

Join Chhavi Jain, an AI systems architect, founder of Live AI Dream, and IEEE SPS Vice Chair, for a guided introduction to building AI agents.

Learn how to:

  • Give your agent a clear task.
  • Help it choose what to do next.
  • Let it check a result and try again.
  • Use it to find and fix code mistakes.
  • Keep a person in control when approval or help is needed.

We’ll focus on a starter agent and explain what it takes to make it more reliable—not promise a production-ready system in one hour.

How AI Makes Sense of Video — Mehmet Tarik Baran

6:00–6:30 PM

Explore Mehmet’s computer-vision project and see how AI finds and follows people or objects in video. Learn how it studies movement and turns what it sees into useful information.

This project demonstration shows how different AI tools can work together as one system.

Student Showcase, Q&A, Pizza & Networking

6:30–7:30 PM

See student projects, hear what they built, and ask questions. Enjoy pizza, meet fellow attendees, and share ideas with students and people working with AI.

Admission
  • General admission:
  • UC San Diego students:
  • IEEE Signal Processing Society members: Free

All admission levels include the workshop, student showcase, pizza, and networking. Registration is required for everyone, including free attendees. Student and SPS member rates require eligibility verification.

Certificate of Participation

An IEEE certificate of participation is planned for participants who successfully complete the workshop, subject to chapter confirmation of issuance and completion requirements. This is participation recognition, not an accredited qualification.

Event Details

Date: October 25, 2026 — planned
Time: 5:00–7:30 PM
Location: To be confirmed
Contact: Chhavi Jain — chhavi.jain@ieee.org

 

 
Title:
Thriving at Work: Cultivating Resilience for Sustainable Success - Talk by Sharmin Banu on Career Development Seminar - IN-PERSON
Date:
November 1st
12:00 PM (2 hours)
Location:
2nd-Floor Classroom
Laguna Hills, CA
Abstract:


As technology evolves and workplace demands intensify, how can we sustain our effectiveness and well-being without sacrificing what matters most?

Join executive leadership coach and author Sharmin Banu for an engaging conversation about cultivating resilience—not just to bounce back from challenges, but to thrive with greater purpose and joy.

Drawing from her book Mid-Career Momentum, Sharmin will introduce her practical 3C Resilience Model: Care, Connect, and Create. Participants will learn to recognize early signs of depletion and identify small, intentional actions to strengthen resilience and create more sustainable success.

Join us to explore practical ways to strengthen your resilience, reconnect with what matters most, and take small steps toward a more sustainable and fulfilling professional life.

 

About the Speaker

Sharmin Banu is an executive leadership coach, former Microsoft engineering manager, and author of Mid-Career Momentum: Design Your Next Phase with Purpose and Joy.

Since 2009, she has coached hundreds of mid- to senior-level leaders across technology and other industries, helping them navigate challenges, expand their leadership impact, and build sustainable success. An ICF Professional Certified Coach (PCC) and former President of ICF Washington State, Sharmin brings a unique blend of engineering experience, leadership insight, and practical coaching tools.

Through her coaching, speaking, and writing, she is passionate about helping professionals grow with greater purpose and joy.

 

Kindly register to attend the technical talk. 

Event informationDate: Nov 1st 2026Time: 12:00PM to 2PM Location: Laguna Hills Community Center
Room: 2nd-Floor Classroom
Address: 25555 Alicia Parkway, Laguna Hills, CA 92653
Title:
San Diego IEEE Electronics Packaging Society (EPS) Meeting - Part 8
Date:
November 3rd
5:00 PM (1.5 hours)
Location:
Qualcomm Building S
San Diego, CA
Abstract:

We are organizing part8 of the IEEE San Diego Electronics Packaging Society (EPS) chapter meeting.

 

Title:
Maximizing performance of power electronics by minimizing magnetic energy storage
Date:
November 4th
6:00 PM (1 hour)
Location:
Murata Electronics North America, Inc.
San Jose, CA
Abstract:

Magnetic components' cost, size and loss inhibit progress in power electronics. The required size is largely driven by the energy storage required, and co-design of circuits and magnetics to minimize energy storage can result in small and efficient converters. Examples presented will include magnetics for high-current-density low voltage power delivery at >4 A/mm2, and new circuits to replace 60 Hz transformers, including in V2H bidirectional EV charging.

Title:
IEEE OC PES/IAS Chapter ExCom Meeting - November 4th 2026
Date:
November 4th
6:30 PM (0 minute)
Abstract:

IEEE Orange County PES/IAS Chapter's ExCom meeting

All IEEE OC PES/IAS Chapter members are requested to attend this meeting. 

To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.

 

 

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
November 4th
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
Stanford IEEE: The Power of Service
Date:
November 5th
5:00 PM (2 hours)
Location:
Paul G. Allen Building
Stanford, CA
Abstract:

Stanford IEEE is hosting "The Power of Service," an evening on the many different paths of service through IEEE. It is open to all Stanford students and geared toward undergraduate and graduate students in electrical engineering, computer science, and related fields.

The evening opens with a short talk on what service through IEEE can look like over a career, from student member to local volunteer to leadership. That is followed by a small panel of IEEE volunteers and Stanford IEEE industry advisors, who will share their own paths through service in industry, their local IEEE section, and IEEE societies, and take audience questions. Officers of the IEEE Santa Clara Valley Section will then give a brief introduction to the local section and how students can get involved. The event ends with informal networking.

Admission is free and no ticketing is required. Room TBD, check back closer to the date.

