Meeting Announcement: San Diego IEEE Life Members Affinity Group – Tuesday, June 23, 6 pm

Join us for our upcoming gathering!

We are pleased to announce the next meeting of the San Diego IEEE Life Members Affinity Group. All members are warmly invited to join us for an evening of camaraderie, conversation, and connection.  This will be an in person meeting.

·       Date: Tuesday, June 23, 2026

·       Time: 6:00 PM – 8:00 PM

·       Location: Crust Pizzeria

·       124 Solana Hills Dr.

·       Solana Beach, CA 92075

·       Phone: 858.356.9925

Topic for Discussion:  San Diego IEEE Life Members Affinity Group (LMAG) have indicated an interest in giving back to our local San Diego community to support the development of future young engineers.  This can be done in the form of participating in youth STEM (Science, Technology Engineering, and Math) activities.   Contacts have been made with San Diego Generation STEAM, and they have indicated an interest in working with the San Diego IEEE LMAG.   They have suggested having IEEE LMAG participate in high school workshops, compsny tours, career panels, educator/industry connection events, and the annual San Diego Festival of Science and Engineering.

If you have any questions or require further information, please contact the venue or reach out to Bill Torre, 619-417-9410. We look forward to seeing you there!

Virtual meeting access will also be provided, below is a Webex link:

Webex Meeting Information:

IEEE Life Member Affinity Group Meeting

Tuesday, June 23, 2026

6:00 PM  |  (UTC-08:00) Pacific Time (US & Canada)  |  2 hrs

Join WebEx meeting

https://ieeemeetings.webex.com/ieeemeetings/j.php?MTID=m98a153e58cadf833d329053c59029989

Meeting number:

2539 203 0021

Meeting password:

PNfp3nb6km3

We are thrilled to host LLNL’s 30th Center for Advanced Signal and Image Sciences (CASIS) workshop. The workshop returns with a full 2-day in-person schedule on Wednesday and Thursday, June 24-25, 2026.

We encourage a broad range of technical topics at the workshop and being non-archival  apart from original work, we are also considering intermediate results from ongoing efforts as well as recently published publications for presentation as a talk and/or a poster. The goal of the workshop is to provide a platform for the exchange of ideas and network with peers across disciplines to foster collaboration and build community. Please submit your abstract by Friday, May 15, 2026. Authors will be notified of the review decisions one week later on May 22,  2026.

Apart from the regular presentation track we will feature parallel tutorials, hands-on mini workshops and a dedicated student track to introduce career opportunities at LLNL.

The workshop will be held in-person at the University of California Livermore Collaboration Center (UCLCC) and requires pre-registration until June 18, 2026. As this is a 2-day whole-day workshop, we will provide coffee and snacks in morning and afternoon breaks as well as a lunch on both days. As this is our 30th anniversary, we will also host a Happy Hour following the regular program on Wednesday, June 24, 2026.

CLICK HERE FOR TALK SUBMISSION, REGISTRATION AND MORE

This year’s workshop features presentations in the following tracks, moderated by the Program Chairs:

• AI/Machine Learning (PhanNguyen, Kowshik Thopalli)
• National Ignition Facility (Eugene Kur, Christopher Miller)
• Non-Destructive Evaluation (Seemeen Karimi, Harry Martz)
• Quantum Sensing & Quantum Computing (Kristi Beck)
• Remote Sensing, Non-Invasive Imaging & Inverse Problems (Sean Lehman, Viacheslav Li)
• Robotics & Automation (Aldair Gongora, Abhik Sarkar)
• Student Track: All topics (Poster only) (Ted Bauman, Min Priest)

Become part of this great experience and submit your talk proposal at https://engineering.llnl.gov/centers/casis/workshops before May 15, 2025!

Check out this report for last year’s amazing event to see what to expect!

The no-fee CASIS Workshop is sponsored by the LLNL Engineering Directorate and held at the University of California Livermore Collaboration Center (UCLCC). It is organized by the Center for Advanced Signal and Imaging Sciences (CASIS), and is a joint meeting with the local chapters of the IEEE Signal Processing Society and IEEE Computer Society. supported by the IEEE Oakland East Bay Section.  

