Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.  

3rd Lecture of IEEE CS San Diego's 2026 Invited Seminar Series (Virtual)

The theme of the NWESS 2026 conference is Powering Progress “Navigating a Transforming Utility Landscape”. 

NWESS 2026 is a 2 day symposium that focuses on a wide range of topics and provides information on how to best address some of the most pressing energy issues facing our region.

The symposium is an industry driven conference; the topics are suggested and voted on by the Industry. The symposium is a combination of presentations and discussions.

Key Note Speakers to open the conference 

• Michel Vargo, Puget Sound Energy

Topics to be presented at NWESS 2026 include:

• Risk Based Management (wildfire mitigation)
• Seismic Transformer Study
• Transformer Loading
• AI for Power Utilities by NVIDIA & NEETRAC
• Preparing for Middle Housing and EPRI Tool for Secondary Design
• Load Seer - Top Down and Bottom Up and how you plan for electrification and climate change
• Data Center Load Growth -The Opportunity, The Risk and the Reality
• Integrated Load Planning Study
• EPRI E-Roadmap Tool / NEVI
• The Grid Center for Reliable Electricity Delivery (GridCRED)

NWESS  is sponsored by the electric energy industry in the Pacific Northwest, the IEEE and the Electrical Energy program at the University of Washington.

University of Washington, Dept. of Electrical & Computer Engineering

Pacific Northwest National Laboratory

Bonneville Power Administration

Electric Power Systems Inc

Snohomish County PUD

Puget Sound Energy

Seattle City Light

Peninsula Light

Tacoma Power

Chiplet and disaggregated architectures are rapidly becoming mainstream across applications from edge to server. Yet the resulting design complexity exceeds the capabilities of today’s tools, flows, and methodologies—particularly when aiming for highly optimized solutions at scale.

Augmented Intelligence, the combination of human expertise and machine intelligence, offers a transformative approach to this challenge. By assigning strategic, high-level decision-making to engineers and delegating computationally intensive, iterative tasks to AI, this framework enables multi-level and multi-domain optimization. The result is the ability to generate a far greater number of custom-optimized designs with the same resources—delivering competitive products with higher quality and faster time-to-market.

At Intel, in collaboration with partners, we have developed and deployed Augmented Intelligence solutions spanning silicon to system design and hardware to software design. These efforts have demonstrated efficiency gains exceeding 90% in critical areas. In this talk, I will share practical examples and key insights from several years of applying Augmented Intelligence to end-to-end design, highlighting how human–AI collaboration is reshaping the path to innovation.

There will not be any recording.  Please attend in person.

Consultants Network Meeting

Synopsis:
Please feel free to check out the work and thoughts of Prof. Ethem Alpaydın, Ph.D., https://mitpress.mit.edu/author/ethem-alpaydn-10375/ on Google Scholar at https://scholar.google.com/citations?user=lXYKgiYAAAAJ&hl=tr and generally on the Internet.

Then, please feel free to submit your questions to Prof. Ethem Alpaydın

• via Twitter by using the hashtag #ProfAlpaydinAMA and tagging @vishnupendyala
• emailing vspendyala(at)hotmail(dot)com with #ProfAlpaydinAMA in the subject

Selected questions will be answered by Prof. Alpaydin during the session. The audience may be able to ask follow-up questions during the session, using the Chat feature.

By registering for this event, you agree that IEEE and the organizers are not liable to you for any loss, damage, injury, or any incidental, indirect, special, consequential, or economic loss or damage (including loss of opportunity, exemplary or punitive damages). The event will be recorded and will be made available for public viewing.

Pierre-Olivier Jubert of Western Digital will review the design and characterization of media used in heat-assisted magnetic recording (HAMR). 

Dr. Peter Kinget from Columbia University will be presenting a Distinguished Lecturer Seminar titled "Circuit Labs at the Lunch Table with MOSbius" on Friday April 3rd at 11:00 AM. Attendance will be eligible for seminar credit.