Details: https://luma.com/1yqa8y4f

Title:
Autonomous Infrastructure Economics: Algorithmic FinOps, Compute Optimization, and Mitigating LLMJacking
Date:
November 5th
7:00 PM (1 hour)
Location:
Alameda Hall
Santa Clara, CA
Cost:
Admission fee may apply
Abstract:

As enterprises operationalize generative AI and autonomous agentic workflows, compute expenditure has evolved from an accounting metric into an active security and reliability boundary. Building upon research presented in Observability for Large Language Models (Apress / Springer Nature) and patented methodologies in compute optimization and hallucination detection, this session provides an architectural deep dive into the dual imperatives of GenAI FinOps and compute protection.

The talk deconstructs the emerging threat landscape of LLMJacking and Denial-of-Wallet (DoW) attacks—where compromised credentials and unconstrained agent loops are exploited by threat actors to divert enterprise LLM capacity to unauthorized workloads. We examine:

  • Algorithmic Cost Reduction: Implementing tiered routing frameworks between Small Language Models (SLMs) and frontier models, semantic caching layers, and vector search pruning to reduce redundant token overhead by up to 60%.
  • Zero-Standing Quotas & Cryptographic Identity: Applying SPIFFE/SPIRE-based short-lived workload attestation to model inference endpoints, preventing compromised API keys from allowing unbounded cloud spend.
  • Automated Circuit Breakers: Establishing sub-minute anomaly tripwires to isolate rogue recursive agent loops and anomalous token velocities in production.
  • Return on Autonomy (RoA) Modeling: Translating raw token consumption into boardroom-defensible metrics that balance MTTR reduction against compute overhead.
Key Attendee Takeaways
  1. Threat Mitigation Blueprint: Actionable telemetry patterns to identify and neutralize LLMJacking attempts before enterprise token quotas are exhausted.
  2. Production FinOps Patterns: Architectural designs for context-window compression and dynamic inference routing that immediately decrease operational cloud spend.
  3. Executive Governance Framework: Clear policies for chargebacks, environment-scoped spend tripwires, and engineering-versus-token ROI trade-offs.
Title:
IEEE ASU ComSoc Keynote Speech Series
Date:
November 6th
10:00 AM (1 hour)
Location:
GWC
Tempe, AZ
Abstract:

The IEEE ASU ComSoc Student Branch Chapter is dedicated to fostering an active community of students and researchers passionate about communications, networking, and emerging wireless technologies. Our mission is to create a dynamic environment for professional development, mentorship, and technical exchange. As a core part of this mission, we host a Keynote Speech Series featuring distinguished leaders whose work informs and inspires our members. These sessions are designed to bridge the gap between cutting-edge research and industry practice, providing our student community with direct access to the visionaries shaping the future of connectivity.

Title:
IEEE PES Orange County Site Visit: Commercial Solar Rooftop and Energy Storage System in Lake Forest, CA
Date:
November 6th
12:00 PM (1 hour)
Location:
25371 Commercentre Dr
Lake Forest, CA
Cost:
Admission fee may apply
Abstract:


 

Event Description:

We will visit Genomic Testing Cooperative (GTC), a commercial genetic-sequencing and testing laboratory, for a presentation about GTC’s Solar Rooftop and Battery Energy Storage System. -- The solar system is rated at 128.96 kW using 284 solar panels. The energy storage system is rated at 2 x 100 kWh using LFP batteries.

 

Speakers:

Mitch Zogab, president and founder of Energy Innovation Solutions (EIS), will be our lead presenter to review and discuss the Solar+Storage project, from client requirements to power engineering design decisions.

EIS is a turnkey energy management company headquartered in Aliso Viejo that focuses on integrated power projects designed to reduce costs and carbon footprints for commercial, industrial, and government entities.  As an Energy Systems contractor, EIS manages solar and storage design, resiliency infrastructure planning, compliance and logistics through a network of engineers and subcontractors.

Mitch Zogab’s background involves directing commercial and industrial clean energy deployments across Southern California.  Notable projects under his leadership include agricultural storage systems, solar carports in Riverside County, and advanced battery storage applications.

Arie Shen, Chief Commercial Officer and CIO at Genetic Testing Cooperative.  Arie will be our host at the client site and describe the commercial laboratory business of GTC and why GTC chose to add solar and energy storage to their operations.


Title:
IEEE Sacramento Valley Evening with Industry
Date:
November 6th
5:00 PM (3 hours)
Location:
University Union
Sacramento, CA
Abstract:

IEEE Sacramento Valley Industry Evening

📅 November 6, 2026
🕔 5:00 PM – 8:00 PM

Join us for an evening of industry insights, career development, networking, and meaningful connections with professionals from the Sacramento Valley engineering community.

🗓️ Event Schedule

Coffee and snacks

5:00 PM — Speaker 1 Presentation
5:30 PM — Speaker 2 Presentation
6:00 PM — Speaker 3 Presentation
6:30 PM — Panel Discussion & Q&A
7:00 PM – 8:00 PM — Networking • 1:1 Resume Review

Dinner

 

Whether you’re an experienced engineer, a young professional, a student, or simply interested in learning from industry leaders, this is a great opportunity to gain insights, ask questions, strengthen your resume, and build your professional network.

Come ready to learn, connect, and grow with the IEEE Sacramento Valley community!

Title:
CANCELLED! SCV/OEB SSIT Chapter Meeting: Diffie-Hellman Key Exchange 50th Anniversary Global Celebration - Moved to 2027!
Date:
November 7th
10:00 AM (3 hours)
Location:
Discovery and Innovation (SCDI) building
Santa Clara, CA
Cost:
Admission fee may apply
Abstract:

This will be RESCHEDULED in 2027!

IEEE Global and SCV-OEB SSIT Chapter: Diffie-Hellman Key Exchange 50th Anniversary Global Celebration

 

Drs. Diffie and Hellman, recipients of the 2015 ACM A.M. Turing Award, will be joining us in person. The day will honor what their work made possible and look ahead to the next 50 years of digital public infrastructure.