The Innovation in Action: WIE Case Challenge is designed to strengthen the connection between academia, technology, and industry by bringing students and professionals together in a collaborative and engaging environment. During the event, students will be grouped with industry professionals and mentors to work as teams on a real-world engineering or technology-related challenge. Participants will have the opportunity to exchange ideas, develop innovative solutions, strengthen leadership and teamwork skills, and build meaningful professional connections while learning from one another’s experiences and perspectives.

IEEE Annual Summer Top Golf Event - Boise Section
Hosted by the Computer Society, Women in Engineering & Young Professionals Chapters.

Join us for the IEEE Summer Golf Event, hosted in collaboration with the Young Professionals (YP), Women in Engineering (WIE), and Computer Society (CS) Chapters. This is a great opportunity to network with fellow IEEE members, enjoy a round of golf, and strengthen connections across our chapters. All skill levels welcome!

Event Details:

• Date: June 25, 2026
• Time: 6:00 PM - 8:00 PM (local time)
• Location: Top Golf, Meridian

Rules & Regulations

1. Eligibility – Open to all IEEE members, students, and professionals in the STEM community. Non-members are warmly encouraged to attend and experience the IEEE network firsthand.
2. Registration – Early registration is strongly encouraged as spots are limited. Register online in advance to secure your place. Walk-ins will be accommodated on a first-come, first-served basis, subject to availability.

EMC Scan Technologies"

Near field scanning is a widely known and well received method for component, module and system EMC characterization. One specific emission scan technology, called the NF EMI scan, is the most common scan technology, but the immunity scan is relatively less known and less widely used. Three immunity and two emission scan technologies will be presented: ESD Scan, RF Immunity Scan, Current Spreading (CSP) and Phase Measurement Scan.

ESD scan is a very effective scan technique to debug or pre-screen components or modules that are more likely to cause problems (specially soft failures) before they are integrated to a system. Its main goal is localizing weak spots or traces causing ESD gun test failures with a well-controlled disturbance source.

RF Immunity Scan is very similar to ESD scan in concept, but it is a narrow-band scan while the ESD scan is a wide-band.

Most currents injected by an ESD gun follow the intended path by design, but a small amount causing system upset can flow through an unexpected route. CSP (Current Spreading) is a visualization technique for surface current flows, which identifies unexpected current paths and can verify ESD protection design.

Phase information helps improving accuracies of modeling of EUT's for simulation or can be directly used for specific applications. Specific application of the phase information will be introduced after brief review of simultaneous magnitude and phase measurement in time and frequency domain.

Power electronics is a foundational technology that drives a wide range of important and emerging applications including cloud computing, wireless communications, robotics, and smart energy systems. By systematically managing the increased complexity in materials, circuits, and systems, new opportunities are created to greatly advance the functionality and performance of power electronics systems.

This speech provides a few examples to illustrate the potential of managed complexity in power electronics design. These include: 1) modular and scalable architecture for systematically managed complexity in high performance circuits; 2) artificial intelligence and machine learning for systematically managed complexity in passive component modeling. This managed complexity approach addresses key challenges in emerging applications by overcoming traditional design barriers from new angles and redefining how power electronics are conceived and implemented in complex systems.

As emerging technologies such as artificial intelligence, autonomous systems, and large-scale digital platforms become increasingly integrated into society, the need for responsible technology governance has never been greater. This educational session introduces participants to the DIITA Principles (IEEE Standards Association Industry Connections Program), a human- and planet-centered approach to guiding the design, deployment, and oversight of technology in an era of rapid innovation.

Through an accessible exploration of governance, ethics, sustainability, transparency, and accountability, attendees will examine how technological decisions can create lasting impacts on individuals, communities, institutions, and the environment. The session highlights the importance of aligning innovation with broader societal goals, including long-term human well-being, environmental stewardship, and sustainable development.

Drawing on real-world examples from AI, digital transformation, and emerging technologies, participants will gain insights into the DIITA Principles and their role in promoting responsible technology governance. The discussion will examine how these principles can help align innovation with human values, environmental sustainability, and long-term societal resilience. Participants will also explore how the DIITA Principles can provide a common framework for collaboration among technologists, policymakers, researchers, educators, and industry leaders working toward human and planetary flourishing.