Peter Kinget and his team of researchers at Columbia University developed the MOSbius platform to bring the world of analog design out of the simulator and onto the lab bench. Test and measurement of analog circuits is tricky but the "aha" moments when the circuits come to life brings a satisfying payoff that often leaves lasting impressions. If you would like to read more, take a look at the free article from SSCS Magazine Summer 2025 - Tinkering With CMOS Circuits at the Lunch Table With MOSbius [Education Corner] and consider attending this presentation.

Quantum Computers are expensive to build, take time to run, and are prone to noise and faults which reduce qubit reliability. Quantum software programmers can benefit from ways to validate whether or not quantum programs behave as expected without running or simulating a full program. This talk will present the Quantum State Preparation Program Validation Framework (QSV), a framework that uses property-based testing to validate whether or not quantum programs meet user-specified properties.

Networking event at the Maritime Museum in San Diego

Collaborative event with the Southwestern College Student Branch and UCSD Computer

Society Student Chapter

SDSU is the main OU organizing the event

Continuation of Stanford IEEE Speaker Series

VexU Competition at LAVC 

Agenda:
* Shunt Reactors: How controlled switching started
* Cap Banks and Filters: Turning them into FACTS through controlled switching
* HV Transformers: Latest developments for a seamless connection to the grid
* MV Transformers: Inverter-based distribution energy resources and IEEE 1547 compliance

ADVANCE REGISTRATION REQUIRED

Come join us in Kemper hall to learn about Careers in Electronics and professional development for ECE students. Mr. Larry Lapides will be speaking to our club, so come prepared with any industry questions.

IEEE Alaska Executive Committee Meeting

Tuesday, April 7, 2026 ⋅ 6:00 – 7:30pm (Alaska Time - Anchorage)

Jeremie Smith is inviting you to a scheduled Zoom meeting using the IEEE Alaska Section Account

Join Zoom Meeting
https://zoom.us/j/98832778456?pwd=WnhVWFpOOGQ0YkZEVnlqMlJjWG5lZz09

Meeting ID: 988 3277 8456
Passcode: 269832

Please register if you will be attending.

This is a social event for our students and members to engage with each other and learn more about our goals.

High Voltage DC Transmission has seen rapid technology advances in the last 20 years driven by the implementation of VSC (Voltage Source Converters) at GW powers and in particular introduction of MMC (Modular Multilevel Converters). The development of interconnected DC transmission grids requires significant further advance from the existing point-to-point HVDC links. It is widely believed that complex DC power grids can be built with comparable performance, reliability, flexibility and losses as traditional AC grids. The primary motivation for DC grid development is the need for power flow and trading between many DC terminals, as an example in the proposed (350 GW) North Sea DC grid, or EU-wide overlay DC grid. AC transmission is not feasible with long subsea cables, and it is inferior to DC systems in many other conditions. This presentation addresses the options and challenges with DC grid development, referring also to state-of-art technology status.

Zhangbei 4-terminal DC system (China, 2020) represents the first implemented GW-scale meshed DC transmission grid, which employs bipolar ring topology with overhead lines and 16 DC Circuit Breakers. However, multiple studies illustrate advantages of some radial, hub-based or segmented topologies, because of component costs, and challenges with interoperability, ownership, DC markets, operation, security and reliability.   

MMC concepts, including half-bridge and full-bridge modules, will underpin DC grid converters and further advances like hybrid LCC/MMC converters have been implemented recently. DC/DC converters at hundreds of MW are not yet commercially available but there is lot of research world-wide, and some lower-power prototypes have been demonstrated. DC/DC converters may take multiple functions including: DC voltage stepping (transformer role), DC fault interruption (DC CB role) and power flow control. Multiport DC hubs can be viewed as electronic DC substations, capable of interconnecting multiple DC lines.

Very fast DC CB circuit breakers (2 ms) have become commercially available recently, but the cost is considerably higher than AC CBs. Slightly slower mechanical DC CBs (5-8 ms) are also available from multiple vendors, while new technical solutions are emerging worldwide for achieving faster operation with lower size/weight/costs. 