 

 

 

IEEE members and guests are welcome at 10:00 AM on Saturday, November 7, at Santa Clara University. Venue details will be confirmed.

 

Title:
IEEE x Optica Speaker Panel
Date:
November 7th
12:00 PM (4 hours)
Location:
San Luis Obispo, CA
Abstract:

Meet our industry speaker panel featuring:

  • Apple Senior Hardware Design Engineer
  • President of Arroyo Instruments
  • CEO of Applied Energetic
  • Cal Poly Faculty
  • Senior Manager of Photonics Company 
Title:
Workshop: Advanced Nonlinear Modeling and Large-Signal Characterization of III-V RF Devices
Date:
November 7th
4:30 PM (8 hours)
Location:
Fukuoka International Congress Center
Fukuoka, FUA
Abstract:

Wideband gap III-V technologies are the backbone of modern high-power RF systems, from base stations to advanced radars. However, as modern architectures demand, achieving the required balance of high efficiency, suitable linearity, and wide bandwidth operation requires more than just standard design. It demands reliable nonlinear device models built on precision and accurate measurement data.

Therefore, advanced and accurate nonlinear modeling of RF diodes and transistors is needed to design improved high-performance circuits, modules, and complete systems. Trapping effects, memory effects, nonlinear parasitic components, scaling requirement, and thermal issues must be considered to extract a reliable device model.

Modern measurement systems enable well-controlled and accurate measurements to collect consistent data in short time. These systems allow multiple measurements without large modifications, such as double RF&DC pulsing, non-50 ohm measurements using modulated signals, vector load-pull at sub-THz frequencies, etc. Then, the innovative device models and modeling tools finalize the process to release a model that will be admired by design engineers.

In this workshop, experienced speakers from industry and academia will share their experiences and insights about III-V device characterization and advanced modeling. Fundamentals of large signal measurements, vector calibration for large signal measurements, calibration verification techniques, modern modeling methods, device size scaling issues, and measurement techniques to analyze nonlinear behaviors, such as trapping, will be covered. In addition to large signal topics, noise modeling of III-V devices will be discussed. The workshop will conclude with a networking session, offering a casual atmosphere to discuss challenges and share ideas about the topics.

Chairs:

  • Osman Ceylan, PhD (Maury Microwave, USA)
  • Seiya Takashima (Sumitomo Electric Device Innovations, Inc., Japan)

Web page

 

Title:
Student Design Competition (Oscillator Track) at APMC-2026 Fukuoka / Japan
Date:
November 9th
4:00 PM (8 hours)
Location:
Fukuoka International Congress Cente
Fukuoka, FUA
Abstract:

Students and young engineers are invited to participate in the Student and Young Engineer Design Competition (SYDC). The competition features up to four distinct tracks, including the Active, Passive, and WPT tracks organized by the APMC 2026 Committee, and the Oscillator track organized in collaboration with IEEE MTT-S TC-3. In each track, registered participants will go through the following three stages:

Oscillator Design Competition is organized by the Foothill Section vice-chair Dr. Osman Ceylan.

Event Link: https://apmc2026.org/student-and-young-engineer-design-competitions.html

Click Here for the Rules

Title:
Space Information Laboratories Information Session
Date:
November 9th
6:00 PM (1 hour)
Location:
San Luis Obispo, CA
Abstract:

Come join to hear about opportunities for SIL personally hosted by the CEO himself!

Title:
Distinguished Lecturer Talk: Building the World's Largest Low-Earth-Orbit Satellite Network Testbed from the Ground Up
Date:
November 9th
6:00 PM (2 hours)
Location:
Khasm Labs
Woodinville, WA
Abstract:

 

Speaker: Prof. Jianping Pan
University of Victoria, BC, Canada


Second-generation low-earth-orbit satellite networks, such as SpaceX's Starlink and Eutelsat's OneWeb, as well as upcoming ones such as Amazon's Leo and Telesat's Lightspeed, have attracted a lot attention in recent years, however, most academic and industry researchers still lack direct access to such systems, impeding their research progress and further improvement on space, air and ground integrated networks envisioned by sixth-generation mobile communication systems. In this talk, we will highlight a coast-to-coast-to-coast low-earth-orbit satellite network testbed with at least one node in each of the ten provinces and three territories in Canada, extended to all six major continents, with tools and datasets publicly available for the research community. The testbed has been augmented by outside-in approaches that can reach over 7 million Starlink user routers and over one thousand aircraft, being the largest around the world of its kind.

Dr Jianping Pan is a professor of computer science at the University of Victoria, British Columbia, Canada. He received his Bachelor's and PhD degrees in computer science from Southeast University, Nanjing, Jiangsu, China, and he did his postdoctoral research at the University of Waterloo, Ontario, Canada. He also worked at Fujitsu Labs and NTT Labs. His area of specialization is computer networks and distributed systems, and his current research interests include protocols for advanced networking, performance analysis of networked systems, and applied network security. He received IEICE Best Paper Award in 2009, Telecommunications Advancement Foundation's Telesys Award in 2010, WCSP 2011 Best Paper Award, IEEE Globecom 2011 Best Paper Award, JSPS Invitation Fellowship in 2012, IEEE ICC 2013 Best Paper Award, NSERC DAS Award in 2016, IEEE ICDCS 2021 Best Poster Award and DND/NSERC DGS Award in 2021, and has been serving on the technical program committees of major computer communications and networking conferences including IEEE INFOCOM, ICC, Globecom, WCNC and CCNC. He was the Ad Hoc and Sensor Networking Symposium Co-Chair of IEEE Globecom 2012 and an Associate Editor of IEEE Transactions on Vehicular Technology. He is a senior member of the ACM and a Fellow of the IEEE.