Designed for engineers, technology professionals, students, and decision-makers, this educational program aims to raise awareness of the critical role governance plays in shaping technology that not only advances innovation but also contributes to a more sustainable, equitable, and flourishing future for both humanity and the planet.

Event Link: Learning Responsible Technology Governance: Insights from DIITA Principles
Friday, June 26 · 10:00 – 11:00am
Time zone: America/Los_Angeles
Google Meet joining info
Video call link: https://meet.google.com/msp-ckde-jku
Or dial: ‪(US) +1 352-612-0360‬ PIN: ‪759 341 055‬#
More phone numbers: https://tel.meet/msp-ckde-jku?pin=5804341574795

Please join us for the IEEE Alaska Section’s June meeting on Friday, 6/26/2026 at 11:30am AKDT

The meeting will be totally virtual, via Zoom.

Cory Stansbury, Long Duration Energy Storage Chief Technologist with Westinghouse will present on their Long Duration Energy Storage Technology and Development.

https://westinghousenuclear.com/data-sheet-library/long-duration-energy-storage-ldes/

IEEE Orange County PES/IAS Chapter's ExCom meeting

All IEEE OC PES/IAS Chapter members are requested to attend this meeting. 

To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.

A professional networking and community-building event organized by the IEEE Women in Engineering (WIE) Affinity Group in Hawaii. The event aims to bring together students, researchers, and industry professionals to foster mentorship, technical exchange, and career development in engineering and related STEM fields.

The event will include a short welcome session, informal networking, and light refreshments to encourage conversation and engagement among attendees. By providing a relaxed and inclusive environment, the activity supports WIE’s mission of promoting diversity, inclusion, and retention of women and underrepresented groups in engineering.

San Diego IEEE Women in Engineering along with Scripps Institution of Oceanography| UC San Diego are hosting an exclusive tour of the Scripps Pier. 

Limited number of participants can participate.  Register early to secure your participation in this unique opportunity tour and support San Diego's exclusive research platform and Women in Engineering. 

July ExCom

Come join us for a group hike on July 11 and/or July 18 at Tiger Mountain near Issaquah! Great Saturdays to enjoy the scenery near I-90 and other parts of the wilderness in Washington State! There will be refreshments and drinks served throughout the event.

Meet at the parking lot near the starting point:

• Preston Park & Ride: Parking lot, 30303 SE High Point Way, Issaquah, WA 98027

We meet at those parking lots around 10:00 AM and start the ground hike around 10:30 AM. More details will be provided when it's closer to the event date.

If you have any questions or want to share input on carpool meetup locations for transportation, please email the organizers:

• John Vertner, john.vertner@ieee.org
• Nicklaus Thompson, nicklaus_thompson@ieee.org

This talk presents advances in power management of power electronic converters within modern microgrids, emphasizing efficiency, stability, and resilience under dynamic operating conditions. It highlights the role of real-time validation techniques, including hardware-in-the-loop (HIL) simulations, which enable rapid testing of control strategies without risking physical assets. The discussion extends to power hardware-in-the-loop (PHIL) testbeds, where actual power devices interact with simulated networks, offering a more accurate representation of real-world performance. These approaches significantly reduce development time while improving reliability and scalability of microgrid systems. The talk also explores emerging opportunities for power electronics engineers in fusion energy, where advanced converters and control systems are critical for handling extreme power levels and ensuring stable operation. Overall, the presentation underscores the convergence of simulation, hardware validation, and next-generation energy applications in shaping the future of power electronics.

About the Speaker:

AI That Works for You: Tools, Prompts, Privacy — and How A Warship Taught Itself History

Generative AI is everywhere — but using it effectively, safely, and without surrendering your data is a skill most people are still developing. This quarter's OEB LMAG lunch brings together and local Higher Ed leader and a CIO, two seasoned practitioners for a practical, hands-on session on getting real value from AI tools. Roger Doering, Professor of Engineering at Cal State East Bay, leads the main program on leveraging generative AI effectively and safely — covering tools, approaches, prompting strategies, and critical privacy and security considerations. He's joined by Mark Rowell, CIO of the USS Hornet Museum, who adds a fascinating real-world dimension: what happens when you build your own private LLM on a historic warship's institutional knowledge. Live demos included. Bring your questions — and your appetite.