DC grid modelling will face the new challenge of numerous converters dynamically coupled through low-impedance DC cables/lines. A compromise between simulation speed and accuracy is required, leading to some average-value modelling, commonly in rotating DQ frame, but capturing very fast dynamics and variable structure to represent fault conditions.

The principles of control of DC grids have been developed. DC systems have no system-wide common frequency to indicate power unbalance, and voltage responds to local and global loading rather than reactive power flow. DC grid dynamics are 2 orders of magnitude faster than traditional AC systems and most components will be controllable implying numerous, fast control loop interactions. Because of lack of inertia, and minimal overload capability for semiconductors, DC grid primary and secondary control should be feedback-based (man-made), fast, and distributed. International standardization efforts have begun.

The protection of DC grids is a significant technical challenge, both in terms of components and protection logic. The selectivity has been demonstrated within 0.5 ms timeframe using commercial and open-source DC relays. Nevertheless, grid operators have expressed concerns with self-protection on various components, back-up grid-wide protection, interoperability, and in general if we can achieve power transfer security levels comparable with AC grids and acceptable to stakeholders.

In this presentation, I will present some of the recent progresses in building conversational agents, with a focus on the speech modality. I will introduce desirable properties of such systems and explain some of the key concepts, core ideas, and main technologies developed in practical systems.

EMBS Phoenix Chapter 2026 Meet & Greet

The EMBS Phoenix Chapter officers are excited to host our first in-person meeting in 2026, where we can meet our local community of biomedical engineers and practitioners and hear from one of our officers, Vishnu Prateek Kakarapathi on wearables + AI development from his graduate research at ASU. We look forward to meeting our membership, prospective members, networking, and planning what we want to do together next!

Pizza and light refreshments will be served.

We look forward to expanding our local EMBS chapter, so please bring a friend, or two.

Chiplets have become a compelling approach to scaling and heterogeneous integration e.g. integrating workload-specific processors and massive bandwidth memory systems into computing systems; integrating die from multiple function-optimized process nodes into one product; integrating silicon from multiple businesses into one product. Chiplet-based products have been produced in high volume by multiple companies using proprietary chiplet ecosystems. Recently, the community has proposed several new standards (e.g., UCIe) to facilitate integration and interoperability of any compliant chiplet. Hyperscalers (e.g., Google, Amazon) are actively designing high volume products with chiplets through these open interfaces. Other communities are exploring the end-to-end workflow and tooling to assemble chiplet-based products. High performance computing can benefit from this trend. However, the performance, power, and thermal requirements unique to HPC, present many challenges to realizing a vision for affordable, modular HPC using this new approach. Architectural modeling and simulation will play a critical role in pathfinding for this new potential direction for HPC beyond Exascale.

(NOTE: This event is only open to SJSU students, faculty and staff.)

Silicon Valley is commonly acknowledged as the tech capital of the world. How did Silicon Valley come into being, and what can we learn for our own careers? The story goes back to local Hams trying to break RCA's tube patents, Stanford "angel" investors, the sinking of the Titanic, WW II and radar, and the SF Bay Area infrastructure that developed –these factors pretty much determined that the semiconductor and IC industries would be located in the Santa Clara Valley, and that the Valley would remain the world’s innovation center as new technologies emerge –digital, then software, biotech, VR, autonomous vehicles, artificial intelligence, LLMs –and be the model for innovation worldwide.
This talk will give an exciting and colorful history of development and innovation that began in Palo Alto in 1909. You'll meet some of the colorful characters –Cyril Elwell, Lee De Forest, Bill Eitel, Charles Litton, Fred Terman, David Packard, Bill Hewlett, Bill Shockley and others –who came to define our worldwide electronics industries through their inventions and process development. You'll understand some of the novel management approaches that have become the hallmarks of its tech startups. In this talk, the key Silicon Valley attributes will be illustrated and analyzed, for consideration by engineers interested in creating their own start-ups and high-tech businesses, working for them, or simply understanding them.