 

Title:
Augmenting Human Intellect: The Mouse, The Mother of All Demos, The Unfinished Revolution
Date:
November 10th
6:45 PM (1.2 hours)
Location:
Recreation Center
Sunnyvale, CA
Abstract:

This is a hybrid in-person and online event. Pre-registration is required for either.

Doug Engelbart was an engineer who worked at Stanford Research Institute (later SRI International) from 1957 to 1986. On December 9, 1968, in San Francisco’s Civic Auditorium, he demonstrated a vision of computing that reached beyond calculation wherein computers could augment a human’s ability to understand and solve complex problems. Later called The Mother of All Demos, his vision included many aspects of computing that have become truly ubiquitous. Amongst these was the mouse, his invention which had its first public exposure on that day 58 years ago. He also demonstrated collaborative online editing, hypertext, video conferencing, word processing, spell checking, and revision control.

This talk will trace the development of Engelbart’s vision, which was first inspired by Vannevar Bush’s Memex of 1945, and which led to Engelbart’s 1962 paper Augmenting Human Intellect: A Conceptual Framework and his 1968 Demo. It will also explore the paradigm shift that he championed, and which we all use on a daily basis. Importantly, this talk will also discuss the unfinished revolution that Engelbart left us.

The timing of this talk coincides with other events happening later that week: SRI’s 80th anniversary celebration on Nov. 12, and the dedication of an IEEE Milestone for the Mouse on Nov. 13.

 

Title:
IEEE Hawaii November ExCom
Date:
November 10th
7:30 PM (1 hour)
Location:
Aloha Tower MarketPlace
Honolulu, HI
Abstract:

November Executive Committee Meeting

Title:
IEEE San Diego: SCAMP Milestone Dedication
Date:
November 11th
3:00 PM (3 hours)
Location:
RB Historical Society
San Diego, CA
Abstract:

Please join us for an IEEE Milestone dedication celebrating SCAMP, the Single Chip A-Series Mainframe Processor, designed and built at Unisys in Rancho Bernardo in 1987. An IEEE Milestone is one of IEEE's highest honors for historic technological achievement, and it is especially meaningful that this dedication will take place in the very community where SCAMP was created.

The Milestone plaque will be installed at the Rancho Bernardo History Museum, home of the Rancho Bernardo Historical Society, which preserves the rich history of the area. Technology has long been an important part of that history, and we hope this Milestone is the first of many to celebrate the technological advances made right here.

The celebration will include the plaque unveiling, presentations, and keynote speakers, followed by time to reconnect and celebrate. If you were part of SCAMP, Unisys, Burroughs, or related A-Series projects, we'd love to see you there. IEEE and community members are always welcome.

Registration is required to attend. Please register by October 26: https://cvent.me/eLPynG

Read more about the Milestone: IEEE SCAMP Milestone

We hope to see you there!

Title:
Eastern Idaho Section ExCom
Date:
November 11th
4:30 PM (1 hour)
Location:
3950 S Yellowstone Hwy
Idaho Falls, ID
Abstract:

Bi-Monthly ExCom Meeting held on the third Wednesday of every odd month. (Moved to November 11th to avoid conflicts with holiday travel.)

Title:
GSA Stanford Alum Panel
Date:
November 11th
5:00 PM (1 hour)
Location:
Stanford Electrical Engineering (room TBD)
Stanford, CA
Abstract:

Stanford IEEE and the Global Semiconductor Alliance (GSA) Talent Initiative present an industry panel featuring Stanford alumni from GSA partner companies across the semiconductor industry, followed by informal networking with the panelists.

Wednesday, November 11, 5-6 PM. Free and open to all Stanford students (undergrad and grad) in EE, CS, and related engineering programs.

Room TBD. Panelists are still being finalized. Details and RSVP: https://luma.com/tocxory8

Title:
From Fab to Boardroom: The Relationships That Actually Drive Careers
Date:
November 11th
5:30 PM (2 hours)
Location:
SCDI
Santa Clara, CA
Abstract:

Key Takeaways from this talk:

  - The 4 Types of People You Need In Your Corner for a Successful Career
  - What is Mentorship? And why do you need it?
  - How to be a good Mentor
  - How to be a good Mentee
  - How you can get started
  - Build your own personal Board of Directors for your Career today

Title:
IEEE Hawaii YP November ExCom
Date:
November 11th
7:30 PM (1 hour)
Location:
733 Bishop Street
Honolulu, HI
Abstract:

November ExCom

Title:
Seventh Annual IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP)
Date:
November 12th
8:00 AM (2 days)
Location:
UCLA
Los Angeles, CA
Abstract:

This 2-day symposium focuses on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging.  This includes failure modes, stress levels, mechanisms, testing schemes, accelerated testing, and environmental stresses.  The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliabilit-yrelated aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

Location: In person at UCLA, and over IEEE WebEx
Dates: November 12-13, 2026
Cost: ( for IEEE members, for WebEx) through Oct. 16

 

Title:
Co-Packaged Optics with Silicon Photonics for Chiplets Heterogeneous Integration
Date:
November 12th
4:00 PM (2 hours)
Location:
Qualcomm Building Q Auditorium
San Diego, CA
Abstract:

Co-packaged optics (CPO) are heterogeneous integration packaging methods to integrate the optical engine (OE) which consists of photonic ICs (PIC) such as the laser and photodiodes, and the electrical engine (EE) which consists of the electronic ICs (EIC) such as the laser driver and transimpedance amplifiers (TiA). The advantages of CPO are: (a) to reduce the length of the electrical interface between the OE/EE (or PIC/EIC) and the ASIC, (b) to reduce the energy required to drive the signal, and (c) to cut the latency which leads to better electrical performance. In the next few years, we will see more implementations of a higher level of heterogeneous integration of EIC and PIC with silicon photonics, whether it is for performance, form factor, power consumption or cost. The content of this lecture is shown below.

