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5 meetings

Title:
IEEE Oregon May 2025 Excom In-Person Meeting
Date:
May 13th
6:30 PM (2 hours)
Location:
Fourth Avenue Building
Portland
Abstract:

This will be an in person event at PSU

We'll be in PSU so plan accordingly for parking and finding the room. 

Dinner will be provided 

 

Agenda:

6:30 Eat/Socializing 

7:00 Start of Business meeting 

8:30 End of Business meeting

 

 

Title:
Women in Tech: Shaping the Future of Engineering and Innovation
Date:
May 19th
5:30 PM (1 hour)
Abstract:

Join us for an inspiring session of Women in Tech: Shaping the Future of Engineering and Innovation, hosted by the IEEE Women in Engineering Oregon Section. This event celebrates the remarkable achievements and transformative influence of women leaders who are driving the next wave of technological advancements.

 

Title:
IEEE SSCS Oregon Chapter May Meeting and Seminar (Hybrid)
Date:
May 23rd
8:30 AM (1.5 hours)
Location:
Jones Farm Conference Center
Hillsboro
Abstract:

IEEE SSCS Oregon Chapter May Meeting and Seminar

Join us for a talk from local Intel Labs Researchers, Dr. Susnata Mondal and Dr. Sashank Krishnamurthy, on Friday, May 23rd, 2025. The seminar will be held from 8:30am to 10:00am (PST) via a Hybrid format. Please register for the meeting link and information.

 

Topic:

Energy-Efficient Co-Packaged VCSEL-based High-Speed Optical Links

 

Abstract:

Co-packaged optics integrate optical engines with compute (XPU) or switch chips, drastically reducing electrical losses and boosting link efficiency. At Intel Labs, we developed two generations of co-packaged VCSEL(vertical-cavity surface-emitting laser)-based optical transceivers for next-generation data center and HPC applications. In the first generation, a 4-channel optical engine—including VCSEL driver ICs, VCSELs, photodetectors, TIAs, and fiber termination—was co-packaged with electrical transceiver ICs (mimicking XPU) to deliver up to 64-Gb/s TX and 50-Gb/s RX per-channel NRZ data rates, with outstanding energy efficiencies of 1.3 pJ/b and 1.5 pJ/b. These industry-leading results were enabled by several circuit innovations: a novel complex-zero CTLE for VCSEL equalization, low-power electrical TX, resonant clock distribution, Cherry-Hooper-based RX FFE, and a low-noise dual-clock-phase latch. The second-generation direct-drive transceiver advances to PAM-4 signaling, reaching 108 Gb/s at a record-low 0.9  pJ/b, thanks to a high-linearity coupled-inductor complex-zero CTLE for the VCSEL equalization and a high-linearity low-gain shunt-feedback TIA with active complex-zero CTLE for RX equalization.

 

Speaker Biographies:

Susnata Mondal received the B.Tech and M.Tech degrees in Electronics Engineering from IIT Kharagpur, India, in 2015, and the Ph.D. degree in Electrical and Computer Engineering from Carnegie Mellon University, Pittsburgh, in 2020. Since 2020, he has been a Research Scientist with Intel Labs, Hillsboro, USA, where he works on electrical/optical transceivers. His current research interests include millimeter-wave circuit, algorithm and system design for multi-antenna wireless, and RF/mixed-signal design for high-speed wireline/optical links. He was a recipient of the IEEE SSCS Predoctoral Achievement Award in 2019 and the A.G. Milnes Best Ph.D. Thesis Award from Carnegie Mellon University in 2021. He was selected as the SSCS Rising-Star in ISSCC 2020.

Sashank Krishnamurthy received the B.Tech degree in Electrical Engineering from the IIT Madras, Chennai, India, in 2015, and the M.S. and Ph.D. degrees in Electrical Engineering from the University of California at Berkeley, CA, in 2020. Since 2021, he has been a Research Scientist with Intel Labs, Hillsboro, OR, USA, where he works on ultra high-speed integrated electrical/optical transceivers. He has also been a Visiting Lecturer with the University of California at Berkeley. His current research interests include analog, mixed-signal, high-speed digital, RF, and millimeter-wave circuit techniques.

Title:
OCCS GET Series: Gen AI & Data-Driven Innovation: Transforming Healthcare and Insurance Claims
Date:
May 29th
5:00 PM (2 hours)
Abstract:

We are excited to continue the Orange County Computer Society (OCCS) Global Emerging Technologies (GET) Series, a monthly platform dedicated to spotlighting transformative innovations in computer science and technology. Hosted by the IEEE Orange County Computer Society Chapter, this series brings together professionals, students, and tech enthusiasts to explore the cutting edge of what’s possible.

This month, we turn our attention to the powerful intersection of Generative AI and data-driven innovation in healthcare and insurance—two industries rapidly evolving under the pressures of precision, personalization, and operational efficiency.

In this session, we’ll explore how large language models (LLMs) and multimodal AI systems are revolutionizing clinical workflows and insurance claims processing. From diagnostic support and clinical decision-making to automated claims adjudication, Gen AI is delivering faster, more accurate outcomes for both providers and patients.

Key topics include:
✅ AI-powered EHR summarization
✅ Fraud detection and risk scoring
✅ Automated prior authorizations
✅ Claims optimization and compliance
✅ Synthetic data generation and privacy
✅ Cutting-edge techniques like GraphRAG and federated learning

You’ll gain insights into how these technologies are not only streamlining administrative tasks, but also enabling scalable, privacy-preserving models that are shaping the future of the healthcare ecosystem.

📅 Don’t miss this opportunity to learn how Gen AI is unlocking new possibilities for innovation, operational excellence, and improved care delivery.

Interested in speaking at a future session? Reach out to swapnali.karvekar@ieee.org—we’re always looking for passionate voices to lead the conversation.

Join us as we learn, connect, and transform the future of technology together!

Title:
DLP Talk: Tailoring Light with 2D/3D Photonic Integrated Devices
Date:
June 13th
5:30 PM (1 hour)
Abstract:

Join the IEEE Photonics Society Chapter for an engaging technical talk on the latest advancements in photonic integration. This session will explore cutting-edge research in manipulating complex light fields using both 2D silicon-based and 3D fs-laser inscribed photonic integrated circuits.

The speaker will present recent developments in multi-dimensional light field control—covering amplitude, frequency, time, polarization, and spatial structure—and their applications in optical communications, sensing, metrology, quantum computing, imaging, and more. The talk will conclude with insights into future directions and emerging opportunities in the field.

Don’t miss this opportunity to learn about the transformative potential of 2D/3D photonic integrated devices across a wide range of technologies.

5 meetings. Generated Monday, May 12 2025, at 5:26:40 PM. All times America/Los_Angeles