Hear about chip design from our guest speaker Jigneshkumar Patel.

Agentic AI systems are evolving from tool‑driven workflows into autonomous agents that can perceive, react, and operate in dynamic environments. This talk uses OpenClaw as a reference architecture to explore how agentic systems can move beyond single‑machine orchestration toward perception‑aware, production‑ready deployments.

We begin with OpenClaw’s core design—gateway‑based orchestration, tool execution, and local‑first workflows—and examine its limitations when scaling toward real‑time, autonomous behavior. From there, we introduce architectural patterns for integrating perception signals and environment feedback, enabling agents to reason and act in continuously changing contexts.

The session then covers key system challenges, including state management, observability, and coordination, along with practical approaches for scaling these systems across distributed environments. We conclude with concrete architectural principles for building robust, perception‑aware agentic systems that combine infrastructure rigor, extensible toolchains, and real‑world responsiveness.

This is a hybrid in-person and online event. Pre-registration is required for either.

Conversational AI systems today speak with remarkable confidence, often giving the impression of understanding and reasoning. However, teams deploying these systems often quickly encounter familiar problems: drift, hallucinations, contradictory answers, and conversations that quietly lose their original purpose. Why do systems that seem so capable end up behaving so unpredictably?

In this talk, Elena Gostrer will examine these behaviors from a practical, product-engineering perspective. Rather than exploring model internals, this talk will focus on what actually happens when humans interact with probabilistic language models – and why traditional software assumptions fail in conversational settings.

Elena will also discuss what architectural patterns teams are adopting to keep in control, and she’ll highlight why combining generative AI with explicit structure, state, and constraints is becoming essential. Attendees will leave with a clearer understanding of why conversational AI breaks, what helps it behave more reliably, and how to think differently about designing human-AI interactions.

How to Build an 8-Core Hyperthreaded Monster Computer on a Budget

It is hard to find a computer exactly the way that one wants and needs just sitting on the shelf in a store. Some companies offer custom made ones but with a price to match. Additionally, no one source has all of the things that one would want. Quality becomes another issue as most people shop with price as a major controlling factor so companies are parsimonious in procuring the components.

Dr Morantz has combined his Electrical Engineering, Computer Science, Mathematics, and good common sense to build an 8-core hyperthreaded monster computer with strong performance and reliability while working within a financial budget to fits his own needs and desires.

This presentation covers this project from design phase to completion. Advantages and disadvantages will be discussed along with sourcing and assembly tips. This whole project took several months and has been very rewarding, both in having the computer that is needed and wanted, and being a learning process. Much knowledge and experience was gained with this project. Dr Morantz will go through the steps explaining what he did and why.

Continuation of Speaker Series at Stanford IEEE.

Ontario Power Generation’s Darlington New Nuclear Project (DNNP) is at the forefront of deploying Small Modular Reactor (SMR) technology in Canada, anchored by the GE Vernova Hitachi BWRX-300. As North America’s first commercial, grid-scale SMR, DNNP plans up to four units totaling 1,200 MW. The project introduces advanced safety features, including natural circulation cooling, integral isolation valves, and passive heat removal, while supporting thousands of jobs and boosting Ontario’s economy. A collaboration between OPG, GE Vernova Hitachi, AtkinsRéalis, and Aecon-Kiewit, DNNP strengthens Ontario’s clean energy leadership and sets a model for SMR deployment globally. With construction underway, DNNP will help meet rising electricity demand, advance electrification, and deliver reliable, carbon-free power, showcasing nuclear innovation’s vital role in climate action and economic growth.

Event Moderator: Dr. Maike Luiken, PhD, SMIEEE, IEEE-HKN, FEIC, FCAE, is managing director, R&D, at a start-up company, Carbovate Development, and Adjunct Research Professor, Western University, Canada.