                  • Introduction
                  • Data Centers
                  • Optical Transceivers
                  • PIC and EIC
                  • OBO (on-board optics), NPO (near-board optics), CPO (co-packaged optics)
                  • 3D Integration of the PIC and EIC
                  • 3D Heterogeneous Integration of ASIC Switch, PIC and EIC
                  • 3D Heterogeneous Integration of ASIC Switch, PIC and EIC with Bridges
                  • 3D Heterogeneous Integration of ASIC Switch, EIC and PIC with Glass Packaging
                  • CPO with Silicon Photonics
                  • Summary and Recommendations

The schedule is as follows: 

4-4.30 pm - Networking

4.30-6 pm - Lecture

Title:
SRI at 80
Date:
November 12th
6:00 PM (1.5 hours)
Location:
Computer History Museum
Mountain View, CA
Abstract:

Inventing the Future

SRI has spent 80 years developing the technology that fuels the world we live in today: the internet, robotics, weather satellites, early human-machine AI, medicine, diagnostics and treatments, education programs, mapping, personal computing, and more. Celebrate with us and hear from some of the people who continue to deliver the future.

  • David Pogue, Moderator
  • David Parekh, SRI CEO
  • Adam Cheyer, Siri founder
  • Gary Guthart, Intuitive Surgical founder
  • Todd Grindal, SRI Education President
  • Celia Merzbacher, Executive Director of QED-C
  • Karen Myers, VP, Information and Computing Sciences and Lab Director, AI Center

More special guests to be announced soon!

 

Title:
AI Compute Orchestration: From Silicon to Systems
Date:
November 13th
9:00 AM (5 hours)
Location:
Paul G. Allen Building
Stanford, CA
Abstract:

Stanford IEEE, co-hosted with the IEEE Circuits and Systems Society (CASS) and Samsung Semiconductor, is holding a half-day technical workshop on how AI compute is designed and orchestrated, from the transistor up to the datacenter. It is open to Stanford students, staff, and faculty along with guests from the co-hosting organizations, and is aimed especially at undergraduate and graduate students in electrical engineering and computer science.

The program features talks and a panel from industry and Stanford faculty speakers, covering AI software, circuit design, advanced packaging, and hardware co-design, with time for audience Q&A. Speakers will be announced soon.

Admission is free and no registration is needed. Just show up! Light refreshments and lunch will be provided.

Details: https://luma.com/kv8u97ga

Title:
IEEE Milestone Dedication: SRI
Date:
November 13th
9:30 AM (2 hours)
Location:
Computer History Museum
Mountain View, CA
Abstract:

SRI will be honored with two new IEEE Milestones — designations that recognize technical achievements of lasting historical significance. The room will be filled with some of the people who made these innovations real. 

What to expect: 

  • Doors open at 9:30 am; coffee and light fare will be served 
  • Welcome and opening remarks from David Parekh, CEO of SRI 
  • The unveiling of two new IEEE Milestones
    • Invention of SRI’s Computer Mouse, 1961-1968
    • First Robotic Telepresence Surgery System, 1987-1995
  • Remarks from 2024 IEEE President, Tom Coughlin
  • A history of IEEE Milestone’s from Brian Berg, IEEE Region 6 Milestone Chair 
  • A moderated panel led by Pulitzer Prize-winning journalist and author John Markoff 

This is a rare chance to hear directly from the people who shaped these breakthroughs — and to be there when their contributions are formally written into the historical record. 

Title:
WIEE x IEEE Ice Cream and Trivia Social
Date:
November 13th
11:00 AM (2 hours)
Location:
San Luis Obispo, CA
Abstract:

Come join us for free ice cream and trivia!

Title:
Trustworthy Artificial Intelligence
Date:
November 13th
1:00 PM (5.5 hours)
Location:
University Union
Sacramento, CA
Abstract:

The IEEE Computer Society Sacramento Valley Chapter and California State University, Sacramento invite you to a workshop on Trustworthy Artificial Intelligence, an in-person event. This event brings together leaders from industry, government, and academia to share their expertise Cyber-AI integration. Industry experts will share what they are seeing on the front lines, from emerging attacks to the tools companies use to stop them. State agency leaders will present how the public sector is putting AI to work in cybersecurity, sharing real use cases from protecting government systems and services. University faculty will connect these real-world challenges to the latest research. 

AI now shapes decisions in government, industry, and daily life. For people to rely on it, AI must be secure, reliable, and resilient against attack. This workshop explores what it takes to build AI systems we can trust. Trust in AI can break down at any stage of a model's life. The program traces these risks from start to finish. It begins with supply chain attacks, where poisoned data can corrupt a model before it is ever deployed. It then turns to runtime, where threats like prompt injection and the OWASP risks for AI systems can manipulate a model's behavior. Finally, it examines autonomous AI agents, which face new dangers such as goal drift, memory tampering, and failures that spread across multiple agents.

Knowing the threats is only half the story. Speakers will share proven defense strategies, including threat modeling, risk frameworks, and lessons learned from securing AI in real-world deployments.

Trustworthy AI can also make us safer. Speakers will show how AI strengthens cyber defense and digital forensics through automated threat hunting, faster incident response, and smarter forensic investigation.

The day closes with student research presentations and an expert panel on the future of trustworthy and secure AI. This is a free event for IEEE members. IEEE basic membership is free. 

Please check the website for event updates. 

