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8 meetings

Title:
How USB Came to Be
Date:
February 20th
4:00 PM (1 hour)
Location:
27500 SW Parkway Ave
Wilsonville
Abstract:

You probably use USB connectors every day, but have you ever wondered how they work, or how they became so commonplace?

Join guest speaker Steve McGowan, former Intel employee, to hear about his involvement developing USB technology over the past 23 years

This event is free for students and professionals alike. Pizza will be available for jumi per slice.

Title:
Retropie - Retro Gaming Console Workshop (Register by Feb. 17th!)
Date:
February 26th
6:00 PM (3 hours)
Location:
27500 SW Parkway Ave
Wilsonville
Cost:
Admission fee may apply
Abstract:

Come join IEEE members of Wilsonville OIT as they instruct you how to transform a Raspberry Pi into a retro gaming console! Participants will need to order a kit to participate that they will take home at the end. Participants will learn how to install Retropie and Raspbian OS onto their Raspberry Pi and then how to load games onto it. We will also be using a little Python to program an ON/OFF button.

Title:
Fiber Reinforced Polymer (FRP) Construction Seminar
Date:
February 26th
6:30 PM (2 hours)
Location:
Axiom Electronics
Beaverton
Abstract:

Notice the time change. We are meeting Tuesday the 26th.

Ivar Thorson will present a practical guide to using fiberglass cloth, carbon fiber, nomex honeycomb, and foam cores to build extremely lightweight, rigid, and strong robots. Carbon fiber can 10x or 20x stronger than steel by weight, and is a versatile material for making high-performance machines. We will discuss moldless "hot-wire" foam shaping techniques as a quick and easy way of making prototypes with few tools, and also discuss how the modern era of 3D printers has made mold-making for medium-sized composite structures within reach of most hobbyists. The basic theory and rules of thumb will be presented, followed by step-by-step photographs of the construction of a meter-high, dynamically-balancing monopod "kangaroo" robot. Many of the techniques presented are adopted from the innovative work of Experimental Aircraft Association (EAA) pioneer, Burt Rutan, who founded Scaled Composites and and won the Ansari X-prize in 2004 for being the first to launch a non-governmental manned spacecraft into space, twice in two weeks

Title:
Retropie - Retro Gaming Console Workshop (Register by Feb. 17th!)
Date:
February 27th
12:00 PM (3 hours)
Location:
27500 SW Parkway Ave
Wilsonville
Cost:
Admission fee may apply
Abstract:

Come join IEEE members of Wilsonville OIT as they instruct you how to transform a Raspberry Pi into a retro gaming console! Participants will need to order a kit to participate that they will take home at the end. Participants will learn how to install Retropie and Raspbian OS onto their Raspberry Pi and then how to load games onto it. We will also be using a little Python to program an ON/OFF button.

Title:
IEEE SSCS Oregon Chapter Executive Committee Meeting - February 2019
Date:
February 27th
5:30 PM (1 hour)
Location:
Intel Jones Farm 3 Building (JF3)
Hillsboro
Abstract:

Closed monthly meeting of the IEEE SSCS Oregon Chapter Executive Committee: February 2019

Title:
IEEE SSCS Oregon Chapter February Meeting and Seminar
Date:
February 27th
6:30 PM (2 hours)
Location:
Hawthorne Farms Building 3
Hillsboro
Abstract:

IEEE SSCS Oregon Chapter December Meeting and Seminar

This is the first meeting of 2019 and we will kick things off with a talk from SSCS Distingished Lecturer from Prof. Arun Natarajan of Oregon State University.  Food and drinks will be provided during the networking event from 6:30 to 7:00pm.  The seminar will be from 7:00pm to 8:00pm and we will continue with networking until 8:30pm.

 

Abstract:

Achieving battery less sensors/wireless transceivers that can sense, compute and communicate enables a wide range of ubiquitous internet-of-things applications. RF-powering presents a robust, reliable approach for providing energy to such battery-less sensors. In this talk, I will focus on the key technical challenges for achieving wirelessly-powered sensors for representative IoT applications. Following an introduction to far-field wireless powering, I will present architectures and circuits with a focus on increasing wireless powering range and energy harvesting efficiency at the system level. Packaging and sensor size are also critical constraints for such systems and we will discuss how constraints on volume and weight impact circuits and architectures. We will discuss performance in the context of state-of-the-art and outline future research to further enable ubiquitous RF-powered sensing and communication.

Speaker Biography:

Dr. Natarajan's research is focused on RF and mm-wave integrated circuits and systems for wireless communication and imaging. He received the B.Tech. degree in electrical engineering from the Indian Institute of Technology, Madras, in 2001 and the M.S. and Ph.D. degrees in electrical engineering from the California Institute of Technology (Caltech), Pasadena, in 2003 and 2007, respectively. From 2007 to 2012, he was a Research Staff Member at IBM T. J. Watson Research Center, NY and worked on mm-wave phased arrays for multi-Gb/s data links and airborne radar and on self-healing circuits for increased yield in sub-micron process technologies. Since joining Oregon State University, his research group has focused on low-power RFICs and RF/mm-wave arrays integrated in CMOS/SiGe BiCMOS. Dr. Natarajan received the DARPA Young Faculty Award in 2017, the National Talent Search Scholarship from the Government of India [1995-2000], the Caltech Atwood Fellowship in 2001, the Analog Devices Outstanding Student IC Designer Award in 2004, and the IBM Research Fellowship in 2005, and serves on the Technical Program Committee of the IEEE ISSCC and IEEE RFIC.

Title:
Oregon CAS/EPS & SMTA Oregon - Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging
Date:
February 28th
5:00 PM (3 hours)
Location:
PSU Fourth Avenue Building
Portland
Abstract:

IEEE Oregon Joint EPS (CPMT)/CAS Chapter

(in cooperation with SMTA, IMAPS, IPC & EMA)

IEEE/EPS Distinguished Lecture

Topic: Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

Speaker: John H Lau, ASM Pacific Technology

Date: Thursday, February 28th, 2019, 5.00–8.00pm

Room: PSU Fourth Avenue Building, Lower Level, FAB 160-19
(the seminar room sponsored by the PSU ECE department)
1900 SW 4th Ave., Fourth Avenue Building, Portland, OR 97201

Directions: http://map.pdx.edu/

Title:
IEEE Oregon Section TEMS Workshop Series- Systematic Innovations Methods applied in Problem Solving
Date:
March 16th
8:00 AM (4 hours)
Location:
Bldg 38
Beaverton
Cost:
Admission fee may apply
Abstract:

Systematic Innovations Methods applied in Problem Solving

8 meetings. Generated Wednesday, February 20 2019, at 10:47:55 AM. All times America/Los_Angeles