Datacenter workload fluctuations challenge the design and operation of our critical grid infrastructure. Significant gaps exist in assessment of these fluctuations as to their lifetime and short-term impact on the infrastructure and environment. Some mitigation approaches focus on throttling the datacenter workload, thus impacting the performance. Other approaches include use of alternate generation sources or energy storage systems. While disparate, these approaches are reactive and lack foresight and the intelligence to plan and strategize for optimal power management. We introduce an approach to quantify the transitional entropy generated during datacenter power fluctuations as a metric to evaluate datacenter performance using power demand measurements. A comparative assessment is provided between a BESS optimized datacenter and a regular datacenter to demonstrate the reduction of irreversibilities due to power fluctuations. Workloads are used to characterize the datacenter power demand at the point of interaction with utility. This approach can be scaled from datacenters to servers to chips.

Join us for a General Body Meeting with Guest Speaker Upal Mahbub and IEEE Officer Elections for the next academic year.

A Look Beyond Massive MIMO – Working with a Huge Number of Antennas 

Future wireless systems are expected to provide huge growth in user bit rates and overall required bit rates, and the same might be expect for beyond 5G systems. This means a substantial spectral efficiency increase, which must be achieved while maintaining or even improving the power efficiency. To accomplish this one needs to employ new transmission techniques, with the most promising ones based on the use of a large number of antennas. For this reason, massive MIMO (Multiple-Input and Multiple-Output) schemes, involving tens or even hundreds of antennas, are a key component of 5G, since they allow high capacity gains, while enabling significant power savings. Clearly, the evolution beyond 5G will involve even more antennas.

A new and revolutionary technique able to improve substantially the performance of wireless communication networks is to smartly changing the propagation characteristics of the wireless channel through the use of RIS (Reconfigurable Intelligent Surfaces), which are made of a large number of low cost passive reflecting elements able to independently change the amplitude and/or phase of the incident signal so as to achieve specific propagation effects. LIS (Large Intelligent Surfaces) are the natural evolution of massive MIMO schemes. They will employ many thousands of antenna elements, allowing huge capacity gains, as well accurate positioning and efficient energy harvesting techniques. However, the implementation of these techniques involves considerable challenges.

In this talk we give an overview of potentialities and challenges of systems with a huge number of antennas. We start by making an overview on the evolution from MIMO to massive MIMO, and its extension to RIS and LIS and cell free systems. Then we present the main features of those systems, as well as the implementation constraints and challenges, as well as potential solutions.

Speaker: Rui Dinis received the Ph.D. degree from IST, Technical University of Lisbon, Portugal, in 2001 and the Habilitation in Telecommunications from FCT, Nova University of Lisbon (UNL) in 2010 where he is a Full Professor. Rui Dinis is also researcher at IT (Instituto de Telecomunicações). During 2003 he was a visiting professor at Carleton University, Ottawa, Canada.

Rui Dinis is an IEEE ComSoc Distinguished Lecturer and an IEEE VTS Distinguished Speaker. He is or was editor at several major IEEE journals (IEEE TWC, TCOM, TVT and OJ-COMS) and at Elsevier Physical Communication and Hindawi ISRN Communications and Networking. He was also a guest editor for multiple special numbers in several journals.

He was involved in the organization of IEEE conferences, namely several VTC and GLOBECOM, and is a member of several technical committees of IEEE Communications Society.

Rui Dinis has been actively involved in several international research projects in the broadband wireless communications area. He was involved in pioneer projects on the use of mm-waves for broadband wireless communications and his main research activities are on modulation and transmitter design, nonlinear effects on digital communications and receiver design (detection, equalization, channel estimation and carrier synchronization), with emphasis on frequency-domain implementations, namely for MIMO systems and/or OFDM and SC-FDE modulations. He is also working on cross-layer design and optimization involving PHY, MAC and LLC issues, as well as indoor positioning techniques.

Location Details: 

Room#1300 (On the right side of security check-in at the entrance). 

Security check needs following details:

·        A government issued valid physical photo ID (No pictures/copies accepted)

·        Affiliation

·        Phone Number

Guest parking is available on the same entry level parking. Follow the signs in map view below.