Title:
Volunteers Needed: FIRST Lego League Qualifying Tournament - Camarillo
Date:
November 14th
8:00 AM (8 hours)
Location:
VCOE Conference Center
Camarillo, CA
Abstract:

Once again IEEE Buenaventura Section is supporting middle school robotics by sponsoring the annual FIRST Lego League Robotics Tournament. The tournament will be on Saturday, November 14, 2026, at the Ventura County Office of Education Conference Center in Camarillo. Teams of robot enthusiasts age 10 to 14 will compete for a chance to go to the regional tournament. The IEEE has been generous in its support over many years both financially and in providing volunteers. It is a lot of fun and you will be greatly impressed with what these young people accomplish and their enthusiasm.

If you are available to volunteer from 8 AM to 4 PM we can definitely use you in a variety of roles, from assisting with judging, monitoring the games, and other jobs. No robotics experience is needed. Lunch and refreshments will be provided.

Please E-mail Deron Johnson and the planning team at fll-2026@ieee-bv.org to volunteer or ask questions. Feel free to pass this on to anyone you think might enjoy volunteering!

Title:
HAFB Museum Tour - focus on WWII Wendover Airfield
Date:
November 14th
12:00 PM (1 hour)
Location:
Hill Air Force Base Museum
HAFB, UT
Abstract:

Although you may have toured Hill Air Force Base Museum before, the purpose of this tour is to gain information around the World War II era activities at Wendover Airfield, now essentially a ghost town.

Our submission for an AIAA Historic Aerospace Nomination (similar to the already dedicated IEEE Milestone for Computer Graphics and the currently submitted IEEE Milestone Proposal on Cosmic Rays now in adjudication) is in preparation. Historical records are sparse, and the hope is to learn more from museum docents and each other. 

We know 20,000 people were stationed at Wendover Airfield in 1945.  They trained P47 fighter pilots and developed tactics for heavy bombers  (including nuclear bomb equipped B29 crews). The recent film "Oppenheimer" provided just a glimpse of the monumental effort of the Manhattan Project and did not touch the even bigger effort to design the B29 bomber that could cross immense distances flying above defending fighters. Wendover also tested the first US cruise missiles, the first air-to-air missiles , and the first glide bombs. Performance shortcomings of these programs urged rapid development of modern electronics guidance systems.

Students and young engineers will likely be shocked at the speed at which complex systems were developed and fielded under no excuses wartime pressure and without popular management theories embraced today. These past successful response to technical challenges and life hardships should provide incentive for us today.

 

RSVP required.

Title:
IEEE Foothill YP & Members: Connect, Innovate and Lead
Date:
November 14th
4:00 PM (2 hours)
Location:
Highlander Union Building (HUB), UC Riverside
Riverside, CA
Abstract:

 

IEEE Young Professionals — Connect, Innovate and Lead

Join us for a laid-back evening designed for students, new grads, and anyone navigating their next steps. No suits, no pitches, just people, games, and free food. When: November 14, 4:00 PM - 6:00 PMWhere: HUB, UC RiversideCost: Free Location: Highlander Union Building, 900 University Ave, Riverside, CA, UC Riverside campus What’s actually happening:- Bring a friend and yourself. Just come! (Please register all names)- Enjoy an icebreaker game.- Network for 3 minutes at a time.- Engage in real talk with young professionals and ask us anything.- Savor snacks, drinks, and good music. 
Title:
Phoenix is hosting leading edge AI power electronics and packaging at 3D-PEIM 2026
Date:
November 16th
8:05 AM (4 days)
Location:
ASU Skysong Building 3
Scottsdale, AZ
Abstract:
Explore the latest innovations and cutting-edge research tackling the rapidly evolving demands of AI – and the transformative challenges it is creating across power electronics, advanced packaging, heterogeneous integration, and vertical power delivery.  The conference is in Phoenix this year and it is a collaboration of IEEE, ASU and PSMA.  

 

This year's symposium places a special emphasis on AI challenges in Power Electronics and Packaging. We will be featuring distinguished plenary speakers: Kaladhar Radhakrishnan (Intel), Yi Zheng (Applied Materials), Cian Ó Mathúna (Tyndall National Institute), Madhavan Swaminathan (Penn State), Stephen Coates (Yuxuan Semi), and Rinkle Jain (NVIDIA), who will discuss topics including:

· Power delivery architectures for next-generation AI accelerators

· Vertical power delivery for AI computing and data centers

· Heterogeneous integration of Vertical power for AI

· AI-driven design, modeling, and optimization of power electronics

· Advanced packaging technologies for AI high-density power delivery

· Materials, thermal management, and reliability challenges for AI hardware

 

Whether your AI power challenges are for compute, power delivery networks, chiplet integration, advanced semiconductor packaging, thermal management, or next-generation power conversion, 3D-PEIM 2026 provides a unique forum to engage with the latest research and connect with leaders from academia and industry who are shaping the future of AI power solutions.

Further details for this event can be found at:  https://www.3d-peim.org/  
Title:
Excomm (Nov) - PES Chapter of IEEE Boise Section (Monthly)
Date:
November 16th
10:30 AM (1.1 hour)
Location:
Micron Engineering Center (MEC)
Boise, ID
Abstract:

This is the monthly PES chapter's Executive Committee meeting.  Typically, an hour to discuss old business and new business.

We focus on the upcoming events. 
Senior member activity, Section Picnic, and Holiday Party, Future City Event. + technical events.

Title:
IEEE PES Distinguish Lecture: The Role of HVDC and Power Electronics in Shaping the Future Electric Grid with Large Loads and Renewables
Date:
November 16th
5:00 PM (1 hour)
Abstract:


The electric power industry is undergoing substantial expansion across generation, transmission, and distribution infrastructure. This development is being driven by projected load growth, particularly from large-scale electricity consumers such as artificial-intelligence data centers and electric-vehicle charging facilities.