Generative AI tools have moved from novelty to necessity — but the gap between casual use and genuinely effective use is wide. For users with concerns about accuracy, privacy, security, and institutional knowledge, the public-cloud nature of most AI tools raises real questions.
This session addresses both sides of that challenge. Roger Doering brings academic and professional rigor to the question of how to get the most from generative AI — what works, what doesn't, and how to stay safe while doing it. Mark Rowell then demonstrates what the far end of the privacy spectrum looks like in practice: a fully private LLM, built on Google's NotebookLM, trained on 165 sources of institutional knowledge about one of America's most historic naval vessels.
Together, they cover the landscape from everyday AI productivity to purpose-built institutional intelligence — with plenty of time for hands-on exploration, demos, and the kind of frank conversation that only happens over a good lunch.

WHAT YOU'LL COVER

•      Generative AI tools landscape — what's worth your time in 2026 and why

•      Prompting that actually works — practical approaches and live examples

•      AI privacy and security — what you're sharing, with whom, and how to protect yourself

•      Hands-on demos — try it yourself, not just watch it, so bring a laptop

•      The private LLM case study — how the USS Hornet built a closed, curated AI from 165 institutional sources

•      Real-world use cases from the Hornet's deployment — docents, educators, researchers, and visitors

•      Open discussion — bring your own AI questions, frustrations, and experiments

Co-Sponsored by the Photonics Chapter

    As silicon photonics and co-packaged optics (CPO) technologies continue to scale for AI, cloud, and high-bandwidth networking applications, reliability qualification methodologies are becoming increasingly critical.  While much of the industry focus has been on performance and integration density, standardized approaches for qualification, reliability assessment and long-term service life prediction remain an important industry challenge.   
    This webinar will present the motivation, structure, and key technical considerations behind the emerging JEDEC work that Cisco has led on Silicon Photonics Qualification and Reliability Requirements.  The session will discuss reliability expectations and qualification strategies for silicon photonics devices, chiplets, integrated optical assemblies, and heterogeneous integration approaches used in AI and datacenter applications.  The webinar is intended for engineers and technologists working in silicon photonics, advanced packaging, NPO, CPO, datacenter infrastructure, reliability engineering, semiconductor manufacturing, and optical module development.

Global data center power demand is forecast to rise by 160% to 165% by 2030, with AI driving the majority of this surge. By 2030, worldwide electricity use by data centers is expected to reach 945 TWh. By 2035, demand is projected to soar further to 1,300 TWh globally, with AI making up 70% of total data center power.

Nuclear power reactor is considered to be one of the most viable solutions to fulfill this surge in energy demand caused by AI. 

In this talk, we will examine what is the current state of nuclear power generation, what is the projected growth, cost involved and comparison with conventional energy solutions and alternate energy sources such as Solar and Wind.

How are companies actually adopting AI today?

This informal IEEE networking session is designed for engineers, researchers, and industry practitioners to share real-world experiences around AI adoption — what’s working, what’s not, and where teams are facing challenges.

This is not a talk or presentation.
There are no slides — just a curated, peer-level discussion.

Topics may include:

• Where teams are in their AI adoption journey (experimentation → production)
• Use of LLMs and AI systems in real-world workflows
• Challenges in scaling AI beyond prototypes
• Measuring impact and ROI
• Build vs. buy decisions

The session is intentionally kept small to enable meaningful interaction.

• Short introductions (name, role, current AI focus)
• Open discussion guided by participant experiences
• Informal networking

• Engineers and ML practitioners working on AI systems
• Product and platform leaders involved in AI adoption
• Founders and technical decision-makers
• Researchers interested in applied AI systems

• No presentations or sales pitches
• Participation is encouraged — come ready to share and learn
• Limited capacity to maintain quality of discussion

Chhavi Jain
Vice Chair, IEEE Signal Processing Society – San Diego Chapter

This session is part of an ongoing IEEE initiative to connect practitioners working on real-world AI systems and deployment challenges.