Join us at Santa Clara University for the APEC 2026 Download Event, hosted by the IEEE PELS San Francisco Bay Area Chapter. This engaging session brings together engineers, researchers, and industry professionals to explore the most impactful moments and innovations presented at the Applied Power Electronics Conference (APEC) 2026.

The event will highlight key takeaways from technical sessions, including emerging trends in wide bandgap semiconductors, advances in high-efficiency power conversion, AI-driven design optimization, and next-generation energy systems. Attendees will gain valuable insights into cutting-edge research and real-world applications shaping the future of power electronics.

In addition, we will cover standout keynote sessions, offering perspectives from industry leaders on the evolving landscape of power electronics. The program aims to foster knowledge sharing, networking, and discussion within the local power electronics community.

Student Highlights:
Students are especially encouraged to attend! This is a great opportunity to:

• Discover cutting-edge topics that can inspire your coursework, senior projects, or research direction
• Learn directly from experts about industry expectations and emerging career paths in power electronics
• Network with professionals and local engineers from leading companies in Silicon Valley
• Gain exposure to real-world applications beyond the classroom

Whether you attended APEC or want a curated overview of its most important developments, this download event is an excellent opportunity to stay informed, get inspired, and expand your professional network.

Reserve this date for a social gathering followed by this presentation.  IEEE member fee is subsidized.

Customer interaction platforms are undergoing one of the most significant technological transformations in enterprise computing. What began as simple telephone-based call centers has evolved into sophisticated, cloud-native contact center platforms that integrate voice, messaging, artificial intelligence, and real-time analytics.

This session provides an accessible introduction to modern contact center systems while exploring how emerging technologies are redefining customer experience operations. Participants will learn how traditional components such as Automatic Call Distributors (ACD), Interactive Voice Response (IVR), and workforce management systems formed the foundation of the industry, and how these capabilities are now being re-architected in cloud-based Contact Center-as-a-Service (CCaaS) platforms.

The presentation will examine the perspectives of three critical stakeholders—customers, agents, and supervisors—and how modern systems are designed to optimize each experience through omnichannel engagement, intelligent routing, and data-driven insights. The session will also highlight how advances in generative AI, real-time analytics, and automation are enabling enterprises to move from reactive support models toward proactive and personalized service delivery.

Attendees will leave with a clear understanding of how contact centers operate, the technologies that power them, and the emerging trends shaping the next generation of AI-driven customer experience platforms.

Join us for an exclusive tour of General Dynamics NASSCO, where you’ll get a behind-the-scenes look at one of the nation’s leading shipbuilding facilities.

Please make sure to arrive on time to commence the tour with the group. Late arrivals may not be accommodated.

Important Requirements:

U.S. Citizenship:
Participation is limited to U.S. citizens.

Dress Code:

• Closed-toe shoes are mandatory.

• Shirts must cover the entire torso and have at least a ¼ sleeve (no tank tops or muscle shirts).

• Trousers must be full-length and cover the entire leg.

No Cameras Policy:
Cameras, photography, and recording devices are strictly prohibited during the tour.

Safety Gear:
Hard hats and safety glasses will be provided and must be worn at all times during the tour.

IEEE Members:
If you are an IEEE member, please register using your IEEE account.

Failure to comply with the dress code, citizenship requirement, arrival time, or no-camera policy will result in denial of entry. We appreciate your cooperation in ensuring a safe and secure visit!

Abstract: 

Thursday April 23, 2026

11:30 AM: Networking, Pizza & Drinks

Noon -- 1 pm: Seminar

Please register on Eventbrite before 9:30 AM on Thursday April 23, 2026

IEEE members  non IEEE members

(discounts for unemployed and students )

MIT Room 32-G449 (Kiva) and online via Zoom

https://acm-org.zoom.us/webinar/register/9017687585696/WN_lEhsXZTkQKW1X7pwRgHiOg

After registering, you will receive a confirmation email containing information about joining the webinar.Indicate on the registration form if you plan to attend in person. This will help us determine whether the room is close to reaching capacity. We plan to serve light refreshments (probably pizza) before the talk starting at around 6:30 pm. Letting us know you will come in person will help us determine how much pizza to order.