A substantial number of high-voltage direct-current (HVDC) systems and power-electronics-based Flexible AC Transmission System (FACTS) controllers are expected to be deployed across transmission and distribution networks. These technologies will be essential to serving the requirements of large new loads while facilitating the integration of renewable energy resources. 

According to Pike Research, HVDC transmission is emerging as one of the fastest-growing segments of the utility sector. Cleantech Market Intelligence reports that cumulative global investment in HVDC systems reached approximately US 0 billion between 2012 and 2020, with expenditures continuing to increase rapidly throughout the 2020s. Although a substantial share of this growth is concentrated in China and India, HVDC deployment is also accelerating across Europe, North America, Australia, and other regions as utilities address rising electricity demand and renewable energy integration requirements.

This presentation highlights the state-of-the-art in HVDC and FACTS technologies and explores new applications, including AC line conversion to DC and advances in converter designs such as modular multilevel voltage-source converters (VSCs)

 

 

Dr. Ram Adapa  is a Technical Executive in the Energy Delivery and Customer Solutions at EPRI. His research activities focus on High Voltage Direct Current (HVDC) transmission, Flexible AC Transmission Systems (FACTS), Custom Power, Fault Current Limiters, and Substation Seismic Studies.

Dr. Adapa joined EPRI in 1989 as a Project Manager in the Power System Planning and Operations program. Later he became Product Line Leader for Transmission, Substations, and Grid Operations where he developed the research portfolio and business execution plans for the Grid Operations and Planning areas. Some of the tools in this portfolio included market restructuring, transmission pricing, ancillary services, and security tools to maintain the reliability of the grid.

Before joining EPRI, Dr. Adapa worked at McGraw-Edison Power Systems (presently known as Eaton Cooper Power Systems) as a Staff Engineer in the Systems Engineering Department.

Dr. Adapa received a BS degree in electrical engineering from Jawaharlal Nehru Technological University, India, an MS degree in electrical engineering from the Indian Institute of Technology, Kanpur, India, and a PhD in electrical engineering from the University of Waterloo, Ontario, Canada.

Dr. Adapa is an IEEE Fellow and has been honored several times by IEEE for his outstanding contributions to the profession. He received the 2016 IEEE PES Nari Hingorani Custom Power Award and the 2023 IEEE PES Uno Lamm HVDC Award. He has authored or coauthored more than 125 technical papers and is an IEEE Distinguished Lecturer. He is an individual member of CIGRE and a Registered Professional Engineer.

 

Title:
Networking Reception: IEEE San Diego Section x IEEE CS Career Catalyst Scholars
Date:
November 16th
5:30 PM (3.5 hours)
Location:
Berkeley Ferryboat
San Diego, CA
Cost:
Admission fee may apply
Abstract:

** Attention: Attendance is limited to registered participants only. Capacity is limited.”

The IEEE Computer Society San Diego Chapter is organizing a Panel and Networking Event on Monday, November 16, 2026, from 5:30 PM to 9:00 PM at the Maritime Museum of San Diego. This event is part of the IEEE CS Career Catalyst Pilot Program, in collaboration with Qualcomm Technologies Inc., the program’s official industry partner.

The event will feature: 

  • Welcome address by Dr. Upal Mahbub, Chair of IEEE San Diego Section and Vice Chair (Industry) of IEEE CS Career Catalyst Program
  • A brief intro on the Maritime Museum of San Diego by Dr. Christina Brophy, President and CEO of MMSD
  • Overview of the IEEE CS Career Catalyst Program by Megha Ben, Chair of the IEEE CS Career Catalyst Program and  Scholar Felicitation / Certificate Distribution 
  • A distinguished panel moderated by IEEE San Diego Section and CS Chapter Chair Dr. Upal Mahbub and Megha Ben, featuring:
  • A social networking hour for the 15 Selected Career Catalyst Scholars and CS BoGs with local IEEE leadership, professionals, students, and volunteers. Attendees will have exclusive private access to the "Star of India". 

 

Loaction: Berkeley Ferry, Maritime Museum of San Diego, 1492 N Harbor Dr, San Diego, CA 92101

Parking outside of the museum is managed by the Port of San Diego and is a pay by plate system which is enforced daily from 10am-8pm. The rate is [vtools-xml.php] url[asc/6].50 an hour with a maximum of 3 hours a day per license plate.

Title:
Industrial Robotics Demo
Date:
November 17th
1:00 PM (2 hours)
Location:
Nampa Micron Education Center (MEC)
Nampa, ID
Abstract:

Join IEEE for a demonstration of industrial robotics and automation, featuring robotic arms and industrial robot systems such as those developed by ABB. Explore how robots are programmed, controlled, and integrated into automated manufacturing and industrial processes.

The demonstration will highlight safety and industrial automation application. Participants will gain insight into how functionality, design, and software work together to enable modern robotic applications.

This event is an opportunity for IEEE members, students, faculty, and industry professionals to see and discuss industrial robotics, real-world applications, and learn more about the technologies shaping advanced manufacturing.

Title:
IEEE Richland Section Ex-Com Meeting Nov 17
Date:
November 17th
5:45 PM (1.2 hours)
Location:
1435 George Washington Way
Richland, WA
Abstract:

Scheduling IEEE Richland EX-COM Meeting for 2026

Location: Round Table Pizza, 1435 George Washington Way, Richland, WA 99352

Food and social gathering at 5:45 PM, business meeting at 6:00 PM

Date(s) –  Nov 17

________________________________________________________________________________

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Title:
Rethinking Data Center Electrical Infrastructure: Challenges and Opportunities of 800VDC Power Systems
Date:
November 19th
5:30 PM (3 hours)
Location:
Zio Fraedo's
Pleasant Hill, CA
Cost:
Admission fee may apply
Abstract:

The unprecedented growth of artificial intelligence (AI) is fundamentally transforming data center design. Industry initiatives centered around 800VDC power distribution have emerged as a promising pathway to reduce conversion stages, improve energy efficiency, lower copper usage, and support ultra-high-density computing environments. This presentation will examine the technical and economic drivers behind the transition toward Direct Current (DC) data centers, including increasing AI workloads, growing power demands, and evolving sustainability requirements. It will provide an overview of current industry developments, emerging technologies, and architectural approaches. 