Paving the AI Superhighway: Where Power Meets Intelligence

As part of our 2026 year-round symposium series themed “AI Super-Highway”, this symposium will focus on advanced power technologies for AI era and will be held at Intel SC-12 Auditorium: 

3600 Juliette Ln, Santa Clara, CA, 95054, on Saturday, July 18th, 2026, 1:00 PM to 5:00 PM

This summer symposium concentrates on the critical power and energy infrastructure that underpins the continued evolution and scaling of artificial intelligence. Particularly, it will explore how the rapid expansion of AI is reshaping the global power landscape. The symposium aims to bring together leading pioneers from industry and academia to discuss key challenges, recent innovations, and future opportunities at the intersection of AI and the power sector. 

STAY TUNED.. more information to be announced.

IEEE-USA will be streaming this presentation on our social channels. The webinar will be recorded.

Battling Burnout: How to Stay Effective When the Demands Don’t Stop is a practical, research-informed professional development workshop for high performers, leadership teams, and career-serious professionals. Led by David Sandhu, a former rocket scientist turned leadership speaker, the session helps participants understand how burnout builds gradually and gives them a clear framework for sustaining high performance without running themselves into the ground. Participants learn how to recover from stress, understand their real capacity, make better trade-offs under pressure, set boundaries without damaging their reputation, align their time with what matters most, and protect their energy and identity long term. 

Please attend the 2026 IEEE Oregon Section Summer Social at Next Level Pinball Shop & Museum

EXCOM Meeting for IEEE PES Seattle Officers 

Three-dimensional NAND flash memory has become a cornerstone of modern data storage, powering everything from mobile devices to hyperscale data centers fueling the AI revolution. As the industry pushes toward both higher storage density through aggressive 
vertical scaling and faster operation to meet the demands of next-generation highperformance SSDs, low-latency AI/ML workloads, and real-time data-intensive applications, the challenges of maintaining robust device reliability grow increasingly complex. This talk provides an industry perspective on the co-evolution of 3D NAND density and performance, covering advances in cell architecture and scaling strategies alongside the reliability challenges that arise when optimizing for both capacity and speed. The presentation will also share practical insights on working as an engineer in the semiconductor memory industry and the career path from academia to industry, aimed at students and young professionals entering the field

Join us for the upcoming technical talk —attend in person at Stockman’s Restaurant or virtually via Microsoft Teams 

Title:

Accelerated Qualification of Novel Nuclear Structural Materials: Multiphysics Simulations of a MEMS-Based Creep Device Under Ion Irradiation

Abstract:

Qualification of structural materials for advanced nuclear reactors requires testbeds capable of
simultaneously replicating and monitoring high temperatures, irradiation, and mechanical stress.
This talk presents a multiphysics modeling framework for the design and optimization of an in-
situ testbed for measuring irradiation creep and thermal fatigue.
The testbed couples a silicon MEMS device with ion irradiation and scanning electron
microscopy to enable real-time mechanical testing under irradiation. Finite element simulations
developed in CUBIT and BISON resolve the coupled thermal, electrical, and mechanical
response of the MEMS device and quantify induced strain in the sample. Geometry optimization
of the MEMS device is performed to achieve uniform temperature and strain fields in the test
sample.
Results demonstrate that the multiphysics framework reduces reliance on iterative physical
prototyping in testbed development and provides a reproducible basis for geometry and loading
parameter selection in nuclear materials testing.

Speaker: Akanksha Parmar
Postdoctoral Research Associate
Idaho National Laboratory

Akanksha is a Postdoctoral Research Associate in C650 department at INL, where her research
focuses on computational modeling of nuclear fuels, including high burnup structure, chromia-
doped UO₂, and annular fuel pellets, using advanced constitutive models such as crystal
plasticity.
She received her Ph.D. in Mechanical Engineering from Purdue University, where she combined
multiscale modeling with hands-on fabrication, processing, and characterization to study
microstructure evolution during additive manufacturing. She holds an M.S. in Aeronautics and
Astronautics from Purdue University, where her thesis focused on multiscale modeling of
composite structures.