We may make some auxiliary material such as slides and access to the recording available after the seminar to people who have registered.

Abstract:

What does “normal” look like in a system that grows, adapts, and scales at extraordinary speed? How do its underlying patterns shift as the network expands from its early days to a billion-fold increase in scale?

In this seminar, Dr. Kepner will explore how advances in high-performance, privacy-preserving AI graph analysis tools open new windows into the Internet’s behavior. His work sheds light on emergence, structure, and stability within this constantly changing global system.

Dr. Kepner will explain the deep connections between graphs and matrices and more general mathematical concepts of semirings and associative (token) arrays that are the foundations of modern large language model (LLM) agentic AI systems. These mathematical concepts form the basis of the high performance GraphBLAS sparse matrix standard and the D4M (Dynamic Distributed Dimensional Model) associative array library that can analyze the largest networks in the world while preserving privacy.

Bio:

Dr. Jeremy Kepner is an MIT Lincoln Laboratory Fellow. He founded the Lincoln Laboratory Supercomputing Center and pioneered the establishment of the Massachusetts Green High Performance Computing Center. He has developed novel big data and parallel computing software used by thousands of scientists and engineers worldwide. He has led several embedded computing efforts, which earned him a 2011 R&D 100 Award. Kepner has chaired the SIAM Data Mining conference, the IEEE Big Data conference, and the IEEE High Performance Extreme Computing conference. Kepner is the author of two bestselling books, Parallel MATLAB for Multicore and Multinode Computers, and Graph Algorithms in the Language of Linear Algebra. His peer-reviewed publications include works on abstract algebra, astronomy, astrophysics, cloud computing, cybersecurity, data mining, databases, graph algorithms, health sciences, plasma physics, signal processing, and 3D visualization. In 2014, he received Lincoln Laboratory's Technical Excellence Award. You can learn more about his work here: https://www.mit.edu/~kepner/

Kepner holds a BA degree in astrophysics from Pomona College and a PhD degree in astrophysics from Princeton University. He is a fellow of the Society of Industrial Applied Mathematics (SIAM) and is a faculty advisor to the MIT SIAM student group.

Directions to 32-G449 - MIT Stata Center, 32 Vassar Street, Cambridge, MA: Please use the main entrance to the Stata Center at 32 Vassar Street (the entrance closest to Main street) as those doors will be unlocked. Upon entering, proceed to the elevators which will be on the right after passing a large set of stairs and a MITAC kiosk. Take the elevator to the 4th floor and turn right, following the hall to an open area; 32-G449 will be on the left. Location of Stata on campus map

This joint meeting of the Boston Chapter of the IEEE Computer Society and GBC/ACM will be hybrid (in person and online).

Up-to-date information about this and other talks is available online at https://ewh.ieee.org/r1/boston/computer/. You can sign up to receive updated status information about this talk and informational emails about future talks at https://mailman.mit.edu/mailman/listinfo/ieee-cs, our self-administered mailing list.

Banquet for the IEEE student branch at Cal Poly Pomona and the ComSoc technical society student club.

Monthly AdCom meeting:  [agenda NOT updated yet]

1. Welcome - Hualiang

2. Symposium status update - Annette/Paul/Hualiang

3. Education outreach status - Masha/Azmat/Hualiang

4. Chapter Storage - Hualiang  XXXX NOT

5. Monthly talk preparation - Chandan/Luu

6. Chapter website update -    XXXX NOT Venkatesh/Claire/Paul

7. Senior member advancement - Dwayne

  Xxxx NOT

8: Election 2026

9:  Open discussion - All

Dr. Federico Rosei from the University of Trieste will be presenting a Distinguished Lecturer Seminar titled "Multifunctional materials for emerging optoelectronic technologies" on Tuesday April 28th at 11:00 AM. Attendance will be eligible for seminar credit.