Title:
[ACM: Bluffdale] Fall Tech Talk 2026
Date:
November 29th
4:00 PM (2 hours)
Abstract:

We are sharing an event from the Bluffdale chapter of the ACM.

Time and date: 5 pm to 7 pm, Sunday, 29 Nov 2026

Format: in person and virtual via youtube live.

As IEEE Computer Society and ACM are sister societies, the admission fee for in-person attendance will be waived for IEEE Computer Society members. 

https://bluffdale.acm.org/events/fall-keynote-tech-talk-2026/

Recordings of past events: https://www.youtube.com/@BluffdaleACMChapter

 

Best

Robert Stewart

Title:
IEEE International Conference on Smart Connected Systems and Emerging Technologies (IEEE SCSETech 2026)
Date:
December 1st
9:00 AM (3 days)
Location:
Kellogg West
Pomona, CA
Abstract:

Dear Colleagues,

On behalf of the Organizing Committee, I am delighted to invite you to participate in the IEEE International Conference on Smart Connected Systems and Emerging Technologies (IEEE SCSETech 2026), to be held December 1–3, 2026, at CPP Kellogg West, Pomona, California, USA, in a hybrid format (in-person and virtual participation available).

IEEE SCSETech 2026 will bring together researchers, engineers, industry professionals, students, and technology leaders from around the world to explore innovations and emerging trends in:

• Wireless Communication & Networking
• Artificial Intelligence & Machine Learning
• Cybersecurity & Privacy
• Internet of Things (IoT) & Internet of Vehicles (IoV)
• Smart Power & Sustainable Systems

The conference program will feature:

🎤 Distinguished keynote speakers
📄 Peer-reviewed technical paper presentations
🛠 Workshops and tutorials
🎓 Student paper and poster sessions
🏭 Industry presentations and demonstrations
🤝 Networking opportunities, including a Welcome Reception and Gala Dinner

Accepted and presented papers will be submitted for publication in the IEEE Xplore Digital Library, subject to IEEE quality and publication requirements.

Important Dates

• Paper Submission Deadline: July 30, 2026
• Notification of Acceptance: September 6, 2026
• Camera-Ready Submission: October 2, 2026
• Conference Dates: December 1–3, 2026

Whether you are interested in presenting your research, learning about the latest technological advances, networking with experts, or exploring collaborative opportunities, IEEE SCSETech 2026 offers an outstanding platform for professional engagement and knowledge exchange.

For conference information, registration details, and updates, please visit:

🌐 https://www.ieeescsetech.com/

We look forward to welcoming you to IEEE SCSETech 2026.

Sincerely,

Dr. Tamer Omar
Conference Chair
IEEE International Conference on Smart Connected Systems and Emerging Technologies (IEEE SCSETech 2026)

California State Polytechnic University, Pomona
Pomona, California, USA

📧 tromar@cpp.edu
🌐 https://www.ieeescsetech.com/

Title:
IEEE Hawaii December ExCom
Date:
December 1st
7:30 PM (1 hour)
Location:
Aloha Tower MarketPlace
Honolulu, HI
Abstract:

December Executive Committee Meeting

Title:
IEEE OC PES/IAS Chapter ExCom Meeting - December 2nd 2026
Date:
December 2nd
6:30 PM (0 minute)
Abstract:

IEEE Orange County PES/IAS Chapter's ExCom meeting

All IEEE OC PES/IAS Chapter members are requested to attend this meeting. 

To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.

 

 

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
December 2nd
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
Toy Story Screening & Live Q&A with Pixar Co-Founder Ed Catmull
Date:
December 3rd
6:00 PM (3 hours)
Location:
CEMEX Auditorium (Knight Management Center)
Stanford, CA
Abstract:

An evening with Pixar co-founder Ed Catmull, hosted by Stanford IEEE: a live interview and Q&A with Ed, followed by a screening of the original Toy Story.

Thursday, December 3, 6-9 PM at CEMEX Auditorium. Free. Students, faculty, staff, and families are all welcome (kids with a parent or guardian).

Details are tentative. Details and RSVP: https://luma.com/zfh6spdm

Title:
Volunteers Needed: FIRST Lego League Regional Tournament - Ventura
Date:
December 6th
8:00 AM (8 hours)
Location:
Ventura High School
Ventura, CA
Abstract:

The FIRST Lego League regional tournament will be on Sunday, December 6, 2026, at Ventura High School. Teams of robot enthusiasts age 10 to 14 will compete for a chance to go to the regional championship. It is a lot of fun and you will be greatly impressed with what these young people accomplish and their enthusiasm.

If you are available to volunteer from 8 AM to 4 PM we can definitely use you as a judge. No robotics experience is needed. Lunch and refreshments will be provided.

Please E-mail Deron Johnson and the planning team at fll-2026@ieee-bv.org to volunteer or ask questions. Feel free to pass this on to anyone you think might enjoy volunteering!

Title:
IEEE Hawaii YP December ExCom
Date:
December 9th
7:30 PM (1 hour)
Location:
733 Bishop Street
Honolulu, HI
Abstract:

December ExCom

96 meetings. Generated Friday, October 16 2026, at 1:34:06 AM. All times America/Los_